flow plating 中文意思是什麼

flow plating 解釋
流動電解液電鍍
  • flow : vi 1 流,流動。2 (血液等)流通,循環。3 流過;川流不息;(時間)飛逝;(言語等)流暢。4 (衣服、...
  • plating : n. 1. (電)鍍,噴鍍;鍍金(術)。2. 鍍層;外覆金屬板;【造船】(全部)船殼板;(兵艦等的)裝甲。3. 【攝影】曬相。4. 懸賞賽馬。
  1. According the key factors we find, we bring forward a new conception : multilevel suppressor and design a new high performance suppressor whose ion - exchange membrane has bigger areas and using three electrodes including one cathode ( anode ) and two anodes ( cathode ), at the same time we fill the suppression compartment with one kind of ion exchange resin which has moderate exchange capacity. according to our experiment ' s results, we find the new type suppressor has quite high working current efficiency and suppressing capacity. in most cases, the suppressor ' s current efficiency is over 90 % ; the suppressor can transform the naoh ( concentration : 200mmol / l, flow rate : i. oml / min, conductance : over 10000 i - i s cm " ) to pure water ( conductance : 8. 9 it s cm in chapter 3, the high performance suppressor is applied in determination some trace - amounts ions in plating solution, sewage. in this chapter, we also have a research on the gradient ion chromatography

    第二章首先以xyz - 1型電化學抑制柱為例,分析了電化學抑制柱的抑制過程得出影響抑制容量的主要因素主要是抑制柱的電流效率和離子交換膜的極限電流密度,因此採用中等交換能力的離子交換樹脂作為抑制室的填料以提高電流效率,在通常情況下電流效率可達到90以上;在選用同種離子交換膜的前提下,可通過增加離子交換膜的有效面積達到提高極限電流的目的從而提高抑制柱的抑制容量,因此提出了多級抑制的概念並據此研製了共電極式高容量電化學抑制柱,該抑制柱最高可將流速為1 . 0ml / min ,濃度為200mmol / l電導率超過10000 s ? cm ~ ( - 1 )氫氧化鈉溶液抑制為電導率低至8 . 9 s ? cm ~ ( - 1 )的純水,並且具有穩定性高、分析結果準確等優點。
  2. This machine adopts japanese pro - face touch screen and mitsubishi plc control technology. in addition, it is set with automatic gear - shifting vacuum gauge, a three - flow controller, side - installed heating tube, computer pid automatic temperature control, and two sets of flat magnetic controlled target, contra - variant magnetic - controlled power source, and contra - variant bias power with easy operation and top grade film layer. they are widely used in decorative film layer, and compound film layer in plating

    該設備採用日本pro - face觸摸屏和三菱plc集中控制裝有電腦自動換檔真空計,三路流量控制器,邊裝式加熱管,電腦pid自動控溫,配備兩套邊裝式平面磁控靶,逆變式磁控電源和逆變式偏壓電源,操作簡單,膜層細膩,廣泛適用於鍍制各種裝飾膜層和復合膜層。
  3. This machine adopts japanese pro - face touch screen and mitsubishi plc control technology. in addition, it is set with automatic gear - shifting vacuum gauge, a two - flow controller, side - installed heating tube, computer pid automatic temperature control, and 32 sets contra - variant arc power supply and contra - variant bias power. they are widely used in plating different thick film layers of mono - metal and many compound film layers

    該設備採用日本pro - face觸摸屏和三菱plc集中控制裝有電腦自動換檔真空計,兩路流量控制器,邊裝式加熱管,電腦pid自動控溫,配備32隻逆變式弧電源和逆變偏壓,適用於鍍制各種特種單金屬厚膜層或多鐘金屬復合膜層。
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