掃頻檢驗 的英文怎麼說

中文拼音 [sǎobīnjiǎnyàn]
掃頻檢驗 英文
sweep check
  • 掃 : 掃構詞成分。
  • 頻 : Ⅰ形容詞（次數多） frequent Ⅱ副詞（屢次） frequently; repeatedly Ⅲ名詞1 [物理學] （物體每秒鐘振動...
  • 檢 : Ⅰ動詞1 （查） check up; inspect; examine 2 （約束; 檢點） restrain oneself; be careful in one s c...
  • 驗 : 動詞1. （察看; 查考） examine; check; test 2. （產生預期的效果） prove effective; produce the expected result
  • 檢驗 : checkout; test; examine; inspect; verify; survey; check;checking;testing;[英國]jerque（指檢查船舶...
  1. Based on that penetration depth of eddy current is theoretically different for different operationalfrequency, the flaw depth quantitive measurement method based on the characteristicalfrequency was expounded. to find the best testing model and position, it analysed and discussedthe factors which effected measurement. the mathematic relationship between the specialfrequencyand flaw depth was established to realize the accureate measurement of flaw depth. it primarily researched the technology of alternating current magnetic field leakage testing ( ac - mfl ) in our country

    在利用頻率掃描技術的基礎上，提出了基於拐點頻率的渦流檢測缺陷深度測量方法，對影響測量的多種因素進行了分析和實驗研究，得到了最佳的測試位置和測試方法，建立了拐點頻率和缺陷深度的定量關系，為深度的測量提供了新的途徑。
  2. Gamma knife lack of physiological experiment used in operations or electric stimulation check. so before curing it should be strictly examined by order of procedure as medical history collection, resonance scanning of magnetism, image video synchronization monitor electroencephalogram and ect comprehensive check to cautiously confirm the epilepsy and choose the right target

    伽瑪刀缺乏術中電生理驗證或電刺激檢查，因此，治療前更應嚴格按程序進行診斷檢查，如病史採集，磁共振掃描視頻同步監測腦電圖及ect等綜合檢查，謹慎地確定致癇灶和選擇合適的治療靶點。
  3. Bearings roller bearings and other components. bearing ring precision rolling production line ; a high - precision, super efficient grinding automatic production line ; bearing assembly line ; signal processing equipment ; blank processing equipment ; crowning roller grinder ; end - grinder ; coordinate precision grinder ;, cylindrical grinder ; surface grinder ; spherical roller processing equipment ; raceway grinder ; heat treatment ; needle processing equipment ; polishing processing equipment ; roller - seiki ; rolling auto - sorting machine parts bearing hardness sorting machine bearing cleaning equipment ; contact angle measuring instrument ; contour meter ; bearing life experimental device ; bearing packaging equipment ; roundness instrument ; dynamic vibration noise analyzer ; noise vibration test equipment ; printing machine measuring instrument ; roughness tester ; scanning electron microscope ; finish detector ; inverter ; spindle, wheel, whetstone and other grinding materials

    軸承套圈精密輾擴生產線高精高效磨超自動生產線軸承自動裝配線球加工設備毛坯加工設備凸度滾子磨床雙端面磨床高精度坐標磨床內外圓磨床平面磨床球面滾子加工設備溝道磨床熱處理生產滾針加工設備光飾加工設備滾道超精機滾動體自動分選機軸承零件硬度選別機軸承清洗設備角接觸測量儀輪廓測量儀軸承壽命實驗裝置軸承包裝設備圓度儀振動噪音動態分析儀振動噪音測試裝置印字機加工測量儀粗糙度測試儀掃描電子顯微鏡光潔度檢測儀變頻器電主軸砂輪油石和其他研磨材料
  4. Then the experimental data was analyzed in time domain and frequency domain. thirdly the hilbert translation method was used to detect the nonlinearity of the system. at last the model of this kind of system was identified, the result show that the theory model is the same format as the experiment model

    然後利用振動臺做掃頻試驗，對試驗數據在時域與頻域進行分析處理，利用hilbert變換檢測系統的非線性，分析系統的非線性特點，在此基礎上進行系統的模型識別，並將實驗建立的模型與理論模型進行比較。
  5. The relationship between sputtering conditions and the depositional speed shows : with working pressure 1. 2 pa, sputtering power 180w, the depositional speed of tio2 thin film is 40nm / h, and increases with the increasing of sputtering power. it can be also founded that the depositional speed is nearly proportional to the working pressure : within the range of 0. 3pa to 1. 6pa, the depositional speed increases linearly with the increase of ar pressure. with the enhancement of the substrate ' s temperature of sputtering or annealing, the resulted thin films show a tendency of decreasing in thickness, and increasing in refractivity

    本實驗是採用磁控濺射方法，在不同的溫度下制備了tio _ 2薄膜，並對薄膜進行了不同溫度和時間的退火處理，通過原子力顯微鏡（ afm ） 、 x射線衍射（ xrd ） 、掃描電鏡（ sem ）等檢測手段對薄膜的表面形貌和組成結構進行了分析，結果如下： （ 1 ）濺射工藝條件與薄膜沉積速度的關系表明：採用1 . 2pa工作氣壓， 180w的射頻功率tio _ 2薄膜的沉積速率為40nm h ，並隨射頻功率的增加而提高，呈近似的線性關系，在0 . 3pa 1 . 6pa氣壓范圍中，氬氣壓強升高沉積速率迅速增加，濺射溫度提高和退火處理能使薄膜的厚度減小和折射率提高。
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