封裝部件 的英文怎麼說

中文拼音 [fēngzhuāngbùjiàn]
封裝部件 英文
package parts
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 部 : Ⅰ名詞1 （部分; 部位） part; section; division; region 2 （部門; 機關或組織單位的名稱） unit; mini...
  • 件 : Ⅰ量詞（用於個體事物） piece; article; item Ⅱ名詞1. （指可以一一計算的事物） 2. （文件） letter; correspondence; paper; document
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  • 部件 : component; unit; parts; assembly; subsystem; secundina （pl. secundinae）
  1. The passing parts of this catena product all adopt fluorine plastics alloy to press, its headmost product of fluorine alloy centrifugal pumps, axis - envelop choose advanced outer - install form moire - pipe machine - airproof, airproof of oppositely abrade have silicon nitride chinaware f4 horniness alloy to choose

    本系列產品過流部件全部採用氟塑料合金模壓成型工藝製造，是國內生產的最早的一代氟合金離心泵產品，軸封選用先進的外裝式波紋管機械密封，對磨的密封面有：碳化矽陶瓷四氟硬質合金可供選擇。
  2. An isv may want to ship this as a redistributable component as part of their application

    Isv可能想要將這個封裝當做可轉散發元件來轉送，以作為其應用程式的一部分。
  3. Thirdly, the paper discusses the driver of the peripheral equipment, how to port the uc / os - n and uclinux, h. 323 protocol and the application of the system in the digital speech classroom. also some software and hardware measure are adopted to enhance the system stability. at last, the shortcoming and the something to be improved are given. dsp can be used to realize real - time speech coding algorithm, and after porting ( ac / os - n, arm can manage the keyboard, the lcd and the ethernet peripheral etc. then the embedded network system with specific purpose can be used in others fields, such as pda, set of top, web tv, ect

    在實際設計實現中，為提高系統軟、硬體整體穩定性和可靠性，使用了以下幾種方法： （ 1 ）低電壓復位、抗電源抖動能力、增加時鐘監測電路、抗電磁干擾能力、散熱等技術； （ 2 ）多層pcb設計，線路板結構緊湊，電源部分採用數字5v 、 3 . 3v 、 3v 、 1 . 8v和模擬5v多電源供電； （ 3 ）選用表面貼和bga封裝的器件； （ 4 ）按照軟體工程的要求進行系統分析，規劃系統框圖、流程分析、模塊劃分，減小了不同模塊的相關性，從而最大限度避免了錯誤的發生。
  4. Nuclear facilities - protection of metallic surfaces of structural parts from damage from assembly aids, gaskets, packings, packaging material and thermal insulating materials

    核設施.防止金屬部件表面受到組裝工具密封裝璜
  5. After the briefly present the origin and features of internet protocol version 6 ( ipv6 ), the paper detailedly introduced the conception, characters, security technologies of vpn, and main tunnel protocols used to implement and deploy vpns. after analyzing and comparing these technologies of realizing vpns, we choosed ipsec. then, the paper analyzed in the ipsec structure, function, work mode, and its components such as authentication header ( ah ), encapsulating security payload ( esp ), internet key exchange ( ike ), encryption and authentication algorithms, security association, security policy, and how they cooperate with each other in order to secure ip packages

    在簡要介紹ipv6協議的由來和優點之後，詳細闡述了虛擬專用網的概念、特點、安全技術及實現的關鍵隧道協議，通過對實現技術的分析比較，選用了安全性強大的ipsec隧道技術，接著深入研究了ipv6安全協議ipsec的體系結構、操作模式，詳細論述了ipsec協議簇的各個組成部分，如認證報頭ah協議、封裝安全載荷esp協議、密鑰管理ike協議、加密認證演算法、安全聯盟和安全策略等，以及這些組件之間如何協作，來共同實現對網路層ip數據包的安全保護。
  6. Components for containment enclosures - transfer systems such as plain doors, airlock chambers, double door transfer systems, leaktight connections for waste drums

    密封箱室部件.第3部分:轉運裝置如簡易門氣閘室雙開門用傳送系統和廢物桶密封連接件
  7. To study the influence of the field - emission cathode materials for the vacuum environment of the field - emission devices, ambipolar electrode configuration was designed in this paper. cnts / ptfe and cnts / epoxy composite materials were used as field - emission cathode and the two electrode configurations were encapsuled into a static vacuum system respectively. by contrastive testing, the field - emission properties

    3 .為了研究場發射陰極材料對場發射真空器件內部真空度影響的問題，設計二極電極結構，分別以碳納米管/聚四氟乙烯和碳納米管/環氧樹脂兩種復合材料作為場發射陰極，進行了真空封裝，製成了靜態的真空系統。
  8. Fibre optic interconnecting devices and passive components - basic test and measurement procedures - part 2 - 25 : tests - sealing endurance for closures

