互連線 的英文怎麼說
中文拼音 [hùliánxiàn]
互連線
英文
interconnecting wire-
Image method used for coplanar interconnects dependent parameter calculation
用鏡像電荷法求取共面互連線寄生參數The results indicate the stress of copper interconnects generates in the metallization and the thermal stress caused by thermal mismatch during the damascene process is the main stress. the thermal stress distribution in copper interconnects has been simulated by the finite element analysis software with the different trench structures
對測量結果的分析得出金屬薄膜的淀積是造成銅互連線中應力的主要原因，熱應力在銅互連線應力中占較大比例，熱處理后銅互連線中應力減小。The snam results of local stress distribution are in close agreement with the results of computer simulation
利用計算機模擬了溫度場變化引起的銅互連線中熱應力分佈。Studies on the stress of copper interconnects include the stress measurement by xrd, computer simulation and observation the local stress distribution with snam
利用薄膜應力測試分佈儀和xrd測量硅基銅膜及銅互連線薄膜宏觀應力。The electrical simulation compared the temperature and the current density distribution in copper lines with different width and barrier materials, the result indicating that the maximum temperature locates in the middle of the line and the 20 - degree obliquity is the most optimum one in the pore structure
在電學模擬過程中，對比了不同條寬和不同阻擋層材料下的互連線的溫度、電流密度分佈，以及不同通孔傾角下、不同阻擋層材料下的通孔的溫度、電流密度分佈。Interconnect wire delay questions in deep submicron ic design
深亞微米集成電路設計中的互連線延遲問題Transmitting noise is main interfereing source of switch power supply which is coupled through lines of power supply, singal, interlinkage and grouding
摘要傳導型噪聲是開關電源的主要騷擾源，它可以通過電源線、信號線、互連線、接地導體等進行耦舍。Interconnection dimensions become the limitation for new performance design while the size traditional transistor has met the demand of challenge. thus, the study of interconnection delay becomes more important for current circuit design and technology
為了提高ulsi的頻率特性，按比例縮小晶體管的特徵尺寸的努力受到了互連線本徵特性和寄生效應的限制，互連線的rc延遲成為ulsi進一步提高頻率特性的瓶頸。Consequently, the metal interconnects of vlsi have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes
作為vlsi互連線的金屬薄膜的截面積越來越小，其承受的功率密度急劇增加，使得電遷移成為電路的主要失效模式之一。The work of this paper is coming from the project of electronic science & technology research institute, university of electronic science and technology of china ? soc software - hardware co - verification platform. this paper gives emphasis to the design and implementation of soc software - hardware co - verification platform monitor - control system. simultaneously, the interconnection tests of soc software - hardware co - verification platform, the fpga fabrics interconnection test and fpga with i / o slots interconnection test, are presented
本論文主要圍繞soc軟硬體協同驗證平臺監控系統設計及其實現方法開展研究與討論，同時介紹了在對soc軟硬體協同驗證平臺進行測試過程中本文作者所做的「 fpga陣列互連線數量、連通性和數據速率測試」和「 fpga與i / o槽的互連線數量、連通性和數據速率測試」兩個測試項目方面的工作。Shielding area optimization under the solution of interconnect crosstalk
減小互連線串擾的屏蔽線面積優化As the technology advances into deep sub - micron era, crosstalk reduction is of paramount importance for signal integrity. simultaneous shield insertion and net ordering sino has been shown to be effective to reduce both capacitive and inductive couplings
隨著集成電路工藝發展到深亞微米技術，互連線串擾問題變得相當重要，它與互連線時延問題成為了決定電路性能的主要因素。Based on the model of the interconnect failure, taking the existence of defect into account, the influence of the open soft fault on the interconnect reliability is deeply studied, and a new lifetime model of interconnect is presented
