through-hole 中文意思是什麼

through-hole 解釋
通孔
  • through : 副詞1 穿過，通過，經歷；從頭到尾，完全，全部；到最後，到底，徹底；透；完畢。 2 出來。 adj 1 直通...
  • hole : n 1 洞，穴，孔；（衣服等上的）破洞；傷口；漏洞；窩，坑；水流的深凹處，（河道的）緩流窪。2 （獸的...
  1. Through - hole machine and hand taps of internal screw on light alloy for installing wire thread insert

    輕合金安裝鋼絲螺套用內螺紋通孔的機手用絲錐
  2. Resistance to soldering temperature for through - hole mounted devices

    通孔固定裝置的焊接溫度抗性
  3. Quasi - interfacing plated - through hole

    準表面間鍍覆孔
  4. Pin - through - hole reflow soldering technology

    穿孔再流焊技術
  5. Tapped through hole

    螺紋貫穿孔
  6. Through - hole form

    通孔形式
  7. Interstitial via hole : an embedded through - hole with connection of two or more conductor layers in a multilayer pcb

    埋孔：多層pcb內的連接兩個或以上導體層的鍍通孔。
  8. Reliability of plated through hole ( pth ) has close relationship with technology parameters during manufacture process

    摘要鍍通孔的可靠性與製造過程工藝參數有非常密切的關系。
  9. Lathe chucks, without through - hole ; technical conditions of delivery for power operated lathe chucks

    無通孔的車床卡盤.動力操作車床卡盤的交貨技術條件
  10. Through - hole machine and hand taps of internal screw on common stees for installing wire thread insert

    普通鋼安裝鋼絲螺套用內螺紋通孔的機手用絲錐
  11. Non through - hole machine and hand taps of internal screw on common stees for installing wire thread insert

    普通鋼安裝鋼絲螺套用內螺紋不通孔的機手用絲錐
  12. Printed board assemblies - sectional specification - requirements for through - hole mount soldered assemblies

    印製電路板組件.分規范.通孔安裝焊接組件要求
  13. Standard surface - mount technology or through - hole techniques provide adequate performance

    標準表面貼裝技術或通孔技術提供足夠的性能。
  14. Non through - hole machine and hand taps of internal screw on light alloy for installing wire thread insert

    輕合金安裝鋼絲螺套用內螺紋不通孔的機手用絲錐
  15. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

    通孔盤狀及平面陣列陶瓷多層電容器焊料所含的鉛。
  16. Sectional specification for capability approval of manufacturers of double - sided flexible printed wiring boards of assessed quality with through hole connections and with or without rigidizing component materials

    經質量評定的帶穿透鍍膜孔連接的帶或不帶硬化成分材料的雙面撓性印製電路板製造商性能鑒定用分規范
  17. Sectional specification for capability approval of manufacturers of single - or double - sided flexible printed wiring boards of assessed quality without through hole connections and with or without rigidizing component materials

    經質量評定的無穿透鍍膜孔連接的帶或不帶硬化成份材料的單面或雙面撓性印製電路板製造商性能鑒定用分規范
  18. Workmanship requirements for soldered electronic assemblies - through - hole mount assemblies

    釬焊電子組件的工藝要求.通孔安裝組件
  19. Umf. miniature fuses - part 4 : universal modular fuse - links - through - hole and surface mount types

    微型熔斷器.第4部分:通用模數熔斷體
  20. Workmanship requirements for soldered electronic assemblies - part 3 : through - hole mount assemblies

    釬焊電子組件的工藝要求.第3部分:通孔安裝組件
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