microelectronic packaging 中文意思是什麼
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The industry of microelectronic packaging equipments
微電子封裝設備市場分析 -
Because the calculation of j - integral is much simpler than other method, and the multilayers and interfaces are ubiquitous in microelectronic packaging structures, it is expected that this method will be widely used in the calculation of the strain energy release rate in high density electrical packaging, especially
並通過實例證明，此新方法對于界面分層問題是可行的。由於j積分計算十分簡便，因此扁平小矩形路徑j積分方法有望在電子封裝分層能量釋放率計算中得到廣泛的應用。
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