gold ball bonding 中文意思是什麼

gold ball bonding 解釋
金絲球焊
  • gold : n 1 金，黃金；金幣。2 財富；財寶；黃金一樣貴重[富麗]的東西。3 金色，金黃色。4 包金，鍍金；金粉，...
  • ball : n 鮑爾〈姓氏〉。n 1 球；球狀物。2 球戲，（特指）棒球；【棒球】壞球 （opp strike） 3 【軍事】子彈...
  • bonding : 冰凍膠結
  1. As a contrast object, gold wire ball bonding technology was also studied

    金絲球鍵合作為對比研究對象引入本文研究范圍。
  2. Trough the experiment, we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )

    通過實驗，探索出了合適的貼裝方式（ 183焊膏貼裝）和管芯鍵合工藝（直徑18 m的金絲球焊） 。
  3. Copper wire ball bonding is a new technology which is expected to replace the traditional gold wire ball bonding and is of great significance in reducing the cost and improving the reliability of microelectronic components

    銅絲球鍵合是一種有望取代現行金絲球鍵合工藝的新技術，這一技術對于降低微電子元器件的成本、提高元器件的可靠性具有重要意義。
  4. The whole process of copper wire ball bonding and gold wire ball bonding were compared and analyzed, and a central composite design of experiment ( doe ) approach was applied to optimize the parameters of free air ball formation process and bonding process, separately

    本文首先對比分析了銅絲球鍵合和金絲球鍵合的全過程，採用實驗設計分別對燒球工藝參數和鍵合工藝參數進行了優化。在此優化參數下，獲得了連接良好的銅絲球鍵合點和金絲球鍵合點。
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