封裝測試 的英文怎麼說

中文拼音 [fēngzhuāngcèshì]
封裝測試 英文
package test
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 測 : 動詞1. （測量） survey; fathom; measure 2. （測度; 推測） conjecture; infer
  • 試 : 名詞（古代占卜用的器具） astrolabe
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  • 測試 : test; testing; checkout; measurement
  1. An intelligent device for testing airtight products

    一種智能型密封性能測試裝置
  2. Test procedures for postal inserter

    郵政用封裝機測試規范
  3. E 2f - 8f ic assembly md testing plant

    地下2樓地上8樓ic封裝測試廠
  4. Test method for hermeticity of sealed devices by a radioisotope test

    同位素試驗法測定密封裝置的密封性
  5. Whole design on fully automatic testing - marking - taping machine for sot - 23 package

    23封裝全自動測試打標編帶機的總體設計
  6. China ' s domestic companies included 86 ic design companies : china integrated circuit design co., ltd., datang microelectronics, c * core, spreadtrum communication, lhwt, shenzhen state microelectronics, shenzhen zte ic design, hisense hiview tech., etc. ; 25 manufacturers : smic, huahong nec, hejian, china resources microelectronics, grace semiconductor manufacturing, csmc tech., asmc, etc ; 10 engaged in packaging and testing, such as nantong fujitsu, jiangsu changjiang electronics, tianshui huatian, 10 semiconductor equipment manufacturers : cetc no. 2 institute, cetc no. 48 institute, beijing sevenstar huachuang, institute of microelectronics of the chinese academy of sciences, institute of optics and electronics of the chinese academy of sciences etc. ; 37 semiconductor materials providers, including grinm semiconductor materials, heraeus zhaoyuan precious metal materials, etc

    國內參展商包括中國華大、大唐微電子、蘇州國芯、展訊通信、六合萬通、深圳國微、深圳中興集成電路、海信信芯科技等86家集成電路設計公司；中芯國際、華虹nec 、和艦科技、華潤微電子、宏力半導體、華潤上華、上海新進等25家主要集成電路製造企業；南通富士通、江蘇長電、天水華天等10家封裝測試企業；中電科技集團第2研究所、第48研究所、七星華創、中科院微電子所、中科院光電所等10家半導體設備企業；有研矽谷、賀利氏招遠等37家半導體材料企業。
  7. Several materials with large coefficient of expansion were selected to make packaging components, and it was found that the packaging materials have good temperature sensitivity and compatibility with optical fibers. experimental accuracy and repetition of fbg temperature sensitivity and compensation were discussed. have selected several materials which has bigger coefficient of expansion to do packaging components, have made many temperature experiments, there have not flaws, such as aging, crackle, absciss layer, packaging materials have good temperature sensitivity and compatibility with optical fiber ; have designed the simple and practical packaging components, have performed a serials of experiments about accuracy and repetition of fbg wave - length, have obtained the first step conclusion ; have analyzed the result and made comparison between the result of different experiment, have summarized the best packaging effect and several rules to reduce mistskes

    本文所做的主要工作包括以下幾個內容：一、選取了常見的熱膨脹系數大的材料製作封裝元件，經過多次一80到80反復測試，封裝元件沒有出現老化開裂、封裝裂紋、空洞、離層等缺陷，封裝材料具有良好的溫敏穩定性及復用性，與光纖相容性較好；二、對光纖光柵進行簡單、實用的封裝處理，就封裝效果的優劣性、波長測量的準確度、重復性和封裝時產生的波長損失等方面進行了一系列的實驗，得出了初步的結論；三、對溫敏和溫度補償式封裝的實驗數據進行了詳細的分析和對比，從數字上對溫變過程中光纖光柵中心波長的改變及溫變曲線進行了定量的分析，在大量實驗數據分析結果的基礎上，總結出哪種材料封裝效果更好，以及如何有效的減小實驗誤差。
  8. Abstract : in this paper, two tests are described on air leakage of sinter machine in 2 sintering plant of xiangtan iron and steel co. according to the test results, on the base of analysis and discussion, a series of measures on decreasing air leakage of sinter machine are putted forwored from sealed devices, lubricating oil system, maintenance and management etc. an effective and feasible way is supplied for energy saving and increasing production, decreasding production cost, increasing economy benefit of sintering process

