晶元封裝 的英文怎麼說
中文拼音 [jīngyuánfēngzhuāng]
晶元封裝
英文
fcp-
The cracking with these two types of underfill might become unstable and lead to catastrophic failure at the end. the critical length was about 12m for the assembly with no - flow underfill and 20m for the package with capillary - flow underfill at 20 ?
模擬表明，山固化溫度冷卻到室溫時，所研究的倒裝焊封裝在填充不流動膠時晶元斷裂臨界裂紋長度為12pm ，而填充傳統底充膠時為20hm 。Flip chip will be a new method of packaging technology
倒裝晶元將成為封裝技術的最新手段According to the m1l - std - 883c standard of thermal cycle loading, the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
採用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡（ c - sam ）無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝晶元與底充膠界面分層裂縫傳播速率。Investigation of electroless nickel gold bump technology
晶元封裝技術的發展演變During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc
在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。In poor packages, too large stresses are formed, which often results in cracking of chips and delaminating at mounting interfaces
如若封裝不當，會使器件產生過大的熱應力，致使晶元破裂、封裝微裂、漏氣，導致器件失效。Finite element method ( fem ) was used to simulate thermal and vibration problems in stacked - die csp assembly. finite element models and apdl programes were built in ansys to conduct thermal, thermal - mechanical and vibration analysis. the aim of these researches were trying to find some possible reasons and trends which affect the reliability of stacked csp / bga assembly and give some useful suggestions for the packaging design
本論文正是針對以上情況，以採用引線鍵合工藝的三維疊層csp / bga封裝（裸晶元疊裝）為研究對象，在有限元分析軟體ansys中建立相關的有限元模型，編制了相應的apdl參數化分析程序，進行了溫度場分析、熱循環加載下的snpb合金焊點疲勞分析和實裝pcb板的振動模態分析。Design of motion control system with high speed and high precision positioning platform for ic package
面向晶元封裝的高速精密定位平臺控制系統設計The development of memory chip package technology
內存晶元封裝技術的發展It is proved that thermal fatigue is the main cause of the invalidity of the package. therefore, it is significant to research the reliability of solder ball under the thermal cycle
實踐證明熱作用是晶元封裝組件失效破壞的主導因素，因此熱循環條件下的焊點可靠性研究有著非常重要的意義。Development of cpu chip package technology
晶元封裝技術的發展演變The development of cpu chip package technology
晶元封裝技術的發展First, the paper discusses briefly the ic package technology, the reliability analysis methodologies and the current situation of the ic package
本文首先對晶元封裝及其可靠性分析方法及現狀進行了概述，並對相關理論方法作了介紹。Our company ' s registered capital is us $ 30 million, and total capital is us $ 90 million
公司的「晶元封裝測試一期項目」被深圳市政府相關部門連續三年評定為重大投資建設項目。The development of chip package technology
晶元封裝技術的發展演變Introduction of the chip package technology
晶元封裝技術介紹The advanced chip package technology
先進晶元封裝技術Other performance will be measured after the device is packaged
其它性能指標還需要在晶元封裝完成後作進一步的測量。Analysis and suppression of simultaneous switching noise in high - speed chip package
高速晶元封裝結構的同步開關噪聲分析及抑制New high speed and high precision planar positioning mechanism for chip packaging
面向晶元封裝的新型高速高精度平面定位機構研究分享友人