終板電位 的英文怎麼說

中文拼音 [zhōngbǎndiànwèi]
終板電位 英文
end plate electric potential
  • : Ⅰ名詞1 (最後; 末了) end; ending; finish 2 (指人死) death; end 3 (姓氏) a surname Ⅱ形容詞(...
  • : Ⅰ名詞1 (片狀硬物體) board; plank; plate 2 (專指店鋪的門板) shutter 3 [音樂] (打拍子的樂器) ...
  • : Ⅰ名詞1 (有電荷存在和電荷變化的現象) electricity 2 (電報) telegram; cable Ⅱ動詞1 (觸電) give...
  • : Ⅰ名詞1 (所在或所佔的地方) place; location 2 (職位; 地位) position; post; status 3 (特指皇帝...
  1. Endplate potentials, acetylcholine potentials, and electrotonic potentials were recorded from the motor endplates of isolated diaphragms from acute late septic and nonseptic rats

    記錄急性遲發性膿毒血癥和非膿毒血癥大鼠的離體橫膈運動上的終板電位、乙酰膽堿緊張
  2. The pathological diagnosis should include : ( 1 ) the electromyographic ( emg ) recording and ultrasound imaging of local twitch responses ( ltrs ), ( 2 ) the emg recording of spontaneous electrical activity ( endplate noise ) at multiple active loci in the mtrp, and ( 3 ) the biopsies of mtrp that show contraction knots and giant round muscle fibers

    病理學的診斷應該包括: ( 1 )局部抽搐反應的肌圖記錄與超音波影像, ( 2 )在肌筋膜激痛點里的多發性活動性小點上之自發性活動(雜訊)的肌圖紀錄, ( 3 )肌筋膜激痛點的切片檢查顯現出收縮結節和大而圓的肌肉纖維。
  3. 0. 1 in connectors for frequencies below 3 mhz for use with printed boards. part 3 : two - part connectors for printed boards, having contacts spaced at 2, 54 mm 0, 1 in centres and staggered terminations at that same spacing

    印刷頻率低於3 mhz的連接器.第3部分:中心置和交錯置上觸點間距為2 . 54 mm
  4. 0. 075 in connectors for frequencies below 3 mhz for use with printed boards. part 4 : two - part connectors for printed boards, having contacts spaced at 1, 91 mm 0, 075 in centres and staggered terminations at that same spacing

    印刷頻率低於3 mhz的連接器.第4部分:中心置和交錯置上觸點間距為1 . 91 mm
  5. Conclusions : these results indicate that acute late sepsis facilitates endplate potentials and enhances excitability of the muscle membrane, indicated by a decrease of critical depolarization

    結論:這些結果顯示急性遲發性膿毒血癥易化終板電位,增強肌肉細胞膜的興奮性,減少臨界去極化。
  6. End plate potential

    終板電位
  7. With the development of microelectronic products ( integrated circuit, printed circuit board, etc ) directing to high density, thin separation and low defect ratio, its inspection requirement is higher on aspects of precision, efficiency, universal, and intelligence etc. therefore, this paper researched on the general key techniques in the field of microelectronic products vision inspection, covered the shortage of traditional inspection on aspects of fast and precision locating, image mosaic, and fine defect test, completed theory study on physical dimension and defect inspection of microelectronic products based on machine vision, developed the prototype and used lots of experiments to prove its correctness and feasibility

    隨著微子產品(集成路晶元、印刷等)向著高密度、細間距和低缺陷方向發展,對其檢測技術在精密、高效、通用和智能化等方面提出了更高要求。由此,本文對微子產品視覺檢測中的關鍵技術進行研究,彌補了傳統檢測在精確快速定、圖像全景組合和精細缺陷檢測等方面的不足,最完成基於機器視覺的微子產品外形尺寸和缺陷檢測的理論研究和樣機研製,並進行了大量實驗證明其正確性和可行性,力圖為我國自主創新的微子產品視覺檢測技術提供理論和實際借鑒。
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