混成電路 的英文怎麼說

中文拼音 [húnchéngdiàn]
混成電路 英文
hybrid circuit
  • : 混形容詞1. (渾濁) muddy; turbid2. (糊塗; 不明事理) foolish; stupid
  • : Ⅰ動詞1 (完成; 成功) accomplish; succeed 2 (成為; 變為) become; turn into 3 (成全) help comp...
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : 1 (道路) road; way; path 2 (路程) journey; distance 3 (途徑; 門路) way; means 4 (條理) se...
  • 電路 : [訊] circuit (ckt); electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Development of hybrid integrated circuit of high linearphase - locked frequency discriminator

    合集高線性鎖相鑒頻模塊的研製
  2. Film and hybrid integrated circuits. hermetic packages

    薄模和合式集.密封外殼
  3. Cpk study of bonding process in hic production

    合集鍵合工序能力指數探索
  4. Hic hybrid integrated circuit igniter unit

    合集點火裝置
  5. Hybrid microcircuits. film deposit resistive integrated circuits. general requirements

    合微.薄膜附著阻集.一般要求
  6. Porcelain enameled steel substrate for hybrid integrated circuits

    合集用被釉鋼基片
  7. A study on bonding strength of hybrid integrated circuits

    功率合集鍵合強度控制研究
  8. The circuit is used in high resolution resistance measuring. the coupled chaotic circuit array composed of this circuit is researched by computer simulation and circuit experiment. results show that, it is feasible to improve the stability of orders of chaotic systems and reduce noise in measuring by coupling

    最後,對以這種單源驅動的為基本單元所構的耦合沌陣列在提高系統輸出的穩定性和抑制噪聲作用方面,進行了計算機模擬研究和實際的實驗研究,結果顯示通過耦合的方式,可以將信號檢測的精度提高近一個數量級。
  9. Hybrid integrated circuits. detail specification for type hchf01 frequency differencing and channel seperation

    合集. hchf01型差頻和上下分離詳細規范
  10. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - generic specification

    半導體器件.集.合集和薄膜結構.生產線認證.總規范
  11. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - blank detail specification

    半導體器件.集.合集和薄膜結構.生產線認證.空白詳細規范
  12. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - procedure for qualification approval

    半導體器件.集.第23 - 5部分:合集和薄膜結構.生產線認證.合格鑒定規程
  13. Semiconductor devices - integrated circuits - part 23 - 5 : hybrid integrated circuits and film structures ; manufacturing line certification ; procedure for qualification approval

    半導體器件.集.第23 - 5部分:合集和薄膜結構.生產線認證.鑒定批準
  14. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - manufacturers ' self - audit checklist and report

    半導體器件.集.合集和薄膜結構.生產線認證.生產商自審清單和報告
  15. Semiconductor devices - integrated circuits - hybrid integrated circuits and film structures - manufacturing line certification - internal visual inspection and special tests

    半導體器件.集.合集和薄膜結構.生產線認證.內部目視檢查和特殊試驗
  16. Semiconductor devices - integrated circuits - part 23 - 2 : hybrid integrated circuits and film structures ; manufacturing line certification ; internal visual inspection and special tests

    半導體器件.集.第23 - 2部分:合集和薄膜結構.生產線認證.內部審查和特殊試驗
  17. Hic has been the important technical channel for realizing the small - scale, multi - functional, high - performance, highly reliable military electric equipment, for hic make good use of high - integration, high - speed and other characters of sic, and formed a new - generation advanced microelectronic assembly technique

    合集( hic )充分利用半導體集( sic )高集度、高速等特點,形新一代高級的微子組裝技術,並已為實現軍用子裝備小型化、多功能化、高性能化、高可靠性的重要技術途徑。
  18. Semiconductor devices integrated circuits part11 : section 1 : internal visual examination for semiconductor integrated circuits excluding hybrid circuits

    半導體器件集第11部分:第1篇:半導體集內部目檢不包括
  19. Harmonized system of quality assessment for electronic components - semiconductor devices - integrated circuits - sectional specification for semiconductor integrated circuits excluding hybrid circuits - internal visual examination for semiconductor integrated circuits excluding hybrid circuits

    子元器件質量評估協調體系.半導體器件.集.不包括的半導體集分規范.不包括的半導體集分規范.不包括的半導體集的內目測檢驗
  20. Film and hybrid integrated circuits ; materials, methods for the assessment of conductive pastes

    薄膜和合式集.第7部分:材料導糊劑的評價
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