氣相淀積 的英文怎麼說

中文拼音 [xiāngdiàn]
氣相淀積 英文
gas deposition
  • : Ⅰ名詞1 (氣體) gas 2 (空氣) air 3 (氣息) breath 4 (自然界冷熱陰晴等現象) weather 5 (氣味...
  • : 相Ⅰ名詞1 (相貌; 外貌) looks; appearance 2 (坐、立等的姿態) bearing; posture 3 [物理學] (相位...
  • : Ⅰ動詞(沉澱) form sediment; settle; precipitateⅡ名詞(淺的湖泊, 多用於地名) shallow lake
  • : Ⅰ動詞(積累) amass; store up; accumulate Ⅱ形容詞(長時間積累下來的) long standing; long pending...
  • 氣相 : gas phase
  1. The higher value is comparable to those obtained in cvd epitaxy.

    這個高的數值可以和從化學氣相淀積外延得到的數值比擬。
  2. In contrast to the cvd process, mbe does not require the extensive safety precautions, although solid arsenic dopant must be handled carefully.

    和化學氣相淀積工藝反,雖然在操作中對于固體砷還是必須非常小心掌握,但是,分子束外延不需要龐大的安定保險裝置。
  3. So we applied low temperature techniques to manufacture the sense film of qcm sensors. at low temperature and low pressure, with n - butylamine as the carbon source material, and with dry hydrogen as the carrying gas, we applied r. f. glow discharge plasma to preparation the working film for the qcm sensors

    在「實驗與分析」一章中較為詳細地闡述了採用等離子體化學氣相淀積的方法,以正丁胺作為碳源物質,通過射頻輝光放電在低溫低壓條件下制得了正丁胺等離子體膜。
  4. Particulates can emanate from process equipment (e. g., in cvd and etch reactors)as well as from humans (from street clothes, skin flakes, etc. )

    塵粒也能由工藝設備(如化學氣相淀積和刻蝕反應器)以及工作人員(身穿的外套,體表的皮屑等)而產生。
  5. Chemical vapour deposition

    和化學氣相淀積
  6. Generic specification of low pressure chemical vapor deposition system

    低壓化學氣相淀積設備通用技術條件
  7. Sige simox ; 3. sige smart - cut and behavior of sige / si he terostructure implanted with hydrogen. sige film preparation : sige films were grown on silicon substrate using solid source molecular beam epitaxy ( ssmbe ), gas - solid source molecular beam epitaxy ( gsmbe ) and ultra high vacuum chemical vapor deposition ( uhvcvd ) technologies

    Sige薄膜生長方面:在熟悉各種薄膜外延技術的基礎上,採用了近年來發展較為成熟的固態源分子束外延( ssmbe ) 、-固態源分子束外延( gsmbe ) 、超高真空化學氣相淀積( uhvcvd )三種sige薄膜外延技術,在硅( 100 )襯底上外延生長了sige薄膜。
  8. In this paper, the growth technology is presented for epitaxial silicon carbide films on sapphire with a buffer layer by atmospheric - pressure chemical vapor deposition ( apcvd ) process. the effect of temperature and precursors flow rates on the growth of silicon carbide films by chemical vapor deposition is analyzed. the structural properties of the films grown on sapphire compound substrate are studied by x - ray diffraction ( xrd ), x - ray photospectroscopy ( xps ) and photoluminescence spectroscopy

    本論文提出了在藍寶石上引入一層緩沖層材料形成復合襯底,採用常壓化學氣相淀積( apcvd )方法在其上異質外延生長sic薄膜的技術,分析了cvd法生長sic的物理化學過程,通過實驗提出sic薄膜生長的工藝條件,並通過x射線衍射( xrd ) 、 x射線光電子能譜( xps ) 、光致發光譜( pl譜)和掃描電鏡( sem )對外延薄膜的結構性質進行分析。
  9. 4. investigation are made into preparations of thin gate - oxides for strained si channel mosfet ’ s using pecvd at 300 and low - temperature ( 700 ? 800 ) thermal oxidation, respectively

    4 .分別對300 c下採用等離子體增強化學氣相淀積( pecvd )和700 ~ 800 c下採用熱氧化技術制備sigehmos器件柵介質薄膜進行了研究。
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