electronic packaging 中文意思是什麼

electronic packaging 解釋
電子電路組裝
  • electronic : adj. 電子的，電子操縱的；用電子設備生產的；用電子設備完成的。adv. -cally
  • packaging : n. （效率高而美觀的）包裝法；打包。
  1. In this paper the situation and development of electronic packaging and its requirments for the encapsulate materials in high properties were introduced and a novel kind alicyclic epoxy for electronic packaging was also reviewed with 13 refs

    摘要結合電子封裝的現狀、電子塑封材料的發展以及電子封裝對塑封材料提出的高性能要求，介紹了新型脂環族環氧樹脂及其作為塑封材料的應用前景，其包括耐熱型液體、含磷三官能團型、有機硅多官能團脂環族環氧樹脂。
  2. The challenge of changeover to lead - free in electronic packaging

    電子封裝面臨無鉛化的挑戰
  3. Flip chip technology has become one of the major joining technologies in electronic packaging

    摘要覆晶技術已成為電子構裝中之主要接合技術之一。
  4. 4. a new level of electronic package design is developing to fulfill the requirement of high density electronic packaging technology

    日沁；司知『匕子封裝己經對，匕于封裝設計提出了更高的要求。
  5. Research of rolling electroplate in electronic packaging

    封裝中的滾鍍工藝研究
  6. 2. the delamination at the interface is one of typical failure mode for electronic packaging. in order to get more understanding of the propagation behaviour of [ he delamination, a series of finite element simulations related were done

    為了對界面分層及其傳播行為進行深入研究，本文對b型和d型兩種實驗倒裝焊封裝，在熱循環加載下，進行了有限元模擬。
  7. Research on high performance novel electronic packaging materials of silicon - based aluminum

    新型硅基鋁金屬高性能電子封裝復合材料研究
  8. Current status of research on electronic packaging materials

    電子封裝材料的研究現狀
  9. Application and development of cad in electronic packaging

    技術在電子封裝中的應用及其發展
  10. New progress of electronic packaging technology

    電子封裝技術的新進展
  11. A review of metal - martix composites for electronic packaging

    電子封裝用金屬基復合材料的研究現狀
  12. Present status and progress in study of electronic packaging materials

    電子封裝材料的研究現狀及進展
  13. Review of metal - matrix composite materials for electronic packaging

    金屬基電子封裝復合材料的研究進展
  14. Recent achievements in research for electronic packaging substrate materials

    電子封裝基片材料研究進展
  15. Some successful examples include nickel - free metal alloys for watch and jewellery, advanced encapsulates with low moisture and tailored modulus for electronic packaging, textiles treated with nanostructured materials and water repellent apparels with high air permeability, and air purification system that removes odour and kills bacteria by photocatalytic nano - coating

    成功例子包括：手錶及珠寶專用的無鎳合金；電子封裝所需的低水分和特定模數的先進封裝材料；經納米結構材料處理的布料及透氣度高的防水衣物；以及利用光催化納米塗層技術，能夠除臭殺菌的空氣凈化系統。
  16. 1. the moisture diffusion in plastic electronic packaging was investigated from both experiment and finite element simulation. the diffusion coefficient and the saturate concentration were determined on the pick ' s law

    利用實驗稱重和fick擴散方程模擬塑封材料對水的吸收過程，得到水汽在實驗塑封材料中的擴散系數和飽和濃度。
  17. Hartmann, develops and produces bus backplane wiring and ? electronic packaging solutions in stuttgart

    Hartmann有30年以上的電子系統的生產和開發經驗。
  18. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  19. Recent advances in the study of moisture absorption in plastic electronic packaging

    吸收濕氣對微電子塑料封裝影響的研究進展
  20. Aluminum infiltrated silicon carbide composite exhibits excellent properties such as high thermal conductivity, low coefficient of thermal expansion ( cte ), high modulus and low density, therefore it has extensive potential applications in electronic packaging

    鋁滲碳化硅復合材料具有高導熱、低膨脹、高模量、低密度等優異的綜合性能，在電子封裝領域具有廣闊的應用前景。
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