soldering temperature 中文意思是什麼

soldering temperature 解釋
焊接溫度
  1. Pre - data gathering module achieves the collection and communication of sixteen - route temperature signal. speed measuring and controlling module realizes the control of refolw soldering transfer speed by manipulating transducer. on - off outputting module fulfills calefaction control of calefaction tube by solid state relay. above position operator software programs by delphi, and realizes pid parameter automatic timing and no - oversnooting temperature control. software has friendly interface, convenient operation, complete functions

    前置數據採集模塊完成16路溫度信號的採集和通訊;速度測量模塊與速度控制模塊通過控制變頻器來調節迴流焊的傳輸速度;開關量輸出模塊通過固態繼電器對加熱管進行控制;上位機軟體採用delphi編程,實現了pid參數自整定以及無超調的溫度控制。
  2. Medium frequency induction heating equipment are used in metal melting, temperature keeping, diathermic technology, metal - heat processing brass soldering, quenching, tempering and sintering

    中頻感應加熱設備適用於各種金屬熔煉,保溫,透熱,金屬熱處理,釬焊,淬火回火,燒結,釬絲鋼絲等。
  3. Carefully handle the solder and ensure all the contact points and solder are clean - try different quantities of solder, make sure your soldering iron has been adjusted to the best temperature

    -不同的焊點:線路焊點的運用位置搭配,焊種不同,焊量的比例,溫度的調整
  4. Heaters of high temperature, such as soldering irons, should be kept away from the vinyl insulation sleeve of capacitor which to avoid the cause made over heat or break down to sleeve

    電烙鐵等高溫發熱裝置應與電解電容器塑料外殼保持適當的距離,以防止過熱造成塑料套管破裂。
  5. Direct connect vias conduct so much heat away from the pin and into the plane that high temperature or long soldering time may be required to complete the joint - thermal damage could occur to both the board and the component from soldering or desoldering

    在焊接時,直接連接的過孔會通過引腳把大量的熱傳導至內電層,因此完成焊接就需要很高的溫度或者延長焊接時間,這就會導致在焊接或拆焊時發生電路板或元件的損壞。
  6. The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability

    摘要通過分析焊料在釬焊過程中的行為,提出了電子焊料的工藝性能主要包括熔化固化溫度、抗氧化性、潤濕性和漫流性。
  7. The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on

    分析表明:相關的影響因素主要包括合金的組成、純度和化學均勻性;母材的成分、性質和表面的潔凈度;液態焊料的表面張力;釬焊溫度、氣氛、助焊劑的活性;液態焊料表面膜的組成、結構和性能等。
  8. Resistance to soldering temperature for through - hole mounted devices

    通孔固定裝置的焊接溫度抗性
  9. When soldering the electrolytic capacitor, the soldering time should never be permitted over 10 seconds, and for 260 ? c of the soldering temperature

    在焊接電解電容器時,其焊接時間和焊接溫度不應超過10秒鐘及260攝氏度。
  10. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability

    在焊球合金、焊料合金、峰值溫度、液相線以上時間和焊接環境五個關鍵因素中,前四項對焊點可靠性比較重要,焊接環境對焊點可靠性的影響不很顯著。
  11. Provides an optimum temperature for soldering pcb throughout reflowing operation

    通過迴流焊操作為焊接pcb提供最佳溫度。
  12. Semiconductor devices - mechanical and climatic test methods - resistance to soldering temperature for through - hole mounted devices

    半導體器件.機械和氣候試驗方法.通孔安裝設備的耐釬焊溫度
  13. Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices

    半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設備的耐釬焊溫度
  14. Semiconductor devices - mechanical and climatic test methods - part 15 : resistance to soldering temperature for through - hole mounted devices iec 60749 - 15 : 2003 ; german version en 60749 - 15 : 2003

    半導體器件.機械和氣候試驗方法.第15部分:通孔安裝設
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