printed board 中文意思是什麼

printed board 解釋
印刷電路板
  • printed : 印好的
  • board : n 1 板〈通常指寬4英寸半以上厚2英寸半以下者〉，木板；紙板。2 （廣告）牌；（棋）盤；〈口語〉配電盤...
  1. Acceptability of printed board assemblies

    印刷板組件的合格判定
  2. Printed board assembly drawing

    印製板組裝圖
  3. Metal base printed board

    金屬基印製板
  4. . j printed boards and printed board assemblies - design and use - part 5 - 6 : attachment land joint considerations - chip carriers with j - leads on four sides

    印製電路板和印製電路板組件.設計和使用.第5 - 6部分:附件
  5. Bulid - up flexible printed board

    表面層合電路板
  6. Build - up flexible printed board

    積層撓印製板
  7. Flexible printed board

    擾性單面印製板
  8. Auxiliary printed board information. part 3 : guidelines for artwork

    印製電路輔助文件.第3部分:照相底版指南
  9. Printed board manufacturers qualification profile

    印製電路板生產商資格證明綱要
  10. Mqp printed board manufacturers qualification profile

    印製板製造商的資格綱要
  11. Printed boards and printed board assemblies - design and use - part 1 - 2 : generic requirements - controlled impedance

    印刷電路板和印刷電路板組件.設計和使用.第1 - 2部分:一般要求.控制阻抗
  12. Connectors with assessed quality, for use in d. c., low - frequency analogue and in digital high - speed data applications - part 4 : printed board connectors - section 001 : blank detail specification

    直流低頻模擬設備和數字高速數據應用設備用已審定質量的插頭座.第4部分:印製電路板插頭座.第001節:空白詳細規范
  13. Cause of multilayer printed board ' s warp and the countermeasure

    多層印製電路板翹曲成因與對策
  14. Electronic components. two part and edge socket. connectors for printed board application

    電子元件.雙部件和棱形插座.印製電路板用連接器
  15. Electroconductive paste printed board

    塑模電路板
  16. Printed board and printed board assemblies. design and use. part 1 - 1 : generic requirements. flatness considerations for electronic assemblies

    印刷電路板和印刷電路板組件.設計和使用.第1 - 1部分:一般要求.電氣組件不平度的考慮
  17. Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求
  18. Rigid - flex printed board

    硬軟合板
  19. Buile - up printed board

    積層印製板
  20. Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board

    印製電路板用覆箔板.第103部分:印製電路連接專用材料.第1節:多層印製電路板製造用粘結片材的半固化片規范
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