underfill 中文意思是什麼

underfill 解釋
（焊接）未填滿（凹陷）
  1. The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end. the critical length was about 12m for the assembly with no - flow underfill and 20m for the package with capillary - flow underfill at 20 ?

    模擬表明，山固化溫度冷卻到室溫時，所研究的倒裝焊封裝在填充不流動膠時晶元斷裂臨界裂紋長度為12pm ，而填充傳統底充膠時為20hm 。
  2. Flip chip underfill technology

    的晶元倒裝技術
  3. According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint

    採用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡（ c - sam ）無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝晶元與底充膠界面分層裂縫傳播速率。
  4. Delamination occurred when the liquid and gas phases of water coexist in micro - holes at chip / underfill interface. the adhesive strength between underfill and chip would be reduced due to the absorbed water molecules, resulting in extension and linkage of these micro - holes to form the delamination

    認為在一定的水汽濃度下，器件內部塑封材中國科學院上海微系統與信啟、技術研究所博十學位論文料在界面處的微孔洞可能出現氣液兩相共存。
  5. The height and angle of no - flow underfill fillet little effects on the die cracking

    在特定的焊點排布下，晶元斷裂的可能性會達到最小。
  6. The stress intensity factor ( sif ) and the strain energy release rate were simulated with different pre - crack length for the cases with no - flow underfill and with capillary - flow underfill

    本文第六章用斷裂力學方涪和有限元模擬分析了填充不流動膠晶元斷裂問題，計算了晶元的應力強度因於k和能量釋放率g 。
  7. In the second part, the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials, die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components. in the last chapter, the design tool for advanced electronic package was studied. the main conclusions in the second part are as follows

    論文第二部分電子封裝可靠性研究包含對塑封材料中水汽擴散研究、填充不流動膠的倒裝焊晶元可靠性研究以及大功率器件散熱問題研究三方面內容，最後為實現封裝設計標準化和自動化，研究了若干最主要的電子封裝構型的參數化有限元建模、加載和相應的求解方法。
  8. Zhang liji ( material physics and chemistry ) directed by professor xie xiaoming this paper is intended to solve problems for those who are designing, using pbgas. failure mechanism, as well as cycles to failure of two groups of pbga samples ( with / without underfill ) for thermal cycling conditions in the range of - 40 ~ 125, were presented. the experiment shows that solder ball in the samples without underfill cracked after 500 times cycle, no crack was found in the underfilled samples even after 2700 cycles

    通過一系列的實驗，得到以下實驗結果： ?在本論文設定的溫度循環條件下，未充膠pbga樣品的熱疲勞品壽命在500周左右，充膠樣品的焊點壽命高於2700周； ?對于未充膠器件，中心距（ dnp ）是決定焊點應力、應變大小的最主要因素，裂紋總是從中心距較大處萌生並向中心處擴展； ?溫度循環的過程中焊盤附近焊料組織明顯粗化。
  9. However, the die cracking was dependent on the young ' s modulus and cte of underfill materials. due to the higher cte and lower

    山于薄型晶元在高密度封裝使用中越來越廣泛，本文的結果對高密度封裝設計有重要意義。
  10. 2. the die cracking with no - flow underfill was analyzed during cooling process from the curing temperature of underfill to the room temperature or to the lowest temperature ( - 55 ) in thermal cycle test

    近年來，不流動膠倒裝焊工藝己開始得到應用，但由於不流動膠的固化溫度比常規底充膠高，晶元在冷卻過程中將承受更大的熱應力。
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