solderability 中文意思是什麼
solderability
解釋
焊錫附著性-
Specification for solderability tester by globule method
焊球法可焊性測試儀.技術條件 -
Test methods for bare wires - solderability test of coating - solder globule method
裸電線試驗方法鍍層可焊性試驗焊球法 -
Testing of solderability for soft soldering ; wetting tests
軟釬焊可軟釬性的檢驗.濕潤試驗 -
Specification for solderability tester by solder bath method
焊槽法可焊性測試儀.技術條件 -
Testing of solderability for soft soldering ; vertical dipping test for pre - tinned specimens ; testing ; assessment
軟釬焊可軟釬性的檢驗.預鍍錫試樣的垂直浸漬試驗.檢 -
Testing of solderability for soft soldering ; vertical dipping test for specimens of copper alloys ; testing ; assessment
軟釬焊可軟釬性的檢驗.銅合金試樣的垂直浸漬試驗.檢 -
Solderability tests for component leads, terminations, lugs, terminals and wires
元件引線接線端焊片接頭和金屬絲的軟釬焊性試驗 -
Each displays different properties for solderability, etc
每一種類型都有不同的特性和焊錫性。 -
Excellent in solderability and high heat resistance with either flow or reflow soklering
可焊性和耐焊性優，適用於流焊和再流焊。 -
Department perfect test, which can be made into various mechanical properties such as : tension tests, strength tests slide, terminal testing ; electrical performance test items include : insulation resistance testing, contact resistance testing, testing withstand voltage, high and low test, solderability test, durability testing, vibration - resistant testing, life test
完善之測試部，能作各項機械性能測試如:拉力測試、插撥力測試、端子強度測試；電氣性能測試項目計有:絕緣電阻測試、接觸電阻測試、耐電壓測試、高低測試、可焊性測試、耐久性測試、耐振測試、壽命測試等 -
Solderability tests for component leads, terminations, lugs, terminals, and wires
元件引線終端接線片端子和電線的可釬焊性試驗 -
Specification for solderability tester by wetting balance method
潤濕秤量法可焊性測試儀.技術條件 -
These chip inductors provide maximum protection features for solder reflow, welding and come with precise formed caps of high temperature acrylic for perfect co - centering and vacuum pickup. they have excellent solderability and are able to withstand pull - up force, mechanical shock and pressure. available in sizes of 0402, 0603, 0805, 1008, 1206, 1210, our chip inductors have wide inductance range for virtually all broadband and rf applications
臺達電子提供全系列之被動元件，包括0402 0603 0805 1008 1206與1210系列，可應用於行動電話基地臺寬頻通訊無線電話個人數位助理pda呼叫器搖控器電視機上盒數據機電壓控制振蕩器與高頻模組等。 -
Determining solderability of thick film conductors
厚膜導體的軟釬焊性測定 -
Standard test method for solderability of metallic - coated products
金屬塗覆產品的軟釬焊性試驗方法 -
Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste
環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置 -
Environmental testing - test methods - tests - test te - solderability testing of electronic components for surface mount technology by the wetting balance method
環境試驗規程.第2部分:試驗方法.第69節:試驗te :潤濕平衡法試驗表面鑲嵌技術用電子元件軟釬焊 -
Environmental testing. part 2 : tests. test ta : soldering. solderability testing by the wetting balance method
基本環境試驗規程.第2部分:試驗.第54節:試驗ta :錫焊.潤濕平衡法可焊性試驗 -
Environmental testing - part 2 : tests - test te : solderability testing of electronic components for surface mount technology by the wetting balance method
基本環境試驗規程.第2部分:試驗.第69節:試驗te :潤濕平衡法對表面鑲嵌技術用電子元件的軟釬焊試驗 -
Surface mount solderability test
表面的可焊接性試驗
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