prepreg 中文意思是什麼

prepreg 解釋
頂浸處理
  1. Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth

    多層印製線路板用半固化片. bismaleimide三氮雜苯環氧樹脂浸漬玻璃布
  2. Standard test method for constituent content of composite prepreg by soxhlet extraction

    通過索格利特萃取法測定合成預浸料坯中組分含量的標準試驗方法
  3. Toughening thermoset matrix composites with interlayered thermoplastic particles is an effective method to improve fracture toughness and impact resistance without sacrificing hot / wet properties. furthermore, transverse strength, fatigue resistance and solvent resistance can also be enhanced. drapability and tackness of interleaved prepreg is maintained as conventional level

    對樹脂基體復合材料採取層間顆粒增韌是提高復合材料層壓板韌性、抗沖擊能力和抗分層能力的有效途徑,在保持原有復合材料濕熱性能的前提下,通過層間顆粒增韌,還可以改善垂直纖維方向的強度、抗疲勞性能以及耐溶劑性,並不影響原有的成型工藝。
  4. Test method for volatile content of prepreg

    預浸料揮發物含量試驗方法
  5. Standard test method for gel time of carbon fiber - epoxy prepreg

    碳纖維環氧樹脂預浸料坯凝固時間的標準試驗方法
  6. Standard test method for resin flow of carbon fiber - epoxy prepreg

    碳纖維環氧樹脂預浸料坯的樹脂流動性標準試驗方法
  7. Standard test method for volatiles content of composite material prepreg

    合成材料預浸料坯中揮發物含量的標準試驗方法
  8. Aerospace ; aromatic polyamide aramid ; pre - impregnated woven fabric of high modulus filament yarn prepreg ; dimensions, masses

    航空航天.芳族聚酰胺.高模量長絲紗預浸漬機織物.尺寸
  9. Compared with prepreg tape winding, wet winding can effectively reduce the processing cost of composites

    相對于乾法纏繞成型而言,濕法纏繞成型可有效降低復合村料的製造成本。
  10. Design and manufacture copper clad laminates and prepreg

    健鼎科技股份有限公司已上櫃
  11. Base materials for printed circuits. part 3 : special materials used in connection with printed circuits. specification no. 1 : prepreg for use as bonding sheet material in the fabrication of multilayer printed boards

    印製電路用基材.第3部分:印製電路用的特殊材料.第1號規范:製造多層印製板中用作粘結片材料的預浸材料
  12. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

    印製電路板用覆箔板.第103部分:印製電路連接專用材料.第1節:多層印製電路板製造用粘結片材的半固化片規范
  13. Aerospace - fibre reinforced plastics - description of yarn, fabric and prepreg defects

    航空航天.纖維增強塑料.紗疵,織疵和預浸漬體疵點的定
  14. Aerospace ; aromatic polyamide aramid ; woven filament fabric prepreg from high - modulus filament yarn and epoxy resin ; technical specification

    航空航天.芳族聚酰胺.第2部分:由高模數長絲紗線和環
  15. Test method for physical properties of composite material prepreg part 2 : determination of mass per unit area

    復合材料預浸料物理性能試驗方法第2部分:面密度的測定
  16. Test method for physical properties of composite material prepreg part 3 : determination of fiber mass per unit area

    復合材料預浸料物理性能試驗方法第3部分:纖維面密度的測定
  17. Prepreg for multilayer printed wiring boards - modified or unmodified polyimide resin - impregnated glass cloth

    多層印製電路板的半固化片.改性和未改性浸聚酰亞胺樹脂玻璃布
  18. Test method for resin flow of prepreg

    預浸料樹脂流動度試驗方法
  19. Aerospace ; unidirectional carbon fibre - epoxy sheet and tape prepreg ; technical specification

    航空航天.不定向碳纖維環氧樹脂薄板和預浸漬帶.技術
  20. . aerospace ; preimpregnated fibre sheet and tape prepreg ; determination of bond strength

    航空航天.預浸漬的纖維薄板和纖維帶
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