硬底片 的英文怎麼說
中文拼音 [yìngdepiān]
硬底片
英文
hard negative-
By using the various substrate such as glass, stainless steel, ito < wp = 6 > film and ceremic wafer, we discover that we can deposite the high quality cnx thin film with the high cohesion, high hardness and low friction coefficient on the ceremic substrate
我們發現在載玻片，不銹鋼片及ito膜玻璃片上沉積的cnx薄膜，由於襯底和膜料的應力差較大，都有薄膜破裂、剝落現象。並且有成膜不均勻現象硬度也較低。( 4 ) the study of the optical band gap of cnx film by uv - vis spectrophotometer. ( 5 ) by using the microhardness tester, we study the hardness of cnx film on the ceremic substrate by dc magnetron reactive sputtering with the feed ar and n2 flow rate, film thickness, substrate temperature and substrate bias
（ 5 ）用直流磁控反應濺射法，以陶瓷作為襯底，對在ar和n2不同流量、不同膜厚、不同基片溫度和對基片施加不同偏壓下沉積的薄膜，用< wp = 4 >顯微硬度計研究測試了不同工藝參數下的相應硬度。In this paper, plasma - enhanced chemical vapor deposition ( pecvd ) technique was used to deposit the dielectric p - sio2 films and p - sion films on the silicon wafer under the conditions of low temperature and low pressure with teos organic sourse. this research was focused on the evaluation of film growth, hardness, stress, resistance and refractive index, by changing the experimental parameters including rf power, substrate temperature, chamber pressure, and the flow rates of teos, o2, n2. the results showed that the p - sio2 film was smooth, dense, and structurally amorphous
實驗結果顯示，用pecvd法淀積的p - sio _ 2膜是一表面平坦且緻密的非晶質結構的薄膜，與矽片襯底之間有良好的附著性；在中心條件時生長速率可控制在2600a / min左右；在基板溫度410時有最大的硬度可達16gpa ；其應力為壓縮應力，可達- 75mpa ；薄膜的臨界荷重為46 . 5un 。2. the design of low - level driver of powerpc 405. after thoroughly collecting and consulting the latest information in the field of sopc, in this thesis we choose fpga embedded powerpc405 processor hardcore to construct the demanded sopc system, which manages to meet the application demand between
論文課題在認真深入地調研了國內外sopc領域的最新資料后，選擇了嵌入powerpc405處理器硬核的fpga片上可編程系統，解決vxi介面與本地ram控制器的通訊和靜態存儲器存儲控制等方面的應用需求，通過powerpc硬體設計和底層驅動軟體編程，構建了滿足設計需求的高速數字測試系統。Firstly, i introduce the hardware and software platform of embedded system, and explain the basic hardware and software development, it ’ s a cooperate process. then i analyse the cross development method for embedded system, mentioned the “ host ” and “ target ” in the development of an embedded system. take e - book project as an example, follows the process to introduce a real embedded system project, including the mcu, periphery hardware and the integrated development environment which can provide the whole platform for an integrated development on the pc - - wb33. then i present 3 of the hardware of e - book. for lcd, i introduce the common feature of lcd, the ssct lcd as well as the design, actualize of its driver. for the rs232 serial port, the principle of the serial port and the main driver of it are introduced. for flash memory, i introuce the principle of nor flash and nand flash, and how their drivers implemented. in the end, the conclusion of this paper is generated, there is also a prospect for further research
以一個實際的嵌入式開發項目? ?電子閱讀器為例，按照項目開發流程，介紹了包括項目所使用的微控制器mcu及片內周邊電路;項目所使用的基於mcu的集成開發環境? ?能在pc機上提供完整集成開發的平臺wb33 ，使用它可以很方便的在pc機上模擬目標機的環境。詳細介紹了電子閱讀器的三個底層硬體:對項目中採用的ssctlcd的特性以及其驅動的設計和實現的過程進行了詳細介紹;對rs232串口驅動，介紹了接收端即電子閱讀器端實現串口驅動介面的主要函數;對flash閃存驅動，分別介紹了norflash和nandflash的原理以及它們的驅動實現。最後，對全文給以總結，並對以後進一步的研究做出了展望分享友人