epoxy compounds 中文意思是什麼
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Progress in study on crack initiation in epoxy resin sealing compounds at low temperature and its measures
環氧灌封料低溫開裂問題及對策研究進展 -
Resin based reactive compounds used for electrical insulation - part 3 : specifications for individual materials ; sheet 2 : quartz filled epoxy resinous compounds
電氣絕緣用樹脂基復合物.第3部分:單項材料規范.活頁2 :填石英的環氧樹脂復合物 -
Plastics - epoxy powder moulding compounds ep - pmcs - part 3 : requirements for selected moulding compounds
塑料.環氧樹脂粉末模塑化合物.第3部分:對所選模塑化合物的要求 -
Solventless polymerisable resinous compounds used for electrical insulation - specification for individual materials - epoxy resin - based coating powders
電絕緣不溶可聚合樹脂化合物.第3部分:各型材料規范.第11節:環氧樹脂基塗層粉末 -
Specification for solventless polymerisable resinous compounds used for electrical insulation. part 3 : specifications for individual materials. sheet 11 : epoxy resin - based coating powders
電氣絕緣用無溶劑可聚合樹脂化合物規范.第3部分:單項材料規范.第11活頁:環氧樹脂基粉末塗料 -
Resin based reactive compounds used for electrical insulation - part 3 : specifications for individual materials - sheet 1 : unfilled epoxy resinous compounds
電氣絕緣用樹脂基活性化合物.第3部分:專用材料規范.第1活頁:無填充環氧樹脂化合物 -
In this paper, the methods to enhance the flame retardance and thermal stability of epoxy resins by introducing the compounds containing silicon or phosphor elements to epoxy matrix were reviewed in details
摘要介紹了在環氧樹脂中引入含硅組分來提高其耐熱性和韌性、引入含磷組分改性環氧樹脂提高其阻燃性方面的研究進展。 -
Resin based reactive compounds used for electrical insulation - part 3 : specifications for individual materials ; sheet 1 : unfilled epoxy resinous compounds
電氣絕緣用樹脂基活性復合物.第3部分:單項材料規范.活頁1 :未加填料的環氧樹脂復合物 -
Resin based reactive compounds used for electrical insulation - specifications for individual materials - unfilled epoxy resinous compounds - sheet 1 : unfilled epoxy resinous compounds
電氣絕緣用樹脂基反應性復合物.單項材料規范.未加填料的環氧樹脂復合物.第1活頁:未加填料的環氧樹脂復合物 -
Ep - pmcs. 3 : plastics - epoxy powder moulding compounds ep - pmcs - requirements for selected moulding compounds
塑料.環氧粉末模塑化合物 -
Standard specification for epoxy molding compounds
環氧基樹脂模塑化合物的標準規范 -
08. 02 specification for epoxy molding compounds
環氧模製化合物規范 -
The synthesized compounds ot polymers were added into commerical epoxy resins to form uv adhesives with turnable refraction index
本技術目前開發者為uv硬化系統，已實際應用於光通訊元件之前段接合評估。 -
Plastics - epoxy compounds - determination of epoxy equivalent
塑料.環氧化合物.環氧基當量的測定 -
Plastics. epoxy compounds. determination of epoxy equivalent
塑料製品.環氧化合物.環氧樹脂當量的測定
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