fine-pitch device 中文意思是什麼
fine-pitch device
解釋
微細間距器件-
Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array
半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine pitch land grid array
半導體器件的機械標準化.第6 - 6部分:平面式安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南 -
Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type
半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形 -
Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type
半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南 -
Flga. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type
半導體裝置的機械標準化.表面安裝的半導體器件封裝圖形圖繪制的一般規則.細微間距柵級陣列 -
Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array
半導體器件的機械標準化.第6 - 5部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距球面柵格排列的設計指南 -
Flag. mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array - proposed amendment on terminology
半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制的一般規則.小爆距紋間表面網格陣列
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