焊錫面 的英文怎麼說

中文拼音 [hànxímiàn]
焊錫面 英文
solder side
  • 焊 : 動詞（用熔化的金屬修補金屬器物或使金屬工件連接起來） weld; solder
  • 面 : Ⅰ名詞1 （頭的前部; 臉） face 2 （物體的表面） surface; top 3 （外露的一層或正面） outside; the ri...
  1. During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure

    在下一個迴流工序，錫膏浸潤焊盤表面，形成一個固態錫膏凸起。
  2. Lead - free solder and conducting resin packaging technology involved in lead - free packaging are analyzed. the technological differences between the traditional tin - lead welding and lead - free welding are also described. finally, some technical difficulties in promoting lead - free packaging technology are presented

    從無鉛組裝的角度出發，詳細分析了無鉛組裝技術涉及的無鉛焊料和導電膠組裝技術，闡述了傳統的錫鉛焊接與無鉛焊接的工藝差異，提出了該技術要推廣應用所面臨的技術難點。
  3. Thermosetting powder coating of low - temperature curing type is a newly - developed powder coating which is used on the things that are not suitable for high - temperture baking. this type of powder coating opens up wider application by lowering curing temperature to 108 - 130. it can be used for surface coatings on such things as flaw detectors, auto water tanks, springs, electrical appliances with coils, instruments, equipment with tin welding seams. it can also be used on the products made of aluminum and magnesium materials, glass, plastics and wood etc

    低溫固化型粉末塗料是針對那些不宜高溫烘烤的產品，而最新研製的新品種，它不僅具備一般粉末塗料的特徵，而且可以把固化溫度降低到108 - 130 ，從而拓寬了粉末塗料的應用領域；適用於擦傷機械、汽車水箱、發動機、彈簧、線圈電器、儀器儀表、錫焊條接縫設備、鉛鎂材質、玻璃、塑料、木材等製品的表面塗裝。
  4. Solder bar is made from high purity metal. by means of strict qualitg control the oxide and metallic and non - metallic impnrities and effectively minimized, the available high purity solder bar is with uniform and glazed surface good wetting and spreading ability after molten bright joint and minimum oxide residue after soldering. our product is suitable for wave and handwork soldering with high quality requirement

    本公司生產焊錫條採用高純度金屬原料，在嚴格品管條件下，有效控制氧化程度以及金屬和非金屬雜質含量，焊錫條表面均勻光滑，純度極高，熔化后流動性好，潤濕性極佳，焊點光亮，氧化渣物極少發生，適用於高品質要求的各種波峰焊和手工焊。
  5. Industries with particularly high potential exposures include : construction work involving welding, cutting, brazing or polishing on lead surfaces and application of lead solder ; most smelter operations either as a trace contaminant or as a major product ; secondary lead smelters where lead is recovered from batteries ; and firing ranges

    有機會接觸鉛的工作包括：在建築業中，在含鉛的表面上進行焊接切割鍍焊或打磨粉飾以及使用鉛錫作焊接在采礦業中，提煉鉛或其他元素的工種在回收業中，把電池中的鉛再循環利用以及彈藥製造工作。
  6. Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly

    在表面貼裝裝配的迴流焊接中，錫膏用於表面貼裝元件的引腳或端子與焊盤之間的連接。
  7. ( 3 ) the most principal factors that influence the supersonic atomization process include the flow ratio of the gas - liquid metal ( gmr ) value, the flow of atomizing of gas and the range of the inverse vortex taper. the more of the value of three factors, the more advantage they are for the atomization and the more fine the powders are. ( 4 ) the produced powders are the best in efficient atomization efficiency, particle diameter, particle shape and dispersion when the solder alloy is zhl63a, atomizing medium is n2, the protrusion h = 6. 0mm, atomizing gas pressure p = 100mpa, over - heat temperature t = 167 ( t = 350 )

    研究結果表明： （ 1 ）超音速霧化器的氣體流場在導液管下端形成一個倒渦流錐，在二維空間上呈軸對稱的雙峰分佈，負壓形成於這個倒渦流錐內； （ 2 ）修正後的霧化氣體速度公式可以滿足超音速霧化的要求； （ 3 ）影響超音速霧化工藝最根本的因素有氣液質量流率比（ gmr ）的大小、霧化氣體流量和倒渦流錐范圍，三個因素的值越大，對形成細粉越有利； （ 4 ）在焊錫合金為zhl63a ，霧化介質微n _ 2 ，導液管突出高度取h = 6 . 0mm ，霧化氣體壓力取p = 1 . 0mpa ，合金過熱度取t = 167 （ t = 350 ）時，所制得的粉末在有效霧化率、顆粒球形度、粒度及其離散度三個方面綜合性能最好。
  8. In basis of integer bush, the flange bush adopt high speed friction jointing, the materil are alluse 10 steel bracking, the surface sinter cupbsn 10 - 10tin and copper powder, have enough carrying capability and longer using life, not easy to flake off. suitable for engineer mechanism, panzer, train, pile driver, take the place of bronze cover, save the costs greatly, make the useful life longer

    翻邊軸套在整體軸套的基礎上，採用高速磨擦焊接製作而成，材料全部採用以10井鋼背為基礎，表面燒結cupbsn10 - 10錫青銅粉，具有承載能力大，使用壽命長，不容易脫落等優勢，主要適用於工程機械，坦克，火車，打樁機上，以替代原來的青銅銅套，大大節約了成本，延長了產品的使用壽命。
  9. No white power occurring on soldered surface or surface of the components, no moisture absorption

    焊錫表面和零件面無白粉產生、無吸濕性。
  10. Solder side up

    焊錫面朝上
  11. For right - angle side insert slot x3 and stand type insert slot x1, size : 26. 7 x 9. 2 cm

    右插型slot x3直立式slot x1 ;介面卡從右邊焊錫面朝上或上方插入擴充卡，
  12. For right - angle side insert slot x 3 and stand type insert slot x 1, size : 18. 2 x 10 cm

    右插型slot x 3直立式slot x 1 ;介面卡從右手邊焊錫面朝上或上方插入擴充卡，
  13. Smd environmental testing : tests - test : test methods for solderability of surface mounting devices by wetting balance using lead - free solder paste

    環境試驗:試驗.試驗:用無鉛焊錫膏濕潤平衡法測定表面安裝裝置
  14. Sram module expansion slot riser card adapters and extender cv08rrl costronic slot riser card for local - 5 160p

    右插型slot x2 ; 160p sram module從右手邊插入擴充卡焊錫面朝上，
  15. The board and chip are then heated to melt the solder and join the two together

    然後加熱面板和晶元的縫合處，使焊錫熔化，從而把二者粘在一起。
  16. The fine powders of the solder alloy are one of the key materials in the smt, the requirement as following : the particle diameter is in 5 u m ~ 74 u m, the shape is spherical and the distribution of the particle size is uniform

    表面組裝技術（ smt ）已廣泛應用於電子工業中，而焊錫合金微粉是該技術的關鍵材料之一，通常要求：粉末粒徑5 74 m ，形狀為球形，且粒徑分佈均勻。
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