硅半導體材料 的英文怎麼說
中文拼音 [guībàndǎotǐcáiliào]
硅半導體材料
英文
silicon semiconductor materials- 硅 : 名詞[化學] silicon (14號元素符號 si)
- 半 : Ⅰ數詞1 (二分之一) half 2 (在 中間的) in the middle; halfway 3 (比喻很少) very little; the l...
- 導 : 動詞1. (引導) lead; guide 2. (傳導) transmit; conduct 3. (開導) instruct; teach; give guidance to
- 體 : 體構詞成分。
- 材 : 名詞1 (木料) timber 2 (泛指可以直接製成成品的東西; 材料) material 3 (供寫作或參考的資料) ma...
- 料 : 名詞1 (材料; 原料) material; stuff 2 (喂牲口用的穀物) feed; fodder 3 (料器) glassware 4 (...
- 材料 : 1. (原料) material 2. (資料) data; material 3. (適于做某種事的人才) makings; stuff
-
Single crystal silicon is the semiconductor material which is used mostly in the present electronic industry, it play a very important role in the field of aviation - astronavigation, optics, electron and micro - electronics
單晶硅材料是當代電子工業中應用最多的半導體材料,它在航空航天、光學、電子和微電子等領域發揮著十分重要的作用。Silicon, naturally occurring in the form of silica and silicates, is the most important semiconductor for the electronics industry.
在自然界從硅酸鹽和二氧化硅形式存在的硅是電子工業中最重要的半導體原材料。Testing of materials for semiconductor technology - measurement of carrier lifetime in silicon single crystals - recombination carrier lifetime at low injection by photoconductivity method
半導體工藝材料的試驗.硅單晶中載流子壽命的測量.用As silicon is the most important semiconductor material in micro - electronic field, one - dimensional nano - structures of silicon play an important role in the fields of device assembly, nanometer - size magnetic device, photoelectronics, and have drawn wide interest in the world
摘要作為微電子領域最重要的半導體材料,硅的一維納米結構在器件組裝、納米尺寸磁性器件、光電子等領域具有重要的作用,已經成為國際上材料科學研究的一個熱點。Abstract : experiments were made on a ultrasonic machining tool with work - piece adhered to ultrasonic transducer head, to machine micro - holes on hard and brittle materials such as soda glass and si, to study the effects of tool materials , work - piece materials , amplitude , machining load , slurry concentration , tool length and the size of work - piece on machining rate and wear ratio. in this experiment, the micro - tool was made through wedg
文摘:通過以wedg放電加工手段製作微細超聲加工用工具,在採用工件加振方式的微細超聲加工機上對碳酸玻璃、半導體硅等硬脆材料試件進行微孔加工的實驗,來探討在某一特定加工條件下工具材料、工件材料、工件的振幅、加工靜載荷、磨料懸浮液濃度、工具長度及工件尺寸等重要因素對加工速度、工具損耗率的影響,為微細超聲加工技術的實用化提供參考依據。If the silicon - based films have a favorable luminescence properties in visible light, this important semiconductor will be the basic material in the next generation of the electronics
如果能夠使硅基材料在可見光范圍內具有良好的發光特性,那麼這種重要的半導體材料則有可能在飛速發展的光電子學中成為下一代電子學革命的基礎材料。Flexibility, processability, low cost, interesting optical - electric properties and so on make organic materials be a good substitute for inorganic ones. modification of inorganics by organics can change surface properties of inorganics, for example, frictional, optical, electrical, chemical and biocompatible properties. on the other hand, many interests have been shown to integration of functional organics in si - base devices because of their great promise in optoelectronic, micro - electronic and sensor applications
通過對無機半導體材料進行有機改性,可以改變無機材料的表面化學性質,生物相容性質,光電性質等等,因此,有機無機復合材料在光電器件、生物傳感、微電子器件的應用領域有著很好的應用前景,尤其是在微電子工業中廣泛使用的硅材料與有機光電材料的復合更是備受關注。Testing of materials for semiconductor technology - determination of defect types and defect densities of silicon epitaxial layers
半導體工藝材料的檢驗.硅晶體外延層缺陷種類和缺陷密All the results are of great importance to surface modification of inorganic semiconductor devices and integration of organic devices
本論文的這些研究對于硅及其他無機半導體材料的表面改性和有機光電器件的集成化具有十分重要的意義。Testing of semi - conductive inorganic materials ; measuring the thickness of silicon epitaxial layer thickness by infrared interference method
半導體無機材料的試驗.用紅外線干涉法測量硅外延生長The sensing chip is connected with special amplification circuit of the transmitter by the conductor, and using piezo - resistance effect of semi - conductor silicon material to realize the transformation between pressure and electric signal
敏感晶元通過導線與變送器專用放大電路相連接。它利用半導體硅材料的壓阻效應,實現壓力與電信號的轉換。The temperature sensor based on the absorption properties of an indirect semiconductor
