封裝器 的英文怎麼說

中文拼音 [fēngzhuāng]
封裝器 英文
packetizer
  • : Ⅰ名詞1 (服裝) dress; outfit; attire; clothing 2 (演員的化裝品) stage makeup and costume Ⅱ動詞...
  • : 名詞1. (器具) implement; utensil; ware 2. (器官) organ 3. (度量; 才能) capacity; talent 4. (姓氏) a surname
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Using an extension wrapper like swig see

    使用像swig這樣的擴展封裝器(請參閱
  2. The reason to cause this phenomenon is due to the change of electric field in the blue oled to induce the probality of the carrier shifted and the hole - electron recombination zone changed, which was a possible alternative to achieve color display. 3 ) device with the structure of ito / npb / adn : balq3 / alq3 / mg : ag was fabricated. when the balq3 dopant concentration was about 25 mol %, a high performance devcie with luminous efficiency of 1. 0 lm / w, the peak of emission spectrum at 440 nm, the cie coordinate at ( 0. 18, 0. 15 ), and half lifetime of unencapsulated device about 950 hrs was achieved

    導致本現象的原因是由於各有機層電場強度的變化影響了空穴和電子的隧穿幾率,從而導致載流子的復合區域發生改變而發出不同顏色的光; 3 )制備了結構為ito / npb / adn : balq3 / alq3 / mg : ag的藍光oled ,空穴阻擋材料balq3的摻入顯著影響了oled的光電性能,當balq3的摻雜濃度為25mol %時, oled的發光效率為1 . 0lm / w ,發光光譜的峰值為440nm ,色純度為( 0 . 18 , 0 . 15 ) ,未封裝器件的半衰期達到了950小時; 4 )在藍光材料adn中摻雜npb 、 balq3和tbp三種材料時,不僅改善了件的發光亮度和色純度,而且提高了件的發光效率和壽命。
  3. Test method for measuring the package attenuation coefficient of a sealed device for radioisotope hermetic test

    放射性同位素密試驗用封裝器殼衰減系數的測量方法
  4. A concise and readable ebnf - style wrapper

    一種簡明易讀的ebnf樣式的封裝器
  5. As you can see, the first thing the wrapper does is ensure that dev - state exists

    正如您所見,初始封裝器所做的第一件事就是確保/ dev - state存在。
  6. Subsequently, we can get the chip s - parameter by adding the negative equipment circuit of the parasitic parameters in the s - parameter model of packaged device

    之後,在有管殼封裝器件的s參數模型中,加上負的寄生參量的等效電路,即可得到管芯的s參數。
  7. For designing the microwave power amplifier formed by the chip of sige hbt more accurately, an novel method to extract chip s - parameter from s - parameter of packaged device with package is proposed

    為了更精確設計由sige異質結晶體管( hbt )管芯構成的微波功率放大,本論文提出了一種新穎的從管殼封裝器件的s參數中提取出管芯s參數方法。
  8. First we measured s - parameter of the device and package shell. the package shell and bonding wire are expressed with equipment circuit composed of the resistance, capacitance and inductance then acquired the value of component by optimizing using microwave emulation software ( microwave office )

    首先,測量出管殼封裝器件和管殼的s參數,把管殼和鍵合線均表示為由電容、電感、電阻組成的等效電路,再用微波模擬軟體( microwaveoffice )優化出元件數值。
  9. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中,往往會產生熱殘余應力以及焊接殘余應力,殘余應力的釋放作用及件在使用過程中的熱變形,會降低集成電路晶元與體的結合強度,進而降低集成電路的電性能,反復的熱循環,將導致件的熱疲勞失效,嚴重時可導致矽片或陶瓷片破裂,使整個件遭到破壞。
  10. This wrapper is designed to deliver the most common and also complicated features that ' s expected from the control but are not included ( standard with the control ) or are very difficult to implement

    這是樹形視圖控制項的一個封裝器,旨在發布最普通但也是復雜的功能,這些功能是這個控制項應該能具有的,但是它並不包括這些功能(這個控制項只具有標準功能) ,或者非常難于實現。
  11. Currently, the digital system is composed of a large amount of highly fine packeted ics, such as pgas, bgas, smts, and mcms

    如今的數字電子系統,大量地採用了諸如pga 、 bga 、 smt 、 mcm等高度封裝器件,使得pcb上各件之間的連線間距越來越細密。
  12. Low permeation ratio measurement through oled is very critical and there is no effective method to measuring the low permeation moisture rate of 1 10 - 6 g / m 2 / day, hence, the development of a moisture permeation measurement system would be very useful to help us understanding of permeation mechanisms and the device lifetime as well as degradation

    水汽通過oled的滲透率的大小對于oled的件壽命的研究非常重要,它的值一般要求達到1 10 - 6g / m2 / day ,但目前還沒有有效的測量方法測量如此小的值。因此,對水汽滲透率的測量系統的研究將對我們研究滲透的機理、件壽命等方面提供很大的幫助。
  13. Wrapper element provides an encapsulation of the metadata

    封裝器元素照常提供對元數據的
  14. Vivid creations offers com wrappers for the sax and dom apis to its xtl library that also serve as substitutes for msxml

    Vivid creations在它的xtl庫中提供了sax和dom api的com封裝器,該產品也是msxml的替代品。
  15. This wrapper provides the actual service implementation or acts as a proxy to the remote service

    封裝器提供實際的服務實現,或充當遠程服務的代理。
  16. Instead, special pieces of software inside the kernel called device drivers act as wrappers to these devices

    而稱為設備驅動程序的內核中軟體的特殊部分就充當這些設備的封裝器
  17. Instead, you can create wrapper methods to expose and transmit those numerical types as xsd : string using

    取而代之,您可以創建封裝器方法來公布並傳遞那些數值類型,如xsd : string (使用c #中的
  18. If your distribution installed the automount package, this step might be automated for you. in any event, your installation process is likely to have done some work for you to make mounting a cd - rom device easy. the examples in these steps refer to a suse linux sles8 system with kde desktop and a cd - rw drive mounted as media cdrecorder

    除了設置配置選項之外, tk封裝器還包括一個與tk text窗口小部件一起構建的滾動幫助框(一個帶有message窗口小部件的「關于」框)和一個進行tk動態幾何管理的歷史窗口。
  19. In short, this is what the init wrapper will do

    簡而言之,初始封裝器將做以下事情:
  20. Completing the conversion to devfs using an init wrapper

    使用init封裝器完成到devfs的轉換
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