膜集成電路 的英文怎麼說

中文拼音 [mójíchéngdiànlù]
膜集成電路 英文
fic
  • 膜 : 名詞1. [生物學] （像薄皮的組織） membrane 2. （像膜的薄皮） film; thin coating
  • 集 : gatherassemblecollect
  • 成 : Ⅰ動詞1 （完成; 成功） accomplish; succeed 2 （成為; 變為） become; turn into 3 （成全） help comp...
  • 電 : Ⅰ名詞1 （有電荷存在和電荷變化的現象） electricity 2 （電報） telegram; cable Ⅱ動詞1 （觸電） give...
  • 路 : 1 （道路） road; way; path 2 （路程） journey; distance 3 （途徑; 門路） way; means 4 （條理） se...
  • 集成 : integration集成晶體管 integrated transistor; 集成元件 integrated component
  • 電路 : [訊] circuit （ckt）; electric circuit; electrocircuit電路板 circuit board; 電路保持 guard of a c...
  1. The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer.

    按照順序從每一塊掩膜版上將圖形一層一層地轉移到矽片的表面，就制得了成品集成電路。
  2. In early ic fabrication practice, etch bias was usually dealt with by introducing an appropriate amount of compensation in the masking layer.

    在早期的集成電路製作實踐中，刻蝕偏差通常是通過在掩膜層上引入一個適量的修正來處理的。
  3. Hybrid microcircuits. film deposit resistive integrated circuits. general requirements

    混合微電路.薄膜附著電阻集成電路.一般要求
  4. Among various fabrication techniques of thin film, the sol - gel process has gained much interest for the preparation of pzt thin film, due to ihe advantages of good homogeneity, easy control of composition, low in - ill i reaving temperature, easy formation of large area thin films pb ( zrxti : - k ) 0 :, ( pzt ) films were prepared on the ito coated glass plates and low resistor silicon wafer in sol - gel dip - coating process associated wi di heat treatment : at different temperatures and characterized by x - ray diffraction ( xrd ) and transmission electron microscopy ( tem ). lt is shown that the pzt ferroelectric thin films with ( 110 ) preferred orientation and well - crystallized perovskite structure can be obtained after annealing at 680 ? for 30 minutes on ito substrate and at 800 " c for lornin on silicon substrate

    Pzt的制備方法有很多，其中溶膠?凝膠（ sol - gel ）方法可以和集成電路（ ic ）光刻工藝相互兼容，處理溫度低，有大面積塗敷性能，能精確地控制組分，無需復雜的真空設備，成本低廉，所以對于集成鐵電薄膜電容的應用這種方法有很廣闊的前景。本文利用sol - gel技術在摻錫的in _ 2o _ 3透明導電薄膜（ ito ）襯底和低阻硅襯底上成功地制備了pzt鐵電薄膜。運用了x射線衍射， sawyer - tower電路和lcr電橋分別對薄膜的晶化溫度，結構和電學性能進行了測試。
  5. A novel low mechanical hysteretic ceramic capacitive pressure transducer has been made, by using of ceramic sealing technology ; integrate circuit ( ic ) technology and thick film plane fixing circuit technology. this transducer is made of a deformable ceramic diaphragm and a ceramic base plate, between which has an air cavum. a coaxial gold electrode was fired onto the diaphragm and the base plate

    本文利用新型陶瓷技術、集成電路技術和厚膜平面安裝電路技術，採用零力學滯后的陶瓷和陶瓷密封材料進行設計製造了一種非充液乾式的電容式壓力傳感器，該壓力傳感器由較厚的陶瓷基體和較薄的陶瓷膜片構成，中間形成一空氣介質腔，在基座和膜片之間內置同軸的雙電極，組成兩個電容，當膜片承受壓力時發生位移，使電容量產生變化，經後置處理電路直接轉換為可輸出的直流電壓信號。
  6. Major producers of electrical and electronic ceramics, engineering ceramics, ceramic thick - film integrated circuits, ceramics molybdenum, manganese, tungsten metal manganese, ceramic packages such as ceramics pieces

    主要生產電子電器陶瓷、工程陶瓷、陶瓷厚膜集成電路、陶瓷鉬錳、鎢錳金屬化、陶瓷封裝外殼等各種陶瓷瓷件。
  7. Integrated film circuits ; methods for the assessment of dielectric pastes

    薄膜集成電路.第3部分:材料介電糊劑的評價方法
  8. Alumina ceramic substrates for thick film integratedcircuits

    厚膜集成電路用氧化鋁陶瓷基片
  9. Case outlines for film integrated circuits and hybrid integrated circuits

    膜集成電路和混合集成電路外形尺寸
  10. Terminology for film integrated circuits and hybrid film integrated circuits

    膜集成電路和混合膜集成電路術語
  11. Thick thin film integrated circuit

    厚薄膜集成電路
  12. Thick film integrated circuit

    厚膜集成電路
  13. Generic specification for film integrated circuits and hybrid film integrated circuits

    膜集成電路和混合膜集成電路總規范
  14. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

    膜集成電路和混合膜集成電路分規范採用能力批準程序
  15. Harmonized system of quality assessment for electronic components - film and hybrid integrated circuits - generic specification - requirements for internal visual inspection

    電子元器件質量評定協調體系.膜集成電路和混合集成電路.總規范.內部視力檢驗要求
  16. Semiconductor devices - intergrated circuits. part 20 : generic specification for film integrated circuits and hybrid film intergrated circuits

    半導體器件.集成電路.第20部分:薄膜集成電路及混合薄膜集成電路的總規范
  17. Alumina ceramic substrates for thin film integratedcircuits

    薄膜集成電路用氧化鋁陶瓷基片
  18. Film and hybrid integrated circuits - customer information, product assessment level schedules and blank detail specification

    薄膜集成電路和混合集成電路.用戶信息，產品評估第級一覽表和空白詳細規范
  19. Harmonized system of quality assessment for electronic components - film and hybrid film integrated circuits - generic specification

    電子元器件質量評估協調體系.薄膜和混合薄膜集成電路.一般規范
  20. Semiconductor devices - integrated circuits - part 20 : generic specification for film integrated circuits and hybrid film integrated circuits ; amendment 1

    半導體器件.集成電路.第20部分:薄膜集成電路及混合薄膜集成電路的總規范.第1次修改
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