solders 中文意思是什麼
solders
解釋
索爾德斯-
Research and development of sn - ag - sb lead - free based solders
系列合金的研究與開發 -
It is used for pressure and vacuum of ammoniac liquid and gas as well as of zhe madia which can ' t corrode carbon steel, stainless steel and solders like tin and lead
儀表適用於測量氨的液體和氣體的壓力真空，也可測量對碳鋼、奧氏體不銹鋼和錫鉛類焊料無腐蝕作用的介質的壓力和真空。 -
Recommended fine solders high performance silver solder for audio
推薦使用音質特色佼好的焊錫 -
Dental gold - silver - palladium alloy solders
牙科用金銀鈀合金焊劑 -
Rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended
額定內部壓力是所連接的管道額定內部壓力。如果可以採用焊料，則推薦使用銅焊合金。 -
H rated internal pressure is that of the tube being joined. while solders can be used, brazing alloys are recommended
額定內部壓力是所連接的管道額定內部壓力。如果可以採用焊料，則推薦使用銅焊合金。 -
Seal the assistant who clears up machine being that one kind of new model is good be used for the stainless steel project, equipment, what be come into being black solders road, handles a simplicity when it can help your relaxed treatment argon arc soldering machine flow welding stainless steel, grab the head as long as using this machine to control touch choose clear up liquid saying that the surface is light in soldering clean, the black welding bead is immediately disappear, bright if new, hurt bright stainless steel surface face by no means, clear up the queen using wet fabric to clean again, outside, stainless steel not getting rusty, not being suffused with yellow, be quick, more beautiful, more economical than using acid - washing method speed such as cream and polishing
焊縫清理機是做不銹鋼工程、設備的又一種新型好幫手，它可以幫助您輕松處理氬弧焊接機燒焊不銹鋼時所產生的黑色焊道，操作簡單，只要用本機操縱搶頭沾取清理液在焊道表面輕輕擦拭，黑色焊道即刻消失，光亮如新，決不傷害不銹鋼表面亮面，清理后再用濕布擦拭，不銹鋼表面不生銹、不泛黃，比用酸洗膏和拋光等方法速度更快、更美觀、更經濟。 -
Requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
電子釬焊用電子級釬料合金及助熔和非助熔固體釬料的要求 -
Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
電子組件用的連接材料.電子焊接設備用的電子分級焊料合金和助熔劑和非助熔劑的要求 -
Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
電子組件用連接材料.第1 - 3部分:電子焊接用電子級釬焊合金及有焊劑和無焊劑的固體焊料的要求 -
The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process, which includes temperature of melting or solidifying, anti - oxidation capability, wetability and overflow capability
摘要通過分析焊料在釬焊過程中的行為，提出了電子焊料的工藝性能主要包括熔化固化溫度、抗氧化性、潤濕性和漫流性。 -
The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy, the composition and properties of mother materials and their clean level on the surface, the surface tension of liquid state solders, the temperature and atmosphere in soldering and the activity of flux, the chemical composition and structure and properties of the surface film of melting solders, and so on
分析表明：相關的影響因素主要包括合金的組成、純度和化學均勻性；母材的成分、性質和表面的潔凈度；液態焊料的表面張力；釬焊溫度、氣氛、助焊劑的活性；液態焊料表面膜的組成、結構和性能等。 -
Precious metals - the finenesses of solders used with precious metal jewellery alloys
貴重金屬.貴重金屬珠寶合金適焊性 -
Study on the reliability of sn - ag - cu lead - free solders
無鉛焊料的可靠性研究 -
Specification for zinc, tin and cadmium base solders
鋅錫和鎘基焊料規范 -
Development and research of self - adaptive lead - free solders
自適應無鉛焊料的開發與研究 -
Test methods for lead - free solders - part 1 : methods for measuring of melting temperature ranges
無鉛焊劑的試驗方法.第1部分:熔化溫度范圍的測量方法 -
Study of wettability of rapidly solidified tin - based solders
復合鋼管陶瓷層相組成及緻密化的研究 -
Soldering and brazing materials - methods for the sampling of soft solders for analysis iso 10564 : 1993 ; german version en iso 10564 : 1997
軟釬焊材料和硬焊材料.分析用軟焊取樣方法 -
Higher temperature solders will damage the seat material
採用更高溫度的焊料將會損壞閥座材料。
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