oriented hole 中文意思是什麼
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In this paper, the operation principle of " the acquisition device of cross - hole seismic imaging system ", an important research project of " nine - five - year " plan of cnpc, is introduced. this system interpretes the requisition analysis, function model and data model of the surface master computer ' s software system based on object - oriented technology
本文闡述了中國石油天然氣總公司「九五」重點攻關項目「井間地震成像系統採集裝備」的工作方法，系統論述了其以面向對象為基礎的地面軟體系統的需求分析、功能模塊和數據模型。 -
In order to make the mgb more easy - operating, ultrasonic testing simula - tion software was designed and developed, which has a good user - oriented interface and can simulate easily the inspection fields of planar transducer, focused transducer and angle beam transducer. it also can help inspectors analyze the inspection procedures and predict the feasibility of actual ultrasonic testing, then choose suitable inspection parameters. the side - drill hole and flat - bottom hole are commonly used in ultrasonic
為了使多元高斯模型使用更加方便，本文設計並開發了基於多元高斯聲束理論的超聲檢測聲場模擬軟體，該軟體具有良好的圖形用戶界面，操作簡單，可方便地實現直探頭、聚焦探頭和斜探頭的檢測聲場模擬，可幫助檢測人員進行檢測過程的分析及結構件的可檢性預測，並選擇合適的檢測工藝參數。 -
Aiming at the shortage of material information, tolerance information, technical information, and so on in the model, the author conducted a research on a step based and feature oriented method to integrate the information in the model. the models for several common features were created. they are hole feature, planar face feature, outer - round feature, planar pocket feature, revolved groove feature, circular pattern feature, and rectangular pattern feature
針對現有數據模型在材料、公差以及工藝信息等方面的缺失，研究了在基於step的面向特徵的產品數據模型中集成這些信息的方法，建立了一些常見特徵，如孔類、平面、外圓、平面槽及旋轉槽、圓周陣列、矩形陣列等特徵的信息模型，並用express語言來表達，該模型不僅包含幾何拓撲信息，而且增加了公差、工藝路線、裝夾定位、加工方法、及材料等信息。 -
Storage technologies - sequential, page - oriented, rom, erasable and assoc. memory systems ; capacity, access time, readout rate, noise, optical disk, 3 - d memories ; photorefractive systems, two - photon systems, spectral hole - burning systems
25 23儲存技術?程序式，頁面導向，唯讀記憶體rom ，可消除與結合記憶系統，儲存容量，讀取時間，讀取速率，雜訊，光碟，三維記憶體，光折射系統，雙光子系統，光譜洞燒系統。
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