相容集成電路 的英文怎麼說

中文拼音 [xiāngróngjíchéngdiànlù]
相容集成電路 英文
compatible integrated circuit
  • 相 : 相Ⅰ名詞1 （相貌; 外貌） looks; appearance 2 （坐、立等的姿態） bearing; posture 3 [物理學] （相位...
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 相容 : consistent; compatible; tolerant
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. Gmc network has better high - frequency performances and is easier to control on chip than rc network

    與傳統的電阻電容結構相比，跨導電容結構有更好的高頻特性，在集成電路中較易控制。
  2. Among various fabrication techniques of thin film, the sol - gel process has gained much interest for the preparation of pzt thin film, due to ihe advantages of good homogeneity, easy control of composition, low in - ill i reaving temperature, easy formation of large area thin films pb ( zrxti : - k ) 0 :, ( pzt ) films were prepared on the ito coated glass plates and low resistor silicon wafer in sol - gel dip - coating process associated wi di heat treatment : at different temperatures and characterized by x - ray diffraction ( xrd ) and transmission electron microscopy ( tem ). lt is shown that the pzt ferroelectric thin films with ( 110 ) preferred orientation and well - crystallized perovskite structure can be obtained after annealing at 680 ? for 30 minutes on ito substrate and at 800 " c for lornin on silicon substrate

    Pzt的制備方法有很多，其中溶膠?凝膠（ sol - gel ）方法可以和集成電路（ ic ）光刻工藝相互兼容，處理溫度低，有大面積塗敷性能，能精確地控制組分，無需復雜的真空設備，成本低廉，所以對于集成鐵電薄膜電容的應用這種方法有很廣闊的前景。本文利用sol - gel技術在摻錫的in _ 2o _ 3透明導電薄膜（ ito ）襯底和低阻硅襯底上成功地制備了pzt鐵電薄膜。運用了x射線衍射， sawyer - tower電路和lcr電橋分別對薄膜的晶化溫度，結構和電學性能進行了測試。
  3. Compared with bst materials, especially in thin films, ps t has smaller ferroelectric critical size, lower crystallization temperature, and compatible fabrication with si micro - electronics, so it can meet the need of the high quality si - based integrate circuit ( ic ). moreover, it is important to promote the development of the miniaturization and integration for the modern devices

    與bst相比，特別作為薄膜材料， pst的鐵電臨界尺寸較小，晶化溫度較低，制備工藝與si微電子工藝兼容，更能夠滿足高性能的si基集成電路的需要，對推動現代器件發展的小型化和集成化具有十分重要的意義。
  4. Coplanar waveguides ( cpw ' s ) offer several advantages over conventional microstrips, these include the simplification of the circuit fabrication process, ease of parallel and series insertion of both active and passive components ( without the need for via holes ), and high circuit density. therefore cpw ' s are widely used in microwave and millimeter - wave integrated circuits, optical and high temperature superconductor microwave devices

    與常規的微帶傳輸線相比，共面波導具有容易製作，容易實現無源、有源器件在微波電路中的串聯和並聯（不需要在基片上穿孔） ，容易提高電路密度等優點，因此共面波導被廣泛應用於微波、毫米波、光學和高溫超導等集成電路中。
  5. Compatible hybrid integrated circuit

    相容混合集成電路
  6. The integration of wireless acceleration sensor for structural global monitoring, the integration of wireless strain sensor for structural local monitoring, their corresponding network ’ s topological strucuture, the network ’ s communication protocol, saving energy and the network ’ s experiments are studied systemly, the main contents include : 1. for strucutal global monitoring, the electronics components are compared, anlysysed and seleced. on this base, the design modulization method is used for designing and debugging sensing disposal module, micro - processing module, wireless transceiver module and power module, and thus a wireless acceleration sensor node with digital interface is integrated using the above modules

    本文在充分研究傳感技術、信號處理技術、無線通信技術的基礎上，針對土木工程結構整體性態監測的無線加速度傳感器集成、結構局部性態監測的無線應變傳感器集成以及相應的無線傳感器網路拓撲結構、網路通信協議、網路能耗處理、網路試驗等問題進行了系統的研究，主要研究內容如下: 1 .針對結構整體性態監測的需要，從設計的小型化、低功耗、低成本、高可靠性角度出發，對相關電子器件進行了比較、分析、選擇;在此基礎上，採用模塊化設計方法，對傳感處理模塊、微處理模塊、無線收發模塊以及能源模塊分別設計、調試，進而集成了基於數字介面的無線加速度傳感器節點。
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