interfacial stress 中文意思是什麼

interfacial stress 解釋
界面應力
  • interfacial : adj. 1. 界面的,面際的。2. 界面角的。
  • stress : n 1 壓力,壓迫,緊迫,緊張。2 【語音】重音;重讀;【詩】揚音;語勢,著重點。3 重要(性),重點,...
  1. The interfacial shear stress is a constant proportion of the bottom shear.

    交界面的剪力與底部剪力之比是常數。
  2. 2. because the fracture mode of 3d braided cmc is the interfacial fracture of mode i and mode ii, energy release rate gc and complex stress intensity factor kc was designated as characterization parameters of fracture toughness in the linear fracture theories. 3

    根據三維編織c sic復合材料斷裂韌性的表徵問題屬于線彈性理論范疇以及材料斷裂模式是界面損傷破壞模式的實驗研究結果,提出了該材料的表徵參量應該使用與界面相關的型和型混合斷裂的能量釋放率g _ c ,或者使用復應力強度因子k _ c 。
  3. Here, fem is applied in the analyses of i ) fiber axial stress and interphase shear stress in fragmentation tests during initially applied strain, ii ) influence of temperature on the stress transfer across the interface, iii ) modulus and thickness of the interphase and their influence on interfacial stress transfer, iv ) interfacial debonding process, and v ) fragment aspect ratio, contact friction along the interface and their influences to the interfacial stress transfer efficiency

    在論文的這部分工作中,使用有限元法描述和分析了逐節斷裂試驗中初始應變下的纖維軸向應力和界面相剪切應力,溫度對界面應力傳遞的影響,界面相模量和厚度、纖維節長寬比、界面脫粘過程、界面接觸中的摩擦效應等因素對逐節斷裂試驗中應力傳遞的影響。
  4. Research of stress and strain in the interfacial bonding of rubber composites

    復合材料粘結界面應力應變研究
  5. In this paper, the rapid repairing method using cement concrete lamina is presented, two key designing parameters are analyzed : the interfacial bonding strength of new and used concrete and the shearing stress in interface

    本文闡述了水泥混凝土路面快速薄層修補的方法,研究了修補中兩個重要設計參數:新老混凝土界面抗剪粘結強度和新老混凝土粘結面剪應力,並進行了新老混凝土界面抗剪粘結強度試驗和混凝土收縮試驗。
  6. Through the experiment of the interfacial bonding shear strength and the shrinkage strain of concrete, the influence of the interfacial roughness of used concrete surface and interfacial bonding agent to interfacial bonding strength is revealed ; new concrete component and the shape and size of concrete slab are main factor affecting the shearing stress in layers

    試驗結果表明:老混凝土粘結面的粗糙度和界面粘結劑類型對新老混凝土界面粘結強度影響很大;新鋪混凝土材料和混凝土路面板形狀尺寸是影響新老混凝土粘結面收縮剪應力的主要因素。
  7. Models for calculation of interfacial stress in cobalt - rich crusts breaking

    破碎富鈷結殼時界面應力計算模型
  8. Bi - material interfacial fracture theories are researched with a phenomenon that cracks extend along interface. a gradient invading model of interface crack at the crack tip can gain stress fields along interface. so a formula of energy release rate for 3d braided cmc is deduced and the corrected formula of the energy release rate is examined with test results

    研究了裂紋沿界面擴展的雙材料界面斷裂理論,利用傾斜侵入界面的裂紋模型解析了裂紋尖端沿著界面的應力場,推導了表徵三維編織cmc復合材料斷裂韌性的能量釋放率公式g _ c ,並且用試驗結果驗證了能量釋放率公式的正確性。
  9. Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built, thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built, and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip

    本文根據實際的多晶元組件的封裝結構,建立了三維溫度場分析模型,分析了金剛石作為導熱層和基板對多晶元組件散熱性能的改善;建立了二維和三維的晶元-粘結層-基板熱力學模型,分析了不同的基板/晶元厚度比和面積比對層間熱應力分佈的影響。
  10. Based on analysis and comparison of existing test data applied to existing ultimate strength prediction models, interfacial stress at the end of plate is deduced. after formulas for calculating the effective moment of inertia for frp - strengthened beams being revised and adjustment coefficient related to nominal main steel reinforcement ratio and curtailment length ratio being put forward, strength prediction formulas of compound beams under plate end debonding failure are established. in analysis of strength of compound beams under intermediate crack induced interfacial debonding failure mode, several bond strengths and their relation are introduced

