晶元焊接 的英文怎麼說

中文拼音 [jīngyuánhànjiē]
晶元焊接 英文
chip bonding
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 接 : Ⅰ動詞1 （靠近;接觸） come into contact with; come close to 2 （連接; 使連接） connect; join; put ...
  • 焊接 : weld; welding; soldering; seal; sealing; sealing-in; shutting together
  1. A novel flexible bumps technology for fc and wlp

    凸點晶元倒裝焊接技術
  2. During the course of the manufacture for packaging 2000 pixel hgcdte irfpa wafer, some crucial techniques are solved, such as the design of the button stem structures with inclined dragging wires applied in cryogenic platform, the optimization of long linear irfpa detector ' s signal wires layouts, the implement of a fanout board having thin film gold metalization for defining the required electrical conductors and a method of hermetically sealed vacuum enclosure of large dimension windows, etc

    在用於封裝2000元碲鎘汞焦平面晶元的分置式微型杜瓦研製中，詳細闡明了一種焦平面晶元其裝載面為斜拉式支撐結構的設計，實現了探測器外引功能線的布線優化及其輸出引線工藝改進，並提出了一種大尺寸高氣密光學窗口的焊接方法等關鍵技術。
  3. I talked to someone who did it, by taking apart and desoldering a usb to serial adapter to connect the kuro box s 3. 3 volt, inverted, serial signals to another chip that used these - and soldered the missing resistor onto the kuro box s motherboard

    我與某個曾經這樣做的人聊過，他將機器拆開，把usb拆換為串列適配器來將kuro box的3 . 3伏電壓串列信號反向連接到使用這些信號的另一個晶元並將缺少的電阻器焊接到kuro box的主板上。
  4. The main content is design of digital man - machine interface system, a speed regulating system of good stabilization and dynamic performance ; software for appraising the performance of wire feeder. the first, a digital man - machine interface system using at89s8252 singlechip is designed. the system uses sd7218a keyboard / display chip with serial bus interface

    首先，人機交互系統選用at89s8252為核心控制晶元，選用具有串列總線介面的sd7218a鍵盤/顯示晶元完成了數字化人機交互系統軟、硬體設計;採用rs - 485總線實現主控系統和人機交互系統的數據交互;系統採用數字編碼器和鍵盤配合的方式實現焊接參數的選擇和設定，同時還具有最優參數存儲、調用等功能。
  5. The selected pressure sensor in wide plus k1 series universal pressure transmitter, is a fully welding stainless steel structure which built - in solid pressure sensing chip with stainless steel isolation membrane

    Wideplus - k1系列通用壓力變送器選用的壓力傳感器，是一個內裝固態壓力敏感晶元的帶不銹鋼隔離膜片的全焊接不銹鋼體。
  6. However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper

    充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
  7. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  8. The maximal power outputs of 37. 0 mw / cm2 and 30. 0 mw / cm2 for the p - and n - type laminated materials respectively at the temperature difference 490 have been experimentally obtained, which are about 2. 5 and 3. 0 times those of - fesi2. chemical analyses show that the interface failure between the bridge alloy and the semiconductor bi2te3 results mainly from the eutectic mixtures with low melting point and brittle compounds formed during welding and long time annealing at 190. it is found that the electrical properties of a laminated structure are mainly controlled by the wettability of the bridge alloy on the semiconductor surface

    發現： 1 ）疊層材料具有明顯優于均質材料的熱電性能，在490溫差下， p -型和n -型疊層材料的最大輸出功率分別達到37 . 0和30 . 0 （ mw / cm ~ 2 ） ，是同類型均質- fesi _ 2的2 . 5和3倍； 2 ）在焊接過程和190長時間退火處理過程中，焊接過渡層合金和基體半導體（特別是bi _ 2te _ 3 ）之間存在明顯的元素相互擴散，從而在過渡層中形成一些低熔點共晶體和脆性化合物，這是導致疊層材料破壞的主要原因； 3 ）焊接過渡層合金與半導體基體之間的潤濕性是影響界面層電性能的主要因素。
  9. Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages

    完成某集成電路封裝（叩焊晶元）內部實際的電氣連接的焊料中的鉛。
  10. The conventional quadrants sensors mainly have 4 or 8 quadrants, which are not integrated with the signal processing circuits in one chip but are soldered with the discrete signal processing circuits. in this way, it ' s difficult to realize the micromation and system optimization of the devices. in addition, there are few number of photoelectric sensor parts in conventional quadrants sensors, which limits the targets information got from the conventional quadrants sensors

    傳統的硅象限傳感器主要採用四象限，八象限的結構，採用焊接的方式將分別製造的感光象限和電路結合在一起，不能實現感光象限與信號處理電路的單晶元集成，難以實現器件的微型化和系統優化；同時，傳統象限傳感器的感光象限單元數量較少，獲取的目標信息有限，難以實現對目標的坐標位置獲取、形狀識別等功能。
  11. It was found that the interfacial bonding of 93w - ofc was both the joining action of ofc / w grains and that of ofc / ni - fe binders, whereas the joining of ofc to tc4 could be seen as the mutual intense diffusion effect between ofc / tc4 and as a result cu - ti intermetallic compounds were formed at the joint. the joining of tc4 - a1 and a1 - mb2 were also attributed to the result of diffusion between elements ti - al and al - mg respectively. on the other hand, residual thermal stress and stress - induced distortion were produced at the joint simultaneously due to the difference in thermal expansion coefficient of different welding " materials

    研究表明， 93w與ofc的界面連接是ofc與93w中w晶粒的連接以及ofc與93w中ni - fe粘接劑的連接共同作用的結果； ofc與tc _ 4連接界面的形成是由於ofc與tc _ 4之間發生反應擴散，並由此在二者接頭處生成了cu - ti金屬間化合物的中間相； tc _ 4 - al的連接與al - mb _ 2的連接則分別是其基體元素ti 、 al之間和al 、 mg之間元素互擴散的結果，另外，由於熱膨脹系數的差異，擴散焊接后在不同焊件的接頭處存在殘余熱應力並由此引起接頭的形變。
  12. This thesis introduces the design of software & hardware as well as the detailed implement of the efw network card based on the arm7tdmi processor, including choosing the style of micro - processor, the style of nic chip, flash chip as well as sdram chip ; the design of integer electro - circuit ; the make of print board ; the jointing of apparatus and component ; and hardware debugging

    本文詳細介紹了一種基於arm7tdmi處理器的efw網卡的軟硬體設計及其具體實現。 efw硬體設計及實現主要包括微處理器選型， nic （ networkinterfacecard ）晶元選型， flash晶元以及sdram晶元選型;整體電路設計;印製板製作;元器件焊接以及硬體調試等工作。
  13. Along with microwave mixture ic is evolving toward the direction of high performance, high reliability, miniaturization, high uniformity and low cost, the demand to arts and crafts of chip joint is increasingly high

    摘要隨著微波混合集成電路向著高性能、高可靠、小型化、高均一性及低成本力向的發展，對晶元焊接工藝提出了越來越高的要求。
分享友人
分享到 Line

分享到臉書