fusion curve 中文意思是什麼

fusion curve 解釋
熔化曲線
  • fusion : n. 1. 熔解,熔化;【物理學】(核)聚變,合成。2. 〈美國〉融合;(政黨等的)合併,聯合。
  • curve : n 1 曲線;彎曲;彎曲物。2 曲線規 (=French curve);【機械工程】曲線板;【棒球】曲線球;【統計學...
  1. Herein, the core of this paper is to improve the efficiency of syndication in venture capital investments. firstly, this paper introduces the definition of syndication and its ‘ nuclear fusion ’ effect, gives a new explanation by the analysis of experience curve and synergy

    本文首先介紹了聯合投資的定義以及聯合投資會產生的「核聚變」效應,並利用經驗曲線和協同性分析對聯合投資做了進一步解釋。
  2. We put forward a scheme that multisensor data fusion - surface fitting and curve - fitting was applied in this system according to the temperature drift and nonlinear of sensor. communication between personal computer and measurement system of sensor was realized by means of transceiver with the type of max232, which could finish the data conversion, data processing and printing task, with the result that the measurement system was further improved

    針對傳感器測量的溫度漂移和非線性等問題,提出了利用多傳感器信息融合技術?曲面擬合法和曲線擬合法來加以解決,並通過max232收發器實現pc機與傳感器測量系統之間的通信,完成數據轉換、數據處理和列印等功能,使測量系統更加完善。
  3. Based on silicon - piezoresistive method, the paper first gives the theory of array silicon piezoresistive pressure, acceleration sensor, and the design of its incorporated chip, microstructure and out - circuit. several key techniques of making array silicon piezoresistive pressure, acceleration sensor such as 1c technic, mems ( silicon - silicon direct bonding, anodic bonding, anisotropic etching ) is also studied. minuteness engine machining, anode bonding etc. in the paper there are three ways which are examine - form, curve simulanting, to carry out sensors non - linear self - emendating ; adopt the several curves approaching and curve simulating to achieve the aims of sensor error self compensation, fusion technology etc. therefore, it providing referenced values of ways and directions for sensor system directing on

    論文首先以硅壓阻效應原理為基礎,討論了陣列式硅壓力、加速度傳感器的設計原理,並對陣列式硅壓力、加速度傳感器中集成敏感晶元(壓力、加速度) 、總體結構和壓力陣列的信號處理電路進行了設計,在陣列式硅壓力、加速度傳感器的研製中,還研究了半導體平面工藝、大規模集成電路技術、微機械加工技術(硅硅鍵合、靜電封接、各向異性腐蝕)等關鍵技術的應用。
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