molding compounds 中文意思是什麼

molding compounds 解釋
模塑料
  1. Standard specification for allyl molding compounds

    烯丙基模製化合物的標準規范
  2. Specification for allyl molding compounds

    烯丙基合成化合物規范
  3. Specification for cellulose acetate butyrate molding and extrusion compounds

    醋酸-丁酸纖維素模壓和擠壓成形化合物規范
  4. 08. 01 specification for urea - formaldehyde molding compounds

    脲甲醛模製化合物規范
  5. 08. 01 specifications for melamine - formaldehyde molding compounds

    三氯氰胺甲醛模製化合物規范
  6. We provide thermal interface materials, emi shielding materials, polymer adhesives materials, insulation materials, inductive components and bulk molding compounds

    依美提供導熱介面材料, emi屏蔽材料,聚合物粘合劑材料,絕緣材料,電感元器件及熱固性復合材料。
  7. Specification for thermosetting polyester molding compounds

    熱固性聚酯模壓化合物規范
  8. Standard specification for thermosetting polyester molding compounds

    熱固聚酯模製化合物的標準規范
  9. Standard specification for urea - formaldehyde molding compounds

    脲甲醛模製化合物的標準規范
  10. 08. 02 test method for spiral flow of low - pressure thermosetting molding compounds

    低壓熱固性模塑料的螺線流動度的試驗方法
  11. Practice for compression molding test specimens of thermosetting molding compounds

    熱固性模塑化合物壓縮模塑樣品的實施規程
  12. The book also considers forming technologies for various composite material forms including thermoset and thermoplastic prepreg, molding compounds, and composite / metal laminates

    該書還認為成形技術,為各種復合材料的形式,包括熱固性和熱塑性預浸料,成型化合物,並復合/金屬層板。
  13. Standard specification for melamine - formaldehyde molding compounds

    三聚氰胺甲醛模製化合物的標準規范
  14. Standard specification for molding compounds, thermosetting

    熱固性模鑄化合物的標準規范
  15. Standard practice for compression molding test specimens of thermosetting molding compounds

    熱固模製合成材料的壓力模製試樣的標準操作規程
  16. Standard specification for epoxy molding compounds

    環氧基樹脂模塑化合物的標準規范
  17. 08. 02 specification for epoxy molding compounds

    環氧模製化合物規范
  18. Standard test method for spiral flow of low - pressure thermosetting molding compounds

    低壓熱固性模塑料螺旋形流動的試驗方法
  19. Vinylidene chloride molding compounds

    偏二氯乙烯模塑化合物
  20. Selection of tests for material properties of transfer molding compounds for electronic and microelectronic encapsulation

    電子元件及微電子元件封裝用傳遞模塑化合物材料性能試驗的選擇
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