晶片封裝 的英文怎麼說

中文拼音 [jīngpiānfēngzhuāng]
晶片封裝 英文
chip carriers
  • 晶 : Ⅰ形容詞（光亮） brilliant; glittering Ⅱ名詞1. （水晶） quartz; （rock） crystal 2. （晶體） any crystalline substance
  • 片 : 片構詞成分。
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 晶片 : chip; crystal plate; wafer
  • 封裝 : [半] package; potting; encapsulation; enclosure; packing; cladding; jacketing; encapsulating; pac...
  1. Ultrathin wafer level chip size package technology

    超薄型圓片級晶元尺寸封裝技術
  2. Wlcsp wafer - level chip scale packaging technology

    晶圓片級晶元規模封裝技術
  3. With the existing condition, the bar waveguide on the lithium niobate wafer with liquid phase proton - exchanged method has been fabricated and the benzoic acid is used as the proton source. a series of research on the domain inversion in lithium niobate crystal with proton - exchanged method have been done. and then the operation and the process of domain inversion in lithium niobate crystal with proton - exchanged method has been used

    實驗方面，利用實驗室現有條件，在鈮酸鋰晶片上以苯甲酸為質子源，用液相質子交換法製作了條形波導;對用質子交換法實現鈮酸鋰晶體疇反轉進行了一系列實驗研究，在此基礎上提出了質子交換法實現鈮酸鋰晶體疇反轉的工藝過程，實現了疇反轉並腐蝕得到了v型槽;設計製作了帶尾纖的電光相位調制器，最後進行封裝。
  4. Die bonder is a kind of microelectronics encapsulation device that welds transistors to the base. temperature control system is one important part of it

    粘片機是一種將晶源焊接到底座的微電子封裝設備，溫度控制系統是其較為重要的組成部分。
  5. Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics

    電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。
  6. The accelerometer which has simple fabricated process and high sensitivity and small parasitic capacitance and residual stress is hybrid integrated with the interface circuit using ic nude chip. so the density of the package is increased, and the noise of the sensing system is decreased. these found the base of capacitive accelerometer module using the mcm method

    該傳感器製作工藝簡單，靈敏度高，支撐梁採用u型，減小了刻蝕后的殘余應力，用玻璃作為襯底，減小了襯底和硅可動質量塊間的寄生電容，且把傳感器晶元和用ic裸片製作的介面電路集成在一起，提高了封裝密度，減小了傳感器系統的噪聲，為採用mcm技術製作電容式加速度傳感器模塊打下了基礎。
  7. Iso9001 and ccs china classification society have been approved. main products are 1g 3. 2g 11g 20g reverse osmosis water storage tanks ; carbon steel tanks stainless steel tanks flange air tank ; pressure vessel for ship ; 1. 8 0. 9stepper motor. we have the abilities of smt and wafer rank ddf pop

    主要產品有： 2g 3 . 2g 11g 20g鋼制逆滲透ro純水壓力桶碳鋼不銹鋼法蘭式儲氣罐船用壓力容器1 . 8和0 . 9的步進電機具有smt表面貼裝和晶片級ddf pop封裝能力。
  8. Ceramic substrate packaging, which has better heat resistance and withstand higher and lower temperature and compact

    採用陶瓷封裝，和矽晶晶片膨脹系數較接近散熱性能良好，耐高低溫與沖擊
  9. The transistor count is 3. 8 million ; the package is surface mount 240 - pin quad flat pack ( qfp240 ) ; and the die size is 98mm2 ; the most advanced research progress on microprocessor architecture is extensively studied to get technical preparations for microprocessor design

    該處理器目前正在進行後端設計，即將採用0 . 25 mcmos工藝流片，整個處理器的晶體管數目為380萬，封裝形式是qfp240 ， die面積為98mm ~ 2 。
  10. Tags essentially consist of a plain antenna bonded to a silicon chip and encapsulated inside a glass or plastic module

    標簽基本上是在一塊矽晶片上加裝簡單的天線，然後以玻璃或塑膠組件封裝。
  11. On the other hand, is a silicon wafer that a core resides on

    而晶元（ chip ）是將核心封裝起來的一塊矽片。
  12. Gfm series solar modules are made of high efficiency solar cells in series or in parallel, high transmission rate and low iron tempered glass, anti - aging eva and high flame resistant tpt by hotlamination, with andized aluminum alloy frame. products have high efficiency, long life, easy installation, high resistance against wind pressure and hail impact etc advantages

    Gfm系列太陽能電池組件由高效晶體硅電池片串並聯，用高透光率低鐵鋼化玻璃、抗老化eva和優良的耐火性tpt熱壓密封而成，外加陽極化優質鋁合金邊框，具有效率高、壽命長、安裝方便、抗風、抗冰雹能力強的特性。
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