子印製電路板 的英文怎麼說

中文拼音 [ziyìnzhìdiànlùbǎn]
子印製電路板 英文
daughter board
  • 子 : 子Ⅰ名詞1 （兒子） son 2 （人的通稱） person 3 （古代特指有學問的男人） ancient title of respect f...
  • 印 : Ⅰ名詞1 （圖章） seal; stamp; chop 2 （痕跡） print; mark 3 （姓氏） a surname Ⅱ動詞1 （留下痕跡）...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 板 : Ⅰ名詞1 （片狀硬物體） board; plank; plate 2 （專指店鋪的門板） shutter 3 [音樂] （打拍子的樂器） ...
  • 電路板 : accessory board
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment ; part 2 : transformers and inductors using yex - 2 laminations for printed wiring board mounting

    電信和電子設備用變壓器和電感器的外形尺寸.第2部分:印製線路板座用採用yex - 2薄片的變壓器和電感器
  2. Electronic assembly process planning, especially the pca ( print circuit assembly ) process planning concerns much skill and knowledge. to enhance the efficiency of process planning and to improve the condition of the process management, a knowledge - based capp ( computer aided process planning ) system was established in this paper

    電子裝配工藝設計，尤其是印製電路板組裝（ pca ）工藝設計是一項知識性、經驗性很強的工作，為提高電子裝配工藝編制效率、改善工藝管理狀況，本文建立了基於知識的電子裝配capp系統。
  3. Harmonized system of quality assessment for electronic components - sectional specification : flexible printed boards without through connections

    電子元器件質量評定協調體系.分規范.無貫通連接的柔性印製電路板
  4. Harmonized system of quality assessment for electronic components - capability detail specification : flexible printed boards with through - connections

    電子元器件質量評定協調體系.性能詳細規范:有貫通連接的撓性印製電路板
  5. Harmonized system of quality assessment for electronic components - capability detail specification : flexible printed boards without through - connections

    電子元器件質量評定協調體系.性能詳細規范:無貫通連接的撓性印製電路板
  6. Specification for harmonized system of quality assessment for electronic components - sectional specification : flexible printed boards with through connections

    電子元器件質量評定協調體系.分規范:帶貫通連接的撓性印製電路板
  7. Electronic components. two part and edge socket. connectors for printed board application

    電子元件.雙部件和棱形插座.印製電路板用連接器
  8. Harmonized system of quality assessment for electronic components : sectional specification : single and double sided printed boards with plated through holes

    電子元器件質量評定統一體系.分規范:具有鍍通孔的單面和雙面印製電路板
  9. Printed boards. electronic data description and transfer. part 7 : bare board electric test information in digital form

    印製電路板.電子數據的描述和傳送.第7部分:裸板數字格式的電試驗信息
  10. This paper also introduced an object - oriented knowledge management system. using the eakrl, capp system described in this paper implemented computer aided pca process planning, which includes the selection of the assembly method, the generation of process route, the automatically query of parameters of smt and tht operations

    運用面向對象的工藝知識的處理方法，本文中的電子裝配capp系統實現了印製電路板組裝工藝決策系統，包括安裝方法的自動選擇、工藝路線的生成以及表面貼裝、通孔插裝工序工藝參數的自動選擇。
  11. With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility

    隨著微電子產品（集成電路晶元、印刷電路板等）向著高密度、細間距和低缺陷方向發展，對其檢測技術在精密、高效、通用和智能化等方面提出了更高要求。由此，本文對微電子產品視覺檢測中的關鍵技術進行研究，彌補了傳統檢測在精確快速定位、圖像全景組合和精細缺陷檢測等方面的不足，最終完成基於機器視覺的微電子產品外形尺寸和缺陷檢測的理論研究和樣機研製，並進行了大量實驗證明其正確性和可行性，力圖為我國自主創新的微電子產品視覺檢測技術提供理論和實際借鑒。
  12. Specification for harmonized system of quality assessment for electronic components - example detail specification blank detail specification - two - part and edge socket connectors for printed board application

    電子元器件用質量評估協調體系.實例詳細規范空白詳細規范.印製電路板用二件式和邊緣插座連結器
  13. Blank detail specification : printed board assembly modular electronic units of assessed quality - capability approval ; german version en 160101 : 1998

    空白詳細規范.經質量評定的印製電路板組裝模塊電子裝
  14. Harmonized system of quality assessment for electronic components - capability detail specification : single and double sided printed boards with plated through holes

    電子元器件用質量評估協調體系.性能詳細規范:具有通孔的單面和雙面印製電路板
  15. Connectors for electronic equipment - part 4 : printed board connectors with assessed quality - sectional specification

    電子設備連接器.第4部分:有質量評定的印製電路板連接器.分規范
  16. Connectors for electronic equipment - part 4 - 001 : printed board connectors with assessed quality - blank detail specification

    電子設備連接器.第4 - 001部分:有質量評定的印製電路板連接器.空白詳細規范
  17. In addition, higher levels of cadmium, chromium, copper and other metals are also typically found in the sediment of typhoon shelters around victoria harbour. this contamination appears to be related to discharges between the 1960s and the 1980s from industries involved in electroplating and in the manufacture of printed circuit boards and electronics goods

    另外，維港避風塘沉積物的鎘鉻銅和其他金屬水平一般較高，這種情況與六十年代至八十年代電鍍廠印製電路板廠和電子廠的污染排放有關。
  18. Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid double - sided printed boards with through connections

    電子元器件質量評估協調體系.性能詳細規范:整體連接彎曲剛性雙面多層印製電路板
  19. Harmonized system of quality assessment for electronic components - sectional specification - flex - rigid multilayer printed boards with through connections

    電子元器件質量評定協調體系.分規范.柔性-剛性多層連接印製電路板
  20. Classification of shapes of electronic components for placement on printed wiring boards

    印製電路板布局用電子元件形狀分類
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