grit material 中文意思是什麼
grit material
解釋
砂礫材料-
Colors : chinese black, dark blue, gray, chinese red, peachblow, orange, chicken blood, liver red, dark green, light green, gem green, milk white, rice white, tiger yellow, snow white. . application : fitment material, paint, grit dope.
主要品種有：中國黑中國紅肝紅桃紅桔紅雞血紅芙蓉紅點紅萬年青深綠淺綠寶石綠散花乳黃中黃米黃地板黃虎皮黃草白玉漢白玉雪花白青灰珍珠白等，並在不斷開發新品種。 -
Product ground by grinding material with abrasive belt of grit 320 # to produce continuous grinding lines
用粒度適當粒度的砂帶拉絲成連續的線條。 -
On the basis of these results, the design method and procedure of lime - flyash grit composite were researched combining with the standard. through the engineering practice of recent ten years, some modification were made as follows : the maximum size of the granular material was improved from 4cm to 10 ~ 12cm, the mud content rises to 7 percent from 3 percent, the strength was raised, also the construction became more convenient
在此基礎上，結合規范討論了二灰穩定砂礫材料的設計方法和步驟，並對規范中的有關規定作了如下的修正：最大石料粒徑的尺寸由4厘米增加為10 12厘米，含泥量由3提高到7等，從而提高了二灰穩定、砂礫材料的強度，減少了干縮性，方便了施工。 -
The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement
研究結果表明，增大砂輪軸向進給速度和減小工件轉速，採用粗粒度砂輪有利於提高磨削矽片的材料去除率，砂輪軸向進給速度對材料去除率的影響最為顯著；適當增大砂輪轉速，減小砂輪軸向進給速度，採用細粒度砂輪可以減小磨削表面粗糙度；在其它條件一定的情況下，砂輪速度超過一定值會導致材料去除率減小，主軸電機電流急劇增大，表面粗糙度變差；採用比# 2000粒度更細的砂輪磨削時，材料去除率減小，矽片表面粗糙度沒有明顯改善。 -
By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基於自旋轉磨削原理的矽片超精密磨床，通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。
分享友人