    對于板端剝離破壞,在總結現有承載力模型的基礎上,利用已有試驗數據對各承載力計算公式進行了分析比較,進一步採用分階段分析法,推導了板端界面應力的計算公式,在此基礎上,採用加固復合梁有效慣性矩的修正公式,建立了考慮名義配筋率和板端偏移比影響的板端剝離破壞梁承載力的計算公式;對于跨中受彎裂縫導致的粘結破壞,闡述了常見的幾種粘結強度之間的區別和聯系,並基於拉剪粘結強度,提出了跨中受彎裂縫導致粘結破壞的承載力計算公式,並利用現有試驗結果確定了模型中的一些參數;最後,利用試驗數據對本文建立的兩種粘結破壞承載力計算公式進行了檢驗,結果基本吻合。
  11. To begin with, simulated results of fiber axial stress, interfacial shear stress and variation of axial stress along a sfrc cross section are compared with their analytical solutions by means of a shear - lag method, on the assumption of perfect bonding

    在與本部分有關的研究工作中,首先將纖維和基體完全粘結假設下的解析解和有限元解進行兩個方面的比較:纖維的軸向應力,界面的剪切應力。
  12. Analysis of stress concentrations in cross - ply hybrid laminates taking into account interfacial damage

    疊層板的應力集中分析
  13. It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials

    研究表明, 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果; ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散,並由此在二者接頭處生成了cu - ti金屬間化合物的中間相; tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果,另外,由於熱膨脹系數的差異,擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
  14. Study of interfacial stress of single - fiber composite by photo - elastic experiment

    單纖維界面強度光彈性實驗和理論研究
  15. Stage ii begins at a peak associated with the maximal interfacial stress. then, the unloading of macro - stress occurs. in stage iii, the interface is completely separate

    1 )隨著界面開始分離,宏觀剛度下降; 2 )界面應力達到最大值並發生卸載,使得宏觀應力達到峰值然後卸載。
  16. It seemed that the fiber and the matrix did not creep themselves in the range of the testing stress and temperature, so the matrix microcracking and interfacial sliding will be the main contributer to the macroscopic deformation of the three - dimensional c / sic composite

    由於在所測定的溫度區間和應力范圍內,碳纖維和基體本身都不大可能發生蠕變。因此,基體開裂和界面的滑動是3d - c sic復合材料宏觀變形的主要貢獻者。
  17. On the fundamental of thermo - viscoelasticity, the rate of viscous heat generation in csp matrix in relation with stress and strain status, is obtained. the meso - scale model is put forward, in which processes or phenomena such as viscous heat in csp matrix, heat conduction between csp matrix and oxidant particulates, decomposition of oxidant and its interfacial reactions with csp matrix, are described. the control equations are derived

    應用熱粘彈理論、傳熱學、推進劑熱分解動力學等,分析推導了推進劑粘性加熱與應力應變的關系,建立了描述基體粘性加熱、基體與含能顆粒傳熱、含能顆粒受熱分解及與基體界面反應等過程的細觀模型,推導建立了模型控制方程。
  18. Stress generating mechanisms was discussed. the residual stress of 40 - bilayer mo / si multilayers in a high reflectivity multilayer was - 500 mpa ( compressive ), stress generating cause may be attributed to interfacial diffusion

    重點研究了多層膜的殘余應力控制技術;通過對單層膜以及多層膜的應力狀態分析,得出應力主要是由膜層之間的貫穿擴散引起的。
  19. Interfaces in fiber reinforced composites ( frc ) are vital because they ensure stress transfer between matrix and fibers. to characterize the interfacial properties in a fiber reinforced composites, several micromechanical experimental techniques have been developed

    纖維增強復合材料中,纖維和基體在外載作用下的破壞問題一直是復合材料力學性能研究的熱點,所以纖維和基體之間的界面對復合材料的力學性能起著至關重要的作用。
  20. A finite element analysis ( fea ) was eventually conducted, using mori - tanaka model and j - integral, to further explain the toughening mechanisms and fracture behaviour of the particle interleaved composites. the aim of the analysis was to examine the influence of the particle concentration and size, and the interaction between the particle and the crack tip. fea results indicate that interlayer zones can effectively lower j - integral and stress around the crack tip, and the high stress distribution in the region close to the interface can be the driving force for interfacial failure

    本文的最後還藉助于有限元方法對層間增韌復合材料進行了宏觀和細觀斷裂韌性分析,基於mori - tanaka等效夾雜理論,計算了顆粒含量和尺寸對j積分的影響,有限元分析的結果同樣表明層間增韌可以有效的降低裂紋尖端應力水平,並暗示界面是可能存在的失效原因,所進行的數值分析起到了進一步支持和解釋增韌機理的作用。
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