package outline 中文意思是什麼

package outline 解釋
封裝外形
  • package : n 1 包裝，包紮。2 〈主美〉包，包裹，捆，束，組；（產品等的）（一）件，件頭。3 包裝用物；（包裝用...
  • outline : n. 1. 外形，輪廓；輪廓線；輪廓畫法，略圖（畫法）。2. 〈常 pl. 〉梗概，大綱，提綱；草稿；要點；主要原則。vt. 1. 畫輪廓；打草圖，描略圖。2. 概括地論述，略述。
  1. Very small outline package

    甚小外形外殼
  2. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs

    半導體裝置的機械標準化.表面固定半導體裝置包裝外廓線繪制一般規則.包裝尺寸測量方法
  3. Mechanical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:表面安裝半導體器件封裝外形圖繪制的一般規則.四面扁平部件封裝尺寸的測量方法
  4. Mechnical standardization of semiconductor devices - part 6 - 3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of quad flat packs

    半導體器件的機械標準化.第6 - 3部分:半導體器件包裝用表面安裝略圖制備的一般規則.四方塊包裝件包裝尺寸的測量方法
  5. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體器件的機械標準化.繪製表面安裝半導體器件封裝外形圖的一般規則.焊球網格陣列封裝尺寸的測量方法
  6. Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array

    半導體裝置的機械標準化.第6 - 4部分:表面安裝半導體裝置封裝外形圖繪制的一般規則.球狀網格陣列
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