粗削工件 的英文怎麼說
中文拼音 [cūxiāogōngjiàn]
粗削工件
英文
rough turned piece- 粗 : Ⅰ形容詞1 (長條東西直徑大的) wide (in diameter); thick 2 (長條東西兩長邊的距離寬的) wide (i...
- 削 : 削動詞1. (用刀斜著去掉物體的表層) pare [peel] with a knife 2. (乒乓球的一種打法) cut; chop
- 工 : Ⅰ名詞1 (工人和工人階級) worker; workman; the working class 2 (工作; 生產勞動) work; labour 3 ...
- 件 : Ⅰ量詞(用於個體事物) piece; article; item Ⅱ名詞1. (指可以一一計算的事物) 2. (文件) letter; correspondence; paper; document
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The roughing cut, to remove the greater part of the excess material, should be reasonably heavy, that is, all the machine, or cutting tool, or work, or all three, will stand
粗切削因為要去除大部分的余料,切削力量肯定是相當大的,這就意味著,整個機器、刀具、工件或這三者都要能承受得了。Rough and fine cutting, drilling and boring can be conducted for petroleum drill devices such as drill collar, integral heavy wall drill pipe, centralizer as well as other large - sized and super long axis parts with diameter less than 1600mm and length less than 18000mm
在此可以對鉆鋌、加重鉆桿、扶正器等石油鉆具和其他直徑小於1600毫米、長度小於18000毫米的大型、超長軸類零件進行粗、精車削和鉆、鏜加工。Sometimes, however, certain portions of a piece may require more than one roughing cut
不過,有時工件的某些部位可能需要不止一次的粗切削。The results show that, when increasing the feed rate of the grinding wheel, decreasing the rotating speed of the wafer chuck table and using coarser grit grinding wheel, the material removal rate in the wafer rotating grinding increase, the feed rate of the grinding wheel has greater influence on the material removal rate ; when suitably increasing the rotating speed of the grinding wheel, decreasing the feed rate of the grinding wheel and using finer grit grinding wheel, the wafer surface roughness can be reduced ; there exists a critical rotating speed of the grinding wheel ( about 2300rpm ), beyond which the material removal rate evidently decreases and the spindle motor current and wafer surface roughness steeply increase ; when the grit size of the grinding wheel is finer than # 2000, the material removal rate decreases and the wafer surface roughness has no obvious improvement
研究結果表明,增大砂輪軸向進給速度和減小工件轉速,採用粗粒度砂輪有利於提高磨削矽片的材料去除率,砂輪軸向進給速度對材料去除率的影響最為顯著;適當增大砂輪轉速,減小砂輪軸向進給速度,採用細粒度砂輪可以減小磨削表面粗糙度;在其它條件一定的情況下,砂輪速度超過一定值會導致材料去除率減小,主軸電機電流急劇增大,表面粗糙度變差;採用比# 2000粒度更細的砂輪磨削時,材料去除率減小,矽片表面粗糙度沒有明顯改善。By using a wafer - rotating grinding machine, the influence of the main process factors including grit size of diamond grinding wheel, rotating speed of the wafer chuck table, rotating speed and the down feed rate of the cup grinding wheel on the material removal rate, spindle motor current and wafer surface roughness in grinding large size wafer are experimentally investigated
摘要利用基於自旋轉磨削原理的矽片超精密磨床,通過試驗研究了砂輪粒度、砂輪轉速、工件轉速及砂輪進給速度等主要因素對材料去除率、砂輪主軸電機電流以及磨削后矽片表面粗糙度的影響關系。On the condition of the test, the cutting force of ticp / fe composites was more than which of 45 steel by 60n, and the cutting temperature was higher than which of 45 # steel by 90, and the roughness of machined surface was almost as much as which of 45 # steel. tic ceramic particles enhanced the cutting force and the cutting temperature of ticp / fe composites, but had little effect on the roughness of machined surface. the machining quality of ticp / fe in situ composite was similarity to 45 # steel
在本試驗條件下,原位tic _ p fe復合材料切削加工時的切削力與45 ~ #鋼相比要大60n ,切削溫度要高90 ,加工表面粗糙度與45 ~ #鋼相近; tic陶瓷顆粒使原位tic _ p fe復合材料切削加工時的切削力增大、切削溫度增高,對加工表面粗糙度影響不大;原位tic _ p fe復合材料的可加工性與45 ~ #鋼相當。分享友人