最低能力測驗 的英文怎麼說
中文拼音 [zuìdīnénglìcèyàn]
最低能力測驗
英文
minimum competency test- 最 : 副詞(表示某種屬性超過所有同類的人或事物) most; best; worst; first; very; least; above all; -est
- 能 : 能名詞(姓氏) a surname
- 力 : Ⅰ名1 (力量; 能力) power; strength; ability; capacity 2 [物理學] (改變物體運動狀態的作用) forc...
- 測 : 動詞1. (測量) survey; fathom; measure 2. (測度; 推測) conjecture; infer
- 驗 : 動詞1. (察看; 查考) examine; check; test 2. (產生預期的效果) prove effective; produce the expected result
- 能力 : ability; capacity; capability
- 測驗 : test; trial run; examination; testing
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Then the coupling beams with new reinforcement layout were made an inquiry into, and the improvement on the seismic behavior by coupling beams diagonally reinforced with a few rows in end regions was found out at last, based on the observations of the experimental phenomena and the analysis of the measurement result, and by the comparison of seismic behavior by making use of hysteretic response, ductility and energy dissipation behavior, a conclusion is presented : the code for design and construction of reinforced concrete high - rise structures ( the draft asked for advise hi 2000 ) ca n ' t ensure that the coupling beams have fairly good seismic ductility ; the result of improvement of the seismic ductility of the coupling beams by the increase hi stirrups besides the strengthen of longitudinal detailing reinforcement was n ' t obvious ; the coupling beams diagonally reinforced with a few rows in end regions have fairly good mechanisms, and the ductility and the behavior of energy dissipation are better than conventionally reinforced concrete coupling beams, so it is suitable to te tised in short coupling beams
本文通過對三根小跨高比(均為l h = 1 . 0 )剪力墻洞口連系梁在低周反復荷載作用下的試驗,了解了嚴格按《鋼筋混凝土高層建築結構設計與施工規程》 ( 2000年徵求意見稿)設計的連梁具有的抗震性能,研究了採取增大連梁配箍量同時加強縱向構造筋的方案對抗震性能的影響,並進一步對新的配筋形式的連梁進行了探討,了解了在連梁梁端配置多排交叉斜筋方案對連梁抗震性能的改善。通過對試驗現象的觀察和量測結果的分析,利用荷載?位移滯回曲線、延性和耗能性能等指標對各個試件的抗震性能進行了比較,最後得出結論: 《鋼筋混凝土高層建築結構設計與施工規程》 ( 2000年徵求意見稿)不能保證小跨高比連梁具有較好的抗震延性:通過增大連梁配箍量同時加強縱向構造筋的方案對改善連梁的抗震延性的效果不太明顯;梁端配置多排交叉斜筋的連梁具有相對較好的受力性能,其延性和耗能性能等各項性能指標均優于普通配筋連梁,宜在深連梁中採用。With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility
隨著微電子產品(集成電路晶元、印刷電路板等)向著高密度、細間距和低缺陷方向發展,對其檢測技術在精密、高效、通用和智能化等方面提出了更高要求。由此,本文對微電子產品視覺檢測中的關鍵技術進行研究,彌補了傳統檢測在精確快速定位、圖像全景組合和精細缺陷檢測等方面的不足,最終完成基於機器視覺的微電子產品外形尺寸和缺陷檢測的理論研究和樣機研製,並進行了大量實驗證明其正確性和可行性,力圖為我國自主創新的微電子產品視覺檢測技術提供理論和實際借鑒。
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