package structure 中文意思是什麼
package structure
解釋
程序包結構-
By taking the miniature ceramic rod which is easily to machine high accuracy as sensitive structure, and by printing and polarizing six belt - shaped electrodes above it to constitute three pairs of electrodes, this paper designed package and the phase - sensitive detection circuit in the system so that it effectively reduced the sensitive structure size and improved its processing precision to realize the angular rate gyro microminiaturization
首先採用易於加工成高精度的微型陶瓷棒作為敏感體，在其上印刷成六個帶狀電極並予以極化構成三副電極對，然後設計了封裝及相敏檢波電路，從而有效地減小了敏感結構的尺寸，提高了其加工精度，實現了角速率陀螺微型化。 -
After understanding the whole structure of enterprise model based on rdbms, i define a series of semanteme and expressing - dtd. i adopted the tool ’ s package of jdom and the interface of jsp to generate xml
在充分理解了以關系型數據庫描述的企業模型的完整結構后，基於xml的語義語法dtd ，自定義了一套滿足模型庫結構要求的企業模型數據交換標準。 -
Based on the fem program on fracture of plane structure developed by professor fu xiaoling of ho hai university, a two demension damage and fracture finite program package which is programed in fortran 90 language is developed. the paper adopts the plane - eight - nodes isoparameters element and compute the developing law of the damage and macro - damage of plane structure under load. considering the original damage and tension and compression damage at the same time, the paper adopts the more reasonable concrete constitute relation of two demension and exponent function model
在河海大學符曉陵副教授所編制的平面結構斷裂有限元程序（ dl08p4 ）基礎之上，本文用fortran90語言編制的二維損傷-斷裂有限元程序包，程序採用平面八結點等參數單元分析計算平面結構在外荷載作用下損傷及宏觀裂縫的發展規律，考慮了混凝土結構體內存在著初始損傷和同時存在的拉、壓損傷，並且採用更為合理的具有損傷含義的混凝土二維本構關系（即正交異性損傷模型中的本構方程）和指數函數模型建立的並可進行拉、壓損傷可比性換算的損傷演變方程，較為真實地反映了實際情況。 -
Is corporate value the appropriate efficiency criterion of ownership structure ? the second one is no consideration has been given to the effect of financial package
一是在所有權結構效率判斷標準的選擇上還存在著認識上的缺陷，以「公司價值」作為判斷所有權結構效率的標準是否合理 -
High - qualified designers and engineers of chaowei are able to provide various high - qualified design services such as ic software program, circuit board, product appearance, products structure, and product package, etc. the factories directly under chaowei have advanced production abilities including mould making, inection moulding, surface spray - painting, silk - screening, shift - screening, smt, welding and assembling, quartz clock core production, and quality check and assurance. chaowei held many design patents and utility model patents, at the same time, national clock and watch quality certification, national technical supervision bureau certification, usa fcc and astm security authentication, canada ic, and euro ce are achieved, the rich experience in oem and odm can ensure high quality products and professional service
超維公司擁有一批高素質的專業設計師和工程師，有能力為國內外客戶提供包括ic軟體編程線路板設計產品外觀設計產品結構設計產品包裝設計等多方面高水準的設計服務超維的直屬工廠則擁有模具製造注塑成型表面噴漆絲印移印smt焊接裝配石英鐘機芯製造品質檢驗測試等先進的生產能力超維公司的產品擁有大量的外觀設計專利和實用新型專利，同時獲得了國家鐘表質量檢驗中心的合格證書國家技術監督局檢驗合格證書美國fcc認證和astm安全認證加拿大ic認證歐盟ce認證。 -
The chip is bonded to a stress isolating mechanical structure and sealed into an evacuated package
採用了隔離墊片和應力隔離支柱來減小封裝應力，完成了傳感器的真空封裝。 -
Exploration of knowledge structure and system on package engineering course
包裝工程學科知識體系與結構的探討 -
Dynamic analyses and optimal design of product package structure
物品包裝結構動力學分析及優化設計 -
In order to overcome the issues unfavorable for development of industrialization in local goose husbandry, the strategies for speeding up development of goose husbandry industrialization were proposed in the paper as follows : ( 1 ) recognizing the main objectives, setting up some policies favorable for goose husbandry, improving quality of services in each related agent, making major efforts to develop some leading enterprises with a large scale of goose production, strong strength and good motivation to other small enterprise ; ( 2 ) the novel products with good market prospect should be deplored and developed preferably, the structure of goose production optimized, deep processing of goose products improved rapidly to enlarge the industrialization chain for goose husbandry, meanwhile the package and fresh - keeping technology should be more greatly emphasized, to increase accessional value of the products
論文針對永康市鵝業產品化發展進程中存在的問題，設計了永康市加快鵝業產業化步伐的具體對策和措施： （ 1 ）明確工作思路，採取優惠政策，改善部門服務，大力扶持鵝業龍頭企業，培育一批規模較大、實力雄厚、帶動力強的支柱型鵝業龍頭企業，充分發揮龍頭企業的帶動功能。 （ 2 ）優先發展有市場前景的新產品，優化鵝產品結構，著力做好鵝產品深加工，延長鵝產業鏈條。重點做好包裝和保鮮，提升科技含量，提高鵝產品附加值。 -
This paper constructs fe models of srm in detail and analyzes the vibration mode and natural frequencies with the finite element analysis software package, and studies the influence of the stator structure of srm, such as stator poles, ribs, mounting feet, terminal block and structure parameters, restriction condition on the srm vibration behavior, the contrast to experiment result implies that the fea model is close to the real model for analyzing the vibration characteristics of srm
本文基於有限元分析方法，主要研究了定子凸極、底座、散熱筋，加強筋，接線盒等結構以及結構參數對定子固有頻率和振動模態的影響，並且研究了約束條件下的sr電機定子振動特性。本文比較了模態實驗與有限元分析結果，表明所建立的二維有限元模型對分析sr電機的振動特性有較好的精度。 -
A transient heating response theory is also used to inspect the package structure of the devices
還應用瞬態加熱響應原理對功率管的封裝結構進行了監測。 -
Simulation and design of high - power led ' s package structure
封裝結構的模擬設計 -
Including the entire directory package structure to
（包括整個目錄軟體包結構）復制到 -
The final package structure will look something like listing 11
最後的包結構看起來類似於清單11 ： -
To view the package structure and content
查看包的結構和內容 -
Depending on the package structure, expand any next - level folders
根據包的結構，展開所有次級文件夾。 -
Folder and package structure
文件夾和包結構下。 -
The influence of package structure on the internal flow of automotive catalyst converter
車用催化轉化器封裝結構對其內部流動的影響 -
The assembly process and experimental results are included in this paper. in order to increase the power density of the module, a three - dimensional fc - ipem package structure is introduced. a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
為實現更高的功率密度，本文把微電子行業中廣泛應用的倒裝晶元技術應用於模塊電源研究中，完成了一個半橋fc - ipem （ flipchip - integratedpowerelectronicsmodule ）模塊。 -
Emc / emi simulation of special microwave connection and package structure in mcm - l is taken to sum up some effective emi methods to guide layout design. 3. the system characteristics and link index are analyzed to point out key modules in circuit realization
設計了微波疊層結構，並對疊層結構中出現的互耦、互連、不連續性及封裝結構進行電磁模擬，提出抑制電磁干擾的措施。
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