晶元焊盤 的英文怎麼說
中文拼音 [jīngyuánhànpán]
晶元焊盤
英文
chip bonding pad-
Quick diathermancy avoid damage to cmos chip and solder. precise design and good technics avoid damage due to attrition. vacuumize avoid alterative because of oxygenation during transportation. antistatic plastic core
傳熱吸收快，盡可能的避免對晶元和焊盤的損壞;精確的設計和製造工藝避免磨擦對焊盤可能造成的損壞;真空包裝避免?品在運輸途中氧化變質;防靜電塑料芯;符合美國軍隊及國家宇航局各種標準The main content is design of digital man - machine interface system, a speed regulating system of good stabilization and dynamic performance ; software for appraising the performance of wire feeder. the first, a digital man - machine interface system using at89s8252 singlechip is designed. the system uses sd7218a keyboard / display chip with serial bus interface
首先，人機交互系統選用at89s8252為核心控制晶元，選用具有串列總線介面的sd7218a鍵盤/顯示晶元完成了數字化人機交互系統軟、硬體設計;採用rs - 485總線實現主控系統和人機交互系統的數據交互;系統採用數字編碼器和鍵盤配合的方式實現焊接參數的選擇和設定，同時還具有最優參數存儲、調用等功能。However, the die attach layer delaminated after 500 cycles and pcb cracked in the underfilled samples after long time cycling. c - sam is employed to investigate the delamination in the underfilled samples. highly concentrated stress - strain induced by the cte mismatch between the bga component and the pcb board, coarsened grain and two kinds of intermetallic compounds ( nisn / nisns ) which formed during reflow and thermal cycle and their impact on the reliability of solder joints are discussed in this paper
充膠樣品粗化尤為嚴重； ? ni - sn金屬間化合物包括兩層：其中，靠近ni焊盤的那層比較平整，同時， eds結果分析表明其化學式近似為nisn ，而靠近焊料的那層呈板條狀，化學式近似為nisn _ 3 ，文獻表明其為亞穩相； ?充膠使得樣品最大應力范圍降了接近一個數量級並降低了dnp的作用，同時，器件失效模式變為晶元粘接層分層； ? c - sam結果表明本論文採用的充膠樣品，晶元粘接層分層起始於500周左右，而經過2700周循環的樣品，分層幾乎擴展到整個界面。
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