表面安裝 的英文怎麼說

中文拼音 [biǎomiànānzhuāng]
表面安裝 英文
surface mounting
  • 表 : Ⅰ名詞1 （外面;外表） outside; surface; external 2 （中表親戚） the relationship between the child...
  • 面 : Ⅰ名詞1 （頭的前部; 臉） face 2 （物體的表面） surface; top 3 （外露的一層或正面） outside; the ri...
  • 裝 : Ⅰ名詞1 （服裝） dress; outfit; attire; clothing 2 （演員的化裝品） stage makeup and costume Ⅱ動詞...
  • 表面 : surface; superficies; boundary; face; rind; sheet; skin; outside; appearance
  1. In - circuit testers can now also test for solder opens on surface - mounted devices ( smds ), a common manufacturing defect on boards with smds

    對于表面安裝設備來說，焊接開路是一個很普遍的製造缺陷，在線測試設備可以將其測試出來。
  2. Lampholder ; lampholder g13 for surface mounting

    燈座.表面安裝用g燈座
  3. Test - fixture of surface mounting quartz crystal units

    表面安裝石英晶體元件的試驗臺
  4. Mechanical standardization of semiconductor devices - part 6 - 1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - design guide for gull - wing lead terminals

    半導體器件的機械標準化.第6 - 1部分:半導體器件包裝用表面安裝略圖制備的一般規則.鷗型翼引線終端的設計指南
  5. Surface mounting technology part 2 : transportation and storage conditions of surface mounting devices - application guide

    表面安裝技術第2部分：表面安裝元器件的運輸和貯存條件-應用指南
  6. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.混合外殼輪廓圖
  7. Surface mounted piezoelectric devices for frequency control and selection - standard outlines and terminal lead connections - part 4 : hybrid enclosure outlines

    頻率控制和選擇用表面安裝的壓電器件.標準外形和端頭連接器.第4部分:混合外殼輪廓圖
  8. Mechanical standardization of semiconductor devices - part 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages

    半導體器件的機械標準化.第6部分:表面安裝半導體器件封裝輪廓圖繪制的一般規則
  9. Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn

    環境和耐用試驗.區域陣列式包裝件表面安裝板的試驗方法fbga bga flga lga son和qfn
  10. Environmental and endurance testing - test methods for surface - mount boards of area array type packages fbga, bga, flga, lga, son and qfn iec 62137 : 2004 corrigendum : 2005 ; german version en 62137 : 2004

    環境和耐久性試驗.區域陣列式包裝件表面安裝板的試驗
  11. Standard practice for leak detection and location using surface - mounted acoustic emission sensors

    使用表面安裝的聲輻射探測器作泄漏探測和定位的標準實施規程
  12. Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch ball grid array

    半導體器件的機械標準化.第6 - 5部分:表面安裝半導體器件外殼外形圖繪制的一般規則.小螺距刃片柵格排列的設計指南
  13. Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array

    半導體器件的機械標準化.第6 - 6部分:半導體器件包裝用表面安裝略圖制備的一般規則.小螺距刃片柵格排列的設計指南
  14. Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.表面安裝半導體器件封裝外形圖繪制一般規則.玻璃密封陶瓷方型扁平封裝設計指南
  15. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:半導體器件包裝用表面安裝略圖制備的一般規則.玻璃密封的陶瓷四方塊的設計指南
  16. G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack

    半導體器件的機械標準化.第6 - 8部分:表面安裝半導體器件封裝外形圖繪制的一般規則.玻璃密封的陶瓷四邊形扁平組件的設計指南
  17. Printed board assemblies - part 1 : generic specification - requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

    印刷電路板組件.第1部分:一般規范.使用表面安裝和相關裝配技術的焊接電氣組件和電子組件的要求
  18. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type

    半導體裝置的機械標準化.第6 - 12部分:表面安裝半導體裝置外形圖繪制的一般規則.小節距柵極矩陣列的設計指南.矩形
  19. Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for fine - pitch land grid array ; rectangular type

    半導體器件的機械標準化.第6 - 12部分:表面安裝半導體器件封裝外形圖繪制的一般規則.小節距柵極矩陣列的設計指南
  20. Resistors, rectangular, surface mount, precision

    表面安裝的矩形精密電阻器
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