本文從互連線失效的電遷移模型出發，考慮到缺陷存在時，由局域缺陷導致的開路軟故障對互連線可靠性的作用，給出了缺陷統計分佈情況下新的互連線壽命模型。An algorithm to resolve the coupling effect problem is proposed during the cross point assignment ( cpa ) stage. in the algorithm, the priority queue concept and the rip - up and reroute strategy are combined to control crosstalk noise caused by interconnect coupling capacitance. first, the nets are arranged into different priority queues according to their weighted sum of their length and criticality. then, the cpa problem for one queue of nets is translated into a linear assignment problem. after the assignment of one queue of nets, a post - cpa checking routine is performed to check and rip up the net pairs which violate the crosstalk noise constraint and then push them into the next queue to be reassigned. the algorithm is tested by a set of bench mark examples, and the experimental results are promising
提出了一種在過點分配階段解決噪聲耦合效應問題的演算法.該演算法採用優先隊列同拆線重布策略相結合的方法，控制由互連線耦合電容引起的串擾噪聲.演算法中，首先按照線長和約束限制，將線網劃分到若干個優先隊列中.然後，將每個優先隊列的過點分配問題轉換為線性分配問題.在完成一個線網隊列的分配后，通過過點分配后處理過程檢查串擾約束滿足情況，對違反約束的線網對進行拆除，放入后續線網隊列進行重新分配.實驗數據表明，該演算法能夠取得好的效果Abstract : an algorithm to resolve the coupling effect problem is proposed during the cross point assignment ( cpa ) stage. in the algorithm, the priority queue concept and the rip - up and reroute strategy are combined to control crosstalk noise caused by interconnect coupling capacitance. first, the nets are arranged into different priority queues according to their weighted sum of their length and criticality. then, the cpa problem for one queue of nets is translated into a linear assignment problem. after the assignment of one queue of nets, a post - cpa checking routine is performed to check and rip up the net pairs which violate the crosstalk noise constraint and then push them into the next queue to be reassigned. the algorithm is tested by a set of bench mark examples, and the experimental results are promising
文摘:提出了一種在過點分配階段解決噪聲耦合效應問題的演算法.該演算法採用優先隊列同拆線重布策略相結合的方法，控制由互連線耦合電容引起的串擾噪聲.演算法中，首先按照線長和約束限制，將線網劃分到若干個優先隊列中.然後，將每個優先隊列的過點分配問題轉換為線性分配問題.在完成一個線網隊列的分配后，通過過點分配后處理過程檢查串擾約束滿足情況，對違反約束的線網對進行拆除，放入后續線網隊列進行重新分配.實驗數據表明，該演算法能夠取得好的效果The mechanical simulation compared the stress distribution in copper lines and pore, with the result that the maximum stress locates in the corner
在力學模擬過程中，計算了銅互連線和通孔的熱應力的分佈。On the other hand, tddb experiments of copper interconnection have been taken to prove the performance improvement of interconnect by the use of low - k dielectric
試驗方面則進行了銅互連線的tddb試驗，來驗證低k介質對互連性能的改善。Studies on the microstructure of copper interconnects include the determination of grain size by afm and sem, the measurement of texture by xrd and ebsd, the evaluation of barriers by xps and aes
銅互連線的微觀結構的研究：通過afm 、 sem 、 tem等的分析方法對銅膜及銅互連線薄膜的晶粒尺寸進行了評價。Xrd analysis results reveal the electroplated copper film has strong cu { 111 } texture and cu { 111 } texture weakens after annealed. the cu { 111 } texture of copper film in trenches is obviously weaker than that of the blanket copper film
在沉積態銅膜存在較強的銅{ 111 }織構，熱處理以後銅膜的織構減弱，銅互連線溝槽中銅{ 111 }織構要弱於銅膜的銅{ 111 }織構。The results show the grain size becomes larger along with elevated temperature and the grain size in interconnects does not change evidently after annealed at 200 ? because of the effect of the trench structure
結果顯示熱處理后銅膜晶粒長大，但銅互連線薄膜由於溝槽結構對晶粒的長大有阻礙作用。利用xrd和ebsd測試方法對銅膜及銅互連線薄膜的織構進行評價。分享友人