該傳感器採用單晶硅半導體材料為溫度敏感材料。With the development of vlsi ( very large scale integration ) and ulsi ( ultra large scale integration ), rtp ( rapid thermal process ), which consumes less time and less energy than classical thermal treatments, have been widely employed in semiconductor manufacturing. however, the most importance is that rtp is applied for defects engineering of silicon material. it is generally believed the rtf leads to the injection of additional vacancies into silicon wafer, and then a so - called magic denuded zone ( mdz ) in the near - surface region of cz silicon wafer was formed by controlling the vacancy distribution
隨著大規模集成電路( vlsi )和超大規模集成電路的發展,節省時間、節省能量、容易控制的快速熱退火工藝在半導體器件製造工藝中得到了廣泛的應用,並且在硅材料的缺陷工程中發揮了特殊的作用,人們通過高溫快速熱處理在矽片中引入空位,並控制空位的分佈,進而形成了具有較強內吸雜能力的潔凈區。The motorcycle line : the line has gaoming co, ltd, yihao co. ltd, general electric corporation and jingjia group etc. which annually turn out 200 thousand motorcycle engines and over 300 thousand motor - bicycles and have the capacity to equip motorcycles with complete spare parts. it has various advanced production and testing equipment and the biggest spare parts market for cars and motorcycles which has become famous " motorcylce city " near and far in the middle jiangsu
-快速崛起的硅太陽能集群:以大口徑太陽能級單晶硅生產企業江蘇順大半導體公司為基礎,按照「主攻多晶硅發展單晶硅打通產業鏈」的發展思路,通過引進國外同行知名企業加盟,擴大光電轉換材料的生產規模,延伸開發上下游產品,形成全國最大的光電轉換材料太陽能電池及太陽能燈具的生產基地。Silicon piezoresistive sensors are widely used for pressure measure. consistency, temperature shift and non - linearity are ubiquitous because of semiconductor ’ s inherent characteristics. compensation and calibration are needed for piezoresistive sensor ’ s output voltage
對于廣泛應用於壓力測量的硅壓阻式傳感器,由於所用的半導體材料的固有特性,普遍存在著:一致性、溫度漂移和非線性等問題。With the development of modern industry and technology, some conveying and manipulating operations in non - contact mode need the suspension technology in the fields of guiding system, material processing, micro - electronics and semi - conductor industry and so on. therefore, it is of great importance to develop the suspension technique. there have been some conventional suspension methods at present, among them, magnetic levitation, acoustic levitation, aerodynamic levitation, optical levitation, radio - frequency levitation, electric levitation and super - conducting levitation
隨著現代工業與科學技術的發展,在精密機械工業、半導體工業、航空航天工業、交通與運輸業以及空間材料科學、微電子學和軍事科學等許多領域,需要採用懸浮技術對特定目標如精密元器件、光盤( cd ) 、液晶片( lcd ) 、硅基片( wafer ) 、導航陀螺乃至列車等實現非接觸式的操作或輸運,因此,懸浮技術的發展具有重要的理論意義和實用價值。After a brief introduction to the excitation of semiconductor luminescence diode, the light - emitting machenisms of various new luminescence materials, including - and - semiconductor compounds and ps, the structures of different luminescence diodes, and their properties were discussed, and the application of semiconductor luminescence diode in modern science was presented
在簡介半導體發光二極體的輻射復合基礎上,詳細討論了包括?族、 ?族化合物半導體材料和多孔硅( ps )等新發光材料在內的各種發光材料的發光機理、發光二極體的結構與特性.並介紹了半導體發光二極體在近代科學中的應用Testing of materials for semiconductor technology - determination of impurity content in silicon by infrared absorption - part 1 : oxygen
半導體工藝材料檢驗.用紅外吸收法測量硅的雜質含量Silicon - based silica optical waveguides have many excellent advantages such as simple structure and low loss, further more they are good materials for integrated optics and have good match with optical fibers. integrated devices on silicon - based silica planar optical waveguides have been widely used and play a more important role in optical communications. integrated silica waveguides with well defined core shapes provide an efficient means of controlling both the amplitude and phase of optical signals, are widely used in production of mach - zender optical interferometer, optical splitters, awg, thermooptic switches and various kinds of filters
硅基sio _ 2光波導具有結構簡單、傳輸損耗低、易於集成、性能穩定等優點,並且能有效的與光纖耦合,是較理想的波導材料,而且其製作工藝可採用成熟的半導體微細加工技術,具有工藝簡單、重復性好、製作成本低等特點,所以這種波導日益受到人們的關注,成為光通信領域研究的熱點。Besides the element semiconductors, such as si ( called the first generation semiconductor ), and the compound semiconductors, such as gaas, inp ( called the second generation semiconductor ), silicon carbide ( sic ) is one of the wide band - gap semiconductor materials ( called the third generation semiconductor )
碳化硅( sic )材料是繼第一代元素半導體( si )和第二代化合物半導體( gaas 、 inp 、 gap等)材料之後的第三代寬帶隙半導體材料。分享友人