    光纖互聯裝置和無源部件.基本試驗和測量步驟.第2 - 25部分:試驗.終止閥的密封耐久力
  9. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  10. 5. no parts and components warranty will be delivered if customer or non - warranty - taker dismantles disassemble and adjusts parts, assembly of the diesel and components that are not allowed to be adjusted such as injection pump assembly lead sealing, and reassembles them within the warranty term, which however, fails to meet technology demand such as torque and advance angle of major bolts, resulting in failure and damage of relevant components, assembly and parts

    在保修期內，顧客或非承擔保修者拆卸解體調整柴油機的部件總成和規定不得調整的部位如噴油泵總成鉛封等，重裝后又未達到技術要求如重要螺釘的扭矩噴油提前角等，導致部件總成和相關聯零部件失效和損壞，由此涉及的零部件
  11. The stainless steel reaction vessel is composed of vessel cover, drum body, jacket, mixer, shaft seal actuating device and support, and the part of equipment which directly contacts with material all adopts

    我廠生產的電蒸汽導熱油加熱不銹鋼反應鍋由鍋蓋筒身夾套攪拌器軸封傳動裝置及支承等組成，與鍋內物料接觸處的鍋體和零部件均採用0cr18ni9或1cr18ni9ti不銹耐酸鋼板製成。
  12. This equipment is made up of kiln body, support device, supporting device with shelf, moving kiln head, sealing device for kiln tail, burning device and etc. parts

    該設備由筒體、支承裝置、帶檔輸支承裝置、傳動裝置、活動窯頭、窯尾密封裝置、燃燒裝置等部件組成。
  13. Has four main workshops for castings processing, steel parts processing, installation and debugging and spray painting. the company mainly produces plastic injection molding machines in more than ten specifications and models with injectioncapacity of45 - 2, 500g and mold clamping force of 500 - 5, 000kn. the major parts such as electric equipment as well as hydraulic and sealing parts all employ advanced imported products, which have greatiy improved the precision and stability of the plastic machines

    設有鑄件加工鋼件加工安裝調試噴漆四大車間，主要生產注射量45 - 2500g ，合模力500 - 5000kn共十幾種規格型號的塑料注射成型機電器液壓和密封件等主要部件均採用先進的進口件，使
  14. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  15. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  16. Steady state thermal analysis under natural convection boundary condition was performed. both the temperature distribution and the induced mechanical stress were calculated in this simulation. high stress area was found and the potential reasons which can cause packaging to fail were also discussed

    具體內容包括: 1 .建立一款疊層csp / bga封裝的三維實體有限元模型，求解自然對流條件下的穩態溫度場分佈，並在此基礎上進行穩態熱應力和熱應變分析，找出由於溫度梯度在封裝內部引起的高熱應力區域，分析其可能造成的失效結果。
  17. Fibre optic interconnecting devices and passive components - basic test and measurement procedures - part 2 - 38 : tests - sealing for pressurized closures of fibre optic devices

    光纖互聯裝置和無源部件.基本試驗和測量步驟.第2 - 38部分:光纖設備增壓閉路的密封試驗
  18. Full - sealed assembling capacitor is applied to ac power sys - tem 50 60hz with rated voltage of 6kv 10kv 35kv for improving power factor and quality of power grid, reducing transmission loss and raising the efficiency of transmission transformation faciliti - es. this type of capacitor has an assembling full - sealed struc - ture, and it is comprised of capacitor unit body, container, insula - ition cooling impregnant, outlet ceramic bushing, pressurereleas -

    額定電壓6kv 10kv及35kv的交流電力系統中用來提高功率因數改善電網質量，降低線路損耗，充分發揮輸變電設備效能。本產品為裝配式全密封結構。主要由器身波紋油箱絕緣冷卻油出線套管壓力釋放閥溫度控制器等部件組成。
  19. Bsp supplies the simple interface to operate the peripheral chips conveniently. thus, real - time operating system ( rtos ) can start up from the various hardware successfully and response to the asynchronous event opportunely. on the other hand, rsp implements the encapsulation to rtos and brings up the process model according to the running character of the business layer, realizes the secondary process schedule inside task

    一方面，支撐子系統bsp層（板級支撐包）的設計實現了對硬體層的封裝，這包括對cpu （ mpc8241 ）的封裝和對外部晶元（串口、網口等）的封裝，通過這層封裝使得實時操作系統能夠成功啟動，及時響應異步事件，實現了硬體的基本功能，並且為上層提供了簡單易用的操作晶元的介面，隔離了軟體對硬體功能要求所必需的具體細節。
  20. Enterprise application integration ( eai ) is now becoming the core of it technology, and it incorporates the existed application software of the enterprise, the buisness encapsulation application software, and the new codes written by general middleware, provides a new blue print with high competition which can boost the relation between the client and the provider up, and optimize the inner tenor and shorten the product ’ s market cycle

    企業應用集成（ eai ）正日益成為it技術的核心，它兼有企業已有應用軟體、商業封裝式應用軟體，以及由通用中間件編寫的新代碼的功能，提供一種極有競爭力的嶄新方案，可以增強客戶與供應商的聯系，優化內部進程，縮短產品的市場化周期。
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