混成集成電路 的英文怎麼說
中文拼音 [húnchéngjíchéngdiànlù]
混成集成電路
英文
hybrid- 混 : 混形容詞1. (渾濁) muddy; turbid2. (糊塗; 不明事理) foolish; stupid
- 成 : Ⅰ動詞1 (完成; 成功) accomplish; succeed 2 (成為; 變為) become; turn into 3 (成全) help comp...
- 集 : gatherassemblecollect
- 電 : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
- 路 : 1 (道路) road; way; path 2 (路程) journey; distance 3 (途徑; 門路) way; means 4 (條理) se...
- 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
- 電路 : [訊] circuit (ckt); electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
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Development of hybrid integrated circuit of high linearphase - locked frequency discriminator
混合集成電路高線性鎖相鑒頻模塊的研製Cpk study of bonding process in hic production
混合集成電路鍵合工序能力指數探索Hic hybrid integrated circuit igniter unit
混合集成電路點火裝置Porcelain enameled steel substrate for hybrid integrated circuits
混合集成電路用被釉鋼基片A study on bonding strength of hybrid integrated circuits
功率混合集成電路鍵合強度控制研究Hybrid integrated circuits. detail specification for type hchf01 frequency differencing and channel seperation
混合集成電路. hchf01型差頻和上下分離電路詳細規范Hic has been the important technical channel for realizing the small - scale, multi - functional, high - performance, highly reliable military electric equipment, for hic make good use of high - integration, high - speed and other characters of sic, and formed a new - generation advanced microelectronic assembly technique
混合集成電路( hic )充分利用半導體集成電路( sic )高集成度、高速等特點,形成新一代高級的微電子組裝技術,並已成為實現軍用電子裝備小型化、多功能化、高性能化、高可靠性的重要技術途徑。Hybrid integrated circuits detail specification for type hda030 linear 12 bit digital to analog converter
混合集成電路. hda030型線性12位數字模擬轉換器詳細規范Film and hybrid integrated circuits - part 2 : internal visual inspection and special tests ; german version en 165000 - 2 : 1996
薄膜和混合集成電路.第2部分:內部目視檢查和特殊試驗Hybrid integrated circuits detail specification for type hmsf - 600 power filters
混合集成電路hmsf - 600型電源濾波器詳細規范Hybrid integrated circuits detail specification for type hpa2753 pwm power amplifiers
混合集成電路. hpa2753脈寬調制功率放大器詳細規范Our company develops advanced function devices including hybrid integrated circuits, power integrated circuits and dc dc converters for communications equipment
開發混合集成電路功率集成電路和通信器材用dc dc轉換器等高性能器件。Transmit / receive ( t / r ) modules is the base of the modern radar. the paper puts forth a design scheme according to the target including t / r switch, up conversion, power amplified, low noise receive and down conversion. the dimension is restricted to 106 89mm through scheme comparison and the existing experiment condition, the final products arrive at the target we expect with millimeter hybrid integrated circuit
收發t / r組件在當今雷達系統中佔有舉足輕重的地位,本文根據設計指標提出了毫米波前端的設計方案,系統功能上要求完成收發雙工、上變頻和功率放大、低噪聲放大和下變頻功能,外形尺寸為106 89mm ,通過綜合方案比較,結合自身條件,選取了毫米波混合集成電路形式。The qml manufacturer, the production line and the actual state of the semiconductor devices latest announced by dscc are introduced here
本文介紹了美國國防部供應中心最新公布的半導體器件(分立器件、混合集成電路、單片集成電路) qml廠商、生產線以及產品的實際狀況等。With the development toward sub - micron and deep sub - micron technologies, cmos will have extremely wide market prospects, because its low cost and easy of implementation. hence all the simulation of this paper uses the csmc 0. 6 m standard cmos process
標準cmos工藝作為數模混合集成電路的主流工藝,隨著cmos技術的發展,具有廣泛的市場前景,本文就是在在csmc0 . 6 m標準cmos工藝庫下進行模擬的。Abstract : abstract : by analyzing the design principle of the shear strength test method for chips of semiconductor devices, it is conchuded that the chip quality is the basis for the determination of chip shear strength criterion, which in turn is the shear strength criterion for passive components in hybrid circuits
摘要:摘要:通過對半導體器件的晶元剪切強度試驗方法設計原理的分析,得出晶元質量是設定晶元剪切強度的依據,並以此作為混合集成電路中無源元件的剪切強度判據。Hybrid integrated circuits. detail specification for type hrv013 voltage reference, multichannel
混合集成電路. hrv013型多路基準電壓源詳細規范Shenzhen clip electronic co., ltd. is a high - tech enterprise specializing in the production of electrical connectors and various precision connectors, lcd liquid crystal display terminals, lead frame, hybrid ic integrated circuits terminals, and other precision electronic components
深圳格力浦電子有限公司是深圳市高新技術企業,專業生產通訊手機計算機等各類精密連接器,液晶顯示屏端子光電子器件,混合集成電路端子和精密電子零部件。Hybrid integrated circuits detail specification for type hca2 charge amplifiers
混合集成電路hca2型電荷放大器詳細規范Film and hybrid integrated circuits - part 4 : customer information, product assessment level schedules and blank detail specification ; german version en 165000 - 4 : 1996
薄膜和混合集成電路.第4部分:客戶信息產品評估等級分享友人