solder joint 中文意思是什麼
solder joint
解釋
焊接接點-
According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
採用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡（ c - sam ）無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝晶元與底充膠界面分層裂縫傳播速率。 -
Cast copper alloy solder joint drainage fittings - dwv
Dwv鑄銅合金釬焊連接排水配件 -
Cast copper alloy solder joint drainage fittings : dwv
Dwv類鑄銅合金釬焊連接排水管件 -
Cast copper alloy solder joint pressure fittings
鑄銅合金軟釬焊連接壓力管件 -
Wrought copper and copper alloy solder joint pressure fittings
鍛銅和銅合金釬焊壓力配件 -
Wrought copper and copper alloy solder - joint pressure fittings
鍛銅和銅合金釬焊接壓力連接件 -
Cast copper alloy solder joint drainage fittings - dwv ; errata
鑄銅合金軟釬焊連接排水管件. dwv .勘誤 -
Wrought copper and wrought copper alloy solder joint drainage fittings - dwv
Dwv型鍛銅和鍛銅合金釬焊排水配件 -
In the transition from lead to lead - free, for the manufacturers of electronic products, there is expected to be a period when lead and lead - free materials will be used within the same mounting process, the mixed solder joint which formed in this situation is very complicated
摘要在從有鉛向無鉛轉換過程中，電子產品製造商不可避免會碰到同一組裝過程中有鉛和無鉛同時存在的混合情況，這種情況下形成的混合焊點是很復雜的。 -
The reliability of lead - free solder joint
無鉛焊點的可靠性問題 -
Solder joint fatigue life predictions for csp package under power cycling
封裝結構焊點的壽命預測分析 -
Cements solder joint compounds
水泥焊料結合點混合物 -
Electronic device is developing toward lighter, thinner and littler volume, which demands highly on the density and functionality of package i / os. so it is important factor to assure the quality of the solder joint
電子產品的「輕、薄、短、小」化對元器件的微型化和組裝密度提出了更高的要求，而焊點的質量和可靠性是影響電子產品質量的重要因素。 -
To address this issue, i own development company dedicated to produce aluminum wire enameled wire, enameled wire welding of aluminum products in the process to save time, save costs and reduce process, solder joint reliability bright spot. fundamentally solve the problem of welding aluminum enameled wire, so to some extent, aoruidi aluminum and aluminum brazing wire enameled wire exclusive agent to promote the use and development of aluminum enameled wire
針對這個問題，我公司自主開發生產出鋁漆包線專用焊錫絲，該產品在鋁漆包線的焊接流程中節省時間，節約成本，減少工序，焊點可靠，焊點光亮，從根本上解決了鋁漆包線的焊接問題，從而在某種程度上來說，奧瑞迪鋁漆包線專用焊錫絲和鋁釬劑促進了鋁漆包線的應用和發展。 -
This virtual assembly platform includes evolving simulation of solder joint shapes and reliability cad, modeling and simulation of assembly process and evaluation expert system, and their composition, function and realization of these subsystems are also reviewed
該系統主要包括焊點成形模擬與可靠性cad 、組裝工藝建模與模擬，以及分析評價專家系統等子系統，並對各子系統組成、實現及功能等關鍵技術進行了探討。 -
On the basis of virtual evolving technology of surface mount technology ( smt ) for the solder joints, design for manufacturing ( dfm ) is employed, and dfm - oriented smt virtual assembly system targeted at assembly quality and solder joint reliability is developed
摘要在表面組裝技術焊點虛擬成形技術的基礎上，運用面向製造的設計思想，以表面組裝技術組裝質量與焊點可靠性為目標，研究面向表面組裝技術生產組裝工藝設計的產品虛擬組裝系統。 -
According to the major failure modes of mixed solder joint, this paper analyses the mechanism of mixed solder joint from mounting process, thermal fatigue, ageing, mechanical collision and shock etc ; then introduces the effect factors of reliability from design, material, process and environment etc
根據混合焊點的主要失效形式，對混合焊點的失效機理從組裝工藝、熱疲勞、時效、機械沖擊和震動等四個方面進行分析；然後從設計、材料、工藝和環境等四個方面介紹了影響這類焊點可靠性的因素。 -
Solder end valves are limited by temperatures which affect the strength of the solder joint
4焊接連接埠閥門溫度限制在不影響焊接連接埠的強度范圍內。 -
Quality control of bga solder joint
檢測技術與質量控制 -
Recently it becomes a hot point to find the defects of the solder joint in time and effectively
近年來，如何及時有效的發現焊點的缺陷一直是電子組裝行業研究的一個熱點。
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