片晶連生 的英文怎麼說

中文拼音 [piānjīngliánshēng]
片晶連生 英文
lamellar intergrowth
  • : 片構詞成分。
  • : Ⅰ形容詞(光亮) brilliant; glittering Ⅱ名詞1. (水晶) quartz; (rock) crystal 2. (晶體) any crystalline substance
  • : Ⅰ動詞1 (連接) link; join; connect 2 (連累) involve (in trouble); implicate 3 [方言] (縫) ...
  • : Ⅰ動詞1 (生育; 生殖) give birth to; bear 2 (出生) be born 3 (生長) grow 4 (生存; 活) live;...
  • 連生 : adhesion; overgrowth; intergrowth; intercrescence
  1. Mainly for capacitance, semiconductor, jingzhen, resistance, ic chips, jiechajian procedures, connecting pieces, switching devices, silicon, triode, diode, piezoelectric ceramic base films, tubes, electron tubes, electronic stamping, precision metal parts, production processes between cleansing processes

    元接插件接件轉接器矽三極體二極體壓電陶瓷基顯象管電真空器件等內精密電子沖壓五金零件,產加工過程工序間的清洗。
  2. The “ personality ” of the chip ( its logical functions and interconnections ) can be changed dynamically in nanoseconds merely by changing its configuration bits

    只要讓組態位元發變化,的性格(也就是它的邏輯功能與相互結)也會動態地跟著在奈秒之間發改變。
  3. The task in the paper comprises two parts. the software design procedure works as follow, program the drivers for module on pc with cvi, generate the corresponding ddl and then edit the test serial and invoke the ddl by designing soft panel with vc + + 6. 0. thus facilitate users to control module to conduct high speed data test. the hardware design procedure works as follow, design vxi message based interface circuit and plesio - fdc circuit with fast data transport function on xc2vp30, a virtex - ii pro series fpga chip designed by xilinx company which integrates power - pc processor

    筆者負責的工作包括軟體設計和硬體設計兩部分:軟體設計是用cvi工具編寫模塊在pc機上的驅動程序,成動態接庫,再用visualc + + 6 . 0設計軟面板,實現測試矢量的編輯和動態接庫的調用,讓用戶很方便地控制模塊進行高速數據測試;硬體設計是在xilinx公司的一集成了power - pc處理器的virtex - iipro系列fpga元xc2vp30上完成vxi總線的消息基介面電路設計和具有快速數據傳送功能的準fdc電路[ 1 ] [ 2 ]設計。
  4. The technical breakthroughs in growth of nd : cngg had been made. in particular, continuous laser operation was achieved from nd : cngg pumped by ld. when the crystal wafer was end - pumped by one bar of ld with 807nm wavelength, the cw laser output power of 123. 1 mw was obtained with slope efficiency of 22. 3 %

    本論文用自動化熔體提拉技術成功長出< 111 >方向的直徑25mm以上,長度80mm以上的平界面無核心nd : cngg單,確定了體結構和物相,測量了體的光譜性能,體消光比達到34db ,長技術有新的突破,實現了續激光運轉,用單支807nm半導體激光二極體端面泵浦該子,在國內首次獲得123 . 1mw的1 . 062 m續激光輸出,斜效率達22 . 3 % 。
分享友人