solder paste 中文意思是什麼

solder paste 解釋
焊藥。

  • solder : n. 1. 焊藥，焊劑；焊錫。2. 結合物，聯接因素。vt. ,vi. 焊；接合；錫焊；焊接；（使）結合。
  • paste : n 1 糊，漿糊；面團；軟糖；濃羹，醬。2 糊狀物；玻璃質混合物〈制人造寶石的原料〉；鉛質玻璃；制陶粘...
  1. We should judge the adhibit of solder paste before screen printing by automatic machine or by hand

    我們在進行錫膏印刷前應對錫膏進行一定的檢測。如果沒有專用設備也可以用以下的方法檢查一下。
  2. 6 is the sequence of solder paste height measurements defined

    錫膏厚度的測量順序是否指定
  3. Reflow solder paste in 2 hours as soon as possible after printing

    印刷后要在2小時內迴流焊膏。
  4. The operator should use the solder paste quickly after it has been taken out

    取出的錫膏要盡快實施印刷使用。
  5. 7 is the average and range of solder paste height measurements spc controlled

    錫膏厚度測量的平均值和間距spc是否受控
  6. Familiar with lead - free solder paste and at least 3 years related sales experience

    熟悉無鉛錫膏產品及市場，具備3年以上行業銷售經驗。
  7. To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads

    為了獲得要求的凸起高度，錫膏在晶片焊盤過焊。
  8. 8 are lcd ' s and ucla ' s defined for the average and range of solder paste measurements

    對錫膏厚度測量的平均值和間距是否定義了其控制上限和下限
  9. On the other hand it is a wrong way of opening the cover frequently or not covering the solder paste

    不要取一點用一點，頻繁開蓋或始終將蓋子敞開著。
  10. Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly

    在表面貼裝裝配的迴流焊接中，錫膏用於表面貼裝元件的引腳或端子與焊盤之間的連接。
  11. The operator should assure a shorter open time and make the paste be in good sealed status after we have taken sufficient solder paste once

    開蓋時間要盡量短，一次取出夠用的焊膏后，應立即將內蓋蓋好。
  12. Do not touch solder paste bare - handed. remove with ethyl alcohol from body or clothes if contaminated by solder paste

    小心使用焊膏，避免觸及皮膚。若附於衣服或身體時，應盡快用含有酒精的溶劑把焊膏抹掉。
  13. Solvent may be easily vaporized when solder paste is contacted with air - conditioned current or wind and hence reducing its tackiness

    不要將焊膏放近於風口的位置，因為這樣會使焊膏中的溶劑蒸發，降低其粘性。
  14. 9 is the upper and lower specification limits for individual solder paste height measurements also defined

    單點錫膏厚度測量是否定義了其控制上限和下限
  15. Spherical alloy solder powder producing by high - energy atomizing technique, under accurate monitoring by the computer, carrying out the high quality standard of the alloy solder powder, can satisfy with the high quality demand of the solder paste manufacture absolutely

    採用高能霧化技術生產的球型合金焊錫粉，在計算機精確的控制下，執行高品質的合金焊粉質量標準，完全能滿足高品質錫膏製造的要求。
  16. More than 3 years working experiences in smt processing and strong willing to be a technical sales in selling lead - free solder paste

    3年以上smt生產線工藝製程控制經驗，具有銷售無鉛錫膏產品的願望。
  17. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中，前四項對焊點可靠性比較重要，焊接環境對焊點可靠性的影響不很顯著。
  18. Lead - free n2 / air reflow soldering machine ， automatic lead - free dual wave soldering machine ， semi - auto solder paste printer ， loader ， unloader ， buffer conveyor ， multi - function buffer loader, aoi

    熱風迴流焊錫機，全自動無鉛雙波峰焊錫機，錫膏印刷機，送板機，收板機，緩沖輸送機，多功能暫存機， aoi等。
  19. Figure 5. transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity

    圖5 ，錫高轉移的效率與孔面積比率及它對迴流峰共面度的影響。
  20. Lf305a is designed for widely electronic assembly applications. it is a lead - free, mildly active solder paste

    Lf305a這種材料的設計被廣泛應用於電子零件的裝配.它是一種無鉛，低活性硬質糊狀物
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