    文摘:通過對湘鋼二燒燒結機漏風率的兩次測試和結果分析，從密封裝置、潤滑系統、附件結構的改進等方面提出了一系列降低漏風率的對策，為燒結工序的增產節能，降低生產成本，提高經濟效益提供了一條行之有效的途徑。
  9. Research and development on testing - marking - taping equipment for sot - 23 package

    23封裝測試打標編帶設備的研究
  10. Based on the historical space forecast data and corresponding actual data provided by a global semiconductor assembly and test company, the uncertainty of space planning was defined. during this analysis process, linear regression, grey prediction, neural network back propagation algorithm and confidence interval were applied, respectively, to define the uncertainty. compared with those methods, the confidence interval of historical space forecast error, calculated by mathematical statistics, was the reasonable method to define the space forecasting uncertainty

    本文從半導體工廠長期生產能力計劃的頂層即廠房生產面積的計劃展開，對一跨國半導體封裝測試公司提供的廠房生產面積的長期歷史預測數據以及對應的真實數據進行分析，採用線性回歸，灰預測，神經網路bp演算法，基於數理統計的置信區間的求解等方法分別定義廠房生產面積預測的不確定度，經多種方法的比較得出，基於數理統計方法求解出的生產面積歷史預測誤差置信區間能直觀清楚地標定不確定度。
  11. Amkor technology ' s mission is to be the world ' s premier semiconductor assembly and test services company through customer satisfaction, leading edge technology and financial performance

    安靠的使命是通過客戶的滿意度、先進的技術和財務表現成為世界領先的半導體封裝測試企業。
  12. The company ' s primary business is ic component packaging and test and memory module assembly

    公司的主要業務是集成電路封裝測試和內存模塊裝配。
  13. Ltd wtae was founded in september, 1998, md is located in me export processing zone in kaohsinng. the comply is a joint venture for hun hsin li - hua s semi - conductor operation, who owns 60 parcent of shins ; winbond electronics corp, who owns 15 polcent of stocks ; and a sub - comply of japan s teco, who has a 5 percent share in the company, with 26 billion nt in capital. it is a professional ic packaging and testing plant

    華東先進電子股份有限公司walton advanced electronics . ， ltd ， wtae ，成立於1998年9月，位於高雄加工出口區，由華新麗華旗下半導體事業華新先進60華邦電子15 %及日本東芝20 %三井物產5 %共同合資，總資本額26億元，為一專業ic封裝測試廠。
  14. With yulon ' s reputation and financial power, worldwide fab and assembly house ' s support, anachip is devoted to provide total ic solutions to serve our customers, and expect to reach a great operational result together

    藉由裕隆集團在企業界的聲望及財務奧援，與世界各地晶圓廠及封裝測試廠的配合，易亨電子將致力於提供客戶完整的集成電路方案，共同創造更亮麗的營運成果。
  15. The technology used in the hbt production process is extremely complex ; advanced wireless semiconductor is one of only three companies in the world that possess this technology the other two are both located in the us. unlike the situation with other silicon chip products, japanese and korean manufacturers have yet to master hbt technology

    德信科技成立於2001年，主要從事ic設計，並導入生產，生產過程中除晶圓代工和封裝測試是委外處理外，其餘皆由德信科技掌握，包括行銷。
  16. Smic ' s joint ventures, a testing and assembly facility in chengdu with utac and the manufacturing of on - chip color filters and micro lenses in shanghai with toppan, are also in production

    中芯國際和聯合科技在成都合資成立的封裝測試廠以及和凸版印刷在上海成立的合資企業，專注于生產製造芯載濾光片和微鏡頭均已投產。
  17. If you are interested in joining the world ' s top performing assembly and test services team, please send your application with detailed resume, the copy of language certificates and school transcripts to us

    如果你想加入在世界上名列前茅的封裝測試企業，請寄給我們你的簡歷、語言證書復印件和學校成績單。
  18. The study of wip control system in semiconductor assembly and test factory

    半導體封裝測試廠庫存控制系統的研究
  19. Capacity planning in semiconductor assembly and test manufacturing system

    半導體封裝測試系統的生產能力規劃
  20. Our company ' s registered capital is us $ 30 million, and total capital is us $ 90 million

    公司的「晶元封裝測試一期項目」被深圳市政府相關部門連續三年評定為重大投資建設項目。
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