封裝片 的英文怎麼說
中文拼音 [fēngzhuāngpiān]
封裝片
英文
case chip-
Analyzing and experimentally verifying the strain transducing characteristics of strain sensor. experiments tell that strain sensor capsulated by thin sheet metal can effectively transduce strain under certain mechanical robust with strain transducing efficiency of 97. 8 %, sensitivity of 83. 34 / kg, precision of 1. 64
實驗結構證明，用薄金屬片封裝的應變傳感器在保證一定機械強度的基礎上實現了應變的有效傳遞，應變傳遞效率可達97 . 8 % ，應變靈敏度為83 . 34 / kg ，精度為1 . 64 。This scheme firstly determined the operating mode of coded video stream in nal layer according to the current channel state before they were packed. the coded video stream operated under ssm in error - free channel so as to reduce the packing tradeoff and increase the coding efficiency. while in error - prone channel, they operated under dpm combined with improved unequal error protection ( uep ) scheme based on human eyes characteristic in order to elevate their robustness to channel error
該方案中編碼視頻信息在進行打包封裝前，首先根據當前通道狀態信息自適應地確定其在nal層中的工作模式，在無丟包通道中採用單數據片模式以降低編碼視頻流的打包開銷，提高編碼效率；而在丟包通道中採用數據分區模式以提高編碼視頻流對通道誤碼的魯棒性能，同時基於人眼視覺特性，提出了一種改進的uep策略。A novel package for microelectronics : wafer level package
圓片級封裝Using 3d max 4. 0 to do stereogram and three - dimensional animation, using photoshop 6. 0 to do the picture of background, button, icon, using cool edit pro 2. 0 to record commentary. using object - oriented multimedia development tool - visual basic 6. 0 to compose picture, image, animation text, sound. finally, using inno setup 3 to encapsulate software, making installation procedure
選用3dmax4 . 0製作三維立體圖和三維動畫，用photoshop6 . 0製作背景圖、按鈕、圖標，使用cooleditpro2 . 0錄制聲音，用面向對象的可視化多媒體開發工具visualbasic6 . 0將製作的圖片、圖像、動畫、文本、聲音進行合成，最後用innosetup3對軟體進行封裝，製作安裝程序。It is suited for : high - tech electronic parts and related products such as magnetic head, ic, lsi, optical fiber, semiconductor, electronic lead frame and etc, require high precision disc wheel with high precision, efficiency cutting and break molding
適用：高科技電子零件及相關產品，如磁頭ic lsi光纖半導體封裝品電子導線架等，要求高精度高效率切割切斷加工的高精密薄片砂輪。Lead - free solder bumping technology for wafer level package
圓片級封裝的無鉛焊料凸點製作技術研究Wafer bumping technology for wlp
圓片級封裝的凸點製作技術Specification of leadframes for plastic leaded chip carrier packages
塑料有引線片式載體封裝引線框架規范Chip carrier sockets for plastic quad flat packages for use in electronic equipment, blank detail specification for
電子設備用塑料方形扁平封裝用片式載體插座的空白詳細規范Detail specification for burn - in sockets for chip carrier packages with molded carrier rings for use with electronic equipment
電子設備用帶模壓載體環的片式載體封裝燒進插座的詳細規范Blank detail specification for burn - in socket for chip carrier packages with molded carrier rings for use in electronic equipment
電子設備用帶模壓載體環的片式載體封裝燒進插座的空白詳細規范It can be installed in horizontal or vertical. sealing gasket must be put on the connected, then equably tight the bolt
本閥可水平安裝或垂直安裝，安裝時兩法蘭連接中間必須加密封墊片，然後鎖緊螺栓。Fixed metalized polyethylene - terephthalate film dielectric chip capacitors for direct current - encapsulated, blank detail specification for
直流電用封裝的固定鍍金屬聚對苯二甲酸乙酯薄膜介質片狀電容器的空白詳細規范Packaging of winding wires ; part 3 : taper barrelled delivery spools ; section 3 : specification for non - returnable spools made from thermoplastic material
繞組線的封裝.第3部分:錐形供線盤.第3節:由熱塑性材料製成的不能回收使用的片盤規范Packaging of winding wires ; part 2 : cylindrical barrelled delivery spools ; section 2 : specification for returnable spools made from thermoplastic material
繞組線的封裝.第2部分:圓柱形供線盤.第2節:由熱塑性材料製成的可回收使用的片盤規范Packaging of winding wires ; part 2 : cylindrical barrelled delivery spools ; section 3 : specification for non - returnable spools made from thermoplastic material
繞組線的封裝.第2部分:圓柱形供線盤.第3節:由熱塑性材料製成的不能回收使用的片盤規范The chip is bonded to a stress isolating mechanical structure and sealed into an evacuated package
採用了隔離墊片和應力隔離支柱來減小封裝應力，完成了傳感器的真空封裝。Ultrathin wafer level chip size package technology
超薄型圓片級晶元尺寸封裝技術The valve can be installed in horizontal or vertical. add seal cushion between two flanges connection and screw down bolt
本閥可水平或垂直安裝，安裝時兩法蘭聯接中間必須加密封墊片，然後均勻鎖緊螺栓。Low assembly cost, suit for automatic thick film chip resistor or capacitor equipment
2 .可和現有厚膜封裝，片式電阻分享友人