硫酸銅電鍍 的英文怎麼說
中文拼音 [liúsuāntóngdiàndù]
硫酸銅電鍍
英文
acid copper solution- 硫 : 名詞[化學] sulphur; sulfur [美國] （16號元素, 符號s）
- 酸 : 酸構詞成分。
- 銅 : 名詞（金屬元素） copper （cu）
- 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
- 鍍 : 動詞（用電解或其他化學方法使一種金屬附著到別的金屬或物體表面上） plate
- 硫酸 : [無機化學] sulphuric acid; sulphoacid; vitriol; vitriol oil; dipping acid; sulfuric acid; hydric ...
- 電鍍 : electroplate; electroplating; electrofacing; （electric） plating; electrocladding; galvanize; ga...
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Electroplated coatings - copper sulphate for copper baths - requirements and testing
電鍍層.銅槽用硫酸銅.要求和檢驗The pretreatment, effect of bath compositions and operation conditions such as temperature, currenty and time on compactness of the zinc and cu / ni / cr coatings have been investigated. the relationship of operation conditions to thickness of the coatings was studied by weight method. the specimens have been pickled in nacl or sulfate acid solution to evaluate the porosity of the coating
研究了鎂合金電鍍前處理工藝，電鍍鋅、電鍍銅/鎳/鉻工藝配方及其施鍍溫度、電流密度和時間對鍍層緻密性的影響;採用稱重法研究施鍍工藝與鍍層厚度的關系，利用nacl溶液和硫酸溶液浸泡試樣來考察鍍層孔隙率，採用劃痕試驗和熱震試驗檢驗鍍層的結合力，採用金相顯微鏡和掃描電子顯微鏡觀察鍍層表面形貌。Methods for analysis of acid plating copper solutions part 1 : determination of copper sulfate content by edta volumetric method
酸性電鍍銅溶液分析方法第1部分: edta容量法測定硫酸銅的含量Methods for analysis of acid plating copper solutions part 5 : determination of nickel sulfate content by atomic absorption spectrometric method
酸性電鍍銅溶液分析方法第5部分:原子吸收光譜法測定硫酸鎳的含量It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance
結合銅在微電子工業中的應用，綜述了硫酸鹽鍍銅中銅的電沉積機理、銅鍍層微結構、添加劑對銅電沉積過程的影響以及銅電沉積初期行為方面的研究進展。Methods for analysis of acid plating copper solutions part 3 : determination of sulphuric acid content by potentiometric titrimetric method
酸性電鍍銅溶液分析方法第3部分:電位滴定法測定硫酸的含量Methods for analysis of acid plating copper solutions part 2 : determination of copper sulfate content by potentiometric titrimetric method
酸性電鍍銅溶液分析方法第2部分:電位滴定法測定硫酸銅的含量Copper sulfate for electroplating use
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