表面安裝部件 的英文怎麼說
中文拼音 [biǎomiànānzhuāngbùjiàn]
表面安裝部件
英文
surface mounted assembly- 表 : Ⅰ名詞1 (外面;外表) outside; surface; external 2 (中表親戚) the relationship between the child...
- 面 : Ⅰ名詞1 (頭的前部; 臉) face 2 (物體的表面) surface; top 3 (外露的一層或正面) outside; the ri...
- 裝 : Ⅰ名詞1 (服裝) dress; outfit; attire; clothing 2 (演員的化裝品) stage makeup and costume Ⅱ動詞...
- 部 : Ⅰ名詞1 (部分; 部位) part; section; division; region 2 (部門; 機關或組織單位的名稱) unit; mini...
- 件 : Ⅰ量詞(用於個體事物) piece; article; item Ⅱ名詞1. (指可以一一計算的事物) 2. (文件) letter; correspondence; paper; document
- 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
- 部件 : component; unit; parts; assembly; subsystem; secundina (pl. secundinae)
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Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals
半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide
表面安裝技術第2部分:表面安裝元器件的運輸和貯存條件-應用指南Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 4 : hybrid enclosure outlines
頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.第4部分:混合外殼輪廓圖Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages
半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array
半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack
半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type
半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南Semiconductor devices - mechanical and climatic test methods - part 30 : preconditioning of non - hermetic surface mount devices prior to reliability testing
半導體器件.機械和氣候試驗方法.第30部分:可靠性試驗之前不氣密的表面安裝器件的預調試Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components
自動化處理用組件的包裝.第6部分:表面安裝組件的散裝箱包裝Smds surface mounting technology - standard method for the specification of surface mounting components
表面安裝技術.第1部分:表面安裝元件Smds surface mounting tehcnology - part 1 : standard method for the specification of surface mounting components
表面安裝技術.第1部分:表面安裝部件Smds surface mounting technology - part 1 : standard method for the specification for surface mounting components
表面安裝技術.第1部分:表面安裝元件的Printed wiring boards - guide for the design and use of printed wiring boards : surface mounted devices
印製電路板.第23部分:設計和使用導則:表面安裝器件規范Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies
釬焊電子組件的工藝要求.第2部分:表面安裝組件Workmanship requirements for soldered electronic assemblies - part 2 : surface - mounted assemblies
釬焊電子組件的工藝要求.第2部分:表面安裝組件Workmanship requirements for soldered electronic assemblies - part 2 : surface - mount assemblies iec 61192 - 2 : 2003 ; german version en 61192 - 2 : 2003
釬焊電子組件的工藝要求.第2部分:表面安裝組件Packaging of components for automatic handling - part 6 : bulk case packaging for surface mounting components iec 60286 - 6 : 2004 ; german version en 60286 - 6 : 2004
自動裝配用元件的包裝.第6部分:表面安裝組件的散裝盒分享友人