銅鍍層 的英文怎麼說

中文拼音 [tóngdùcéng]
銅鍍層 英文
copper coating
  • 銅 : 名詞（金屬元素） copper （cu）
  • 鍍 : 動詞（用電解或其他化學方法使一種金屬附著到別的金屬或物體表面上） plate
  • 層 : i 量詞1 （用於重疊、積累的東西 如樓層、階層、地層） storey; tier; stratum 2 （用於可以分項分步的...
  1. Cobalt - tungsten electrodeposit as copper barrier was presented in the paper

    本文提出以電鍍鈷鎢二元合金鍍層作為防銅滲層。
  2. Iron or steel placed in copper sulfate also receives a loose immersion deposit.

    鐵或鋼放入硫酸銅中，也會生成疏鬆的浸鍍層。
  3. The great amount of stabilizing agent led to the non - uniform of the plating layer. the addition of the high polymer could decrease the size of silver particles and help to increase the dispersibility of powders

    採用高銅鍍液，鍍覆表面金屬顆粒降至2 3urn ，形成一層緻密連續的銅銀共沉積的金屬膜層。
  4. Steel wire and wire products - non - ferrous metallic coatings on steel wire - part 6 : copper, bronze or brass coatings

    鋼絲和鋼絲產品.鋼絲的有色金屬塗層.第6部分:銅青銅或黃銅鍍層
  5. Electroplated coatings - copper sulphate for copper baths - requirements and testing

    電鍍層.銅槽用硫酸銅.要求和檢驗
  6. In this paper, the effects of process parameter of brush copperplating on the copper film for prevention of carburization were studied ; the relation between the time of carburization and the minimun thickness of copper film for prevention of carburization was established

    研究了用刷鍍鍍銅防滲碳時的工藝參數對鍍層防滲碳效果的影響，及滲碳時間與防滲碳所需的最小鍍層厚度之間的關系。
  7. Meanwhile, fundamental principles about electroless tin plating by reducing agent and disproportionation reaction were explained. function of every component in the bath was explained that complexing agent can effectively change the potential of copper and tin, and accelerate the beginning of replacement reaction favorably ; reducing agent can increase the rate of chemical reaction and has the effect of promoting reaction dynamics too ; antioxidant can effectively prevent sn2 + in the bath from being oxidated ; additive agent a can improve the stability of the bath ; additive agent b has such effects as refining and brightening for the tin deposits, and it enlarges the range of brightening section ; additive agent c used as leveling agent can not only make the depostis level off, but also improve the dispersive ability of the bath ; surface - active agent can solve bubble problem which gathered on the surface of the deposits, and improve the surface quality of the deposits and the bath stability

    闡述了鍍液中各組分的作用：絡合劑能有效地改變銅、錫的電位，促使初期的置換反應順利進行；還原劑能加快化學反應速度，對反應動力學有積極的促進作用；抗氧化劑能有效地防止鍍液中sn ~ （ 2 + ）的氧化；添加劑a能提高鍍液的穩定性，添加劑b對鍍層能有細化和光亮作用，擴大了鍍層光亮區的范圍；添加劑c作為平滑劑，不僅能增強鍍層表面的平整性，而且能提高鍍液的分散能力；表面活性劑較好地解決了化學鍍過程中汽泡在鍍件表面聚集的問題，提高了鍍層的表面質量和鍍液的穩定性。
  8. ( 1 ) first, metallizing abs plastics surface by chemical coarsing, metal ion absorption, metal ion reducing and chemical copper - plating. then, the copper - coating was thickened by electroplating in order to improve adhesion between following - coating and plastics matrix, and nickel was preplating. finally, ni - sic composite was plated

    （ 1 ）通過反復實驗，確定工藝流程：首先通過粗化、敏化、活化和化學鍍銅，使塑料表面金屬化，再電鍍銅加厚銅鍍層，增強后續鍍層與塑料基體的結合力，然後預鍍鎳，最後電鍍ni ? sic復合鍍層。
  9. Gold and silver gilding techniques in the western han dynasty of china

    兩件西漢時期鎏金與鎏銀青銅器鍍層中的金屬化合物
  10. Standard specification for decorative electroplated coatings of copper plus nickel plus chromium on plastics

    塑料表面裝飾用銅加鎳鉻鍍層標準規范
  11. Specification for electroplated coatings on threaded components. nickel or nickel plus chromium on steel components. nickel or nickel plus chromium on copper and copper alloy including brass components

    螺紋部件的電鍍層規范.第3部分:鋼制部件的鎳或鎳鉻鍍層.第4部分:銅及銅合金
  12. Copper coated steel wire. test method for weight of copper coating and composition

    鍍銅鋼絲鍍層重量及其組分試驗方法
  13. The pretreatment, effect of bath compositions and operation conditions such as temperature, currenty and time on compactness of the zinc and cu / ni / cr coatings have been investigated. the relationship of operation conditions to thickness of the coatings was studied by weight method. the specimens have been pickled in nacl or sulfate acid solution to evaluate the porosity of the coating

    研究了鎂合金電鍍前處理工藝，電鍍鋅、電鍍銅/鎳/鉻工藝配方及其施鍍溫度、電流密度和時間對鍍層緻密性的影響;採用稱重法研究施鍍工藝與鍍層厚度的關系，利用nacl溶液和硫酸溶液浸泡試樣來考察鍍層孔隙率，採用劃痕試驗和熱震試驗檢驗鍍層的結合力，採用金相顯微鏡和掃描電子顯微鏡觀察鍍層表面形貌。
  14. The good adhesion of zinc coating can be obtained. 3. pyrophosphate copper electroplating is conducted by ammonium citrate as a auxiliary complexing agent at around 40, the narrow range of current density can

    3 .焦磷酸鹽鍍銅時採用檸檬酸銨作為輔助配合劑，溫度控制在40左右，電流密度范圍較窄，控制在1 . 0a . dm ~ （ - 2 ）左右，電鍍時間較長，無法達到無孔狀態，所以必須採用酸性鍍銅加厚銅鍍層。
  15. Results showed cobalt - tungsten deposit as copper barrier at temperature of 500 and below was superior to nickel, cobalt deposit

    當溫度低於500時，鈷鎢合金鍍層的防銅滲性能優於後二者。
  16. Meanwhile, properties of cobalt - tungsten, nickel, cobalt deposit as copper barrier at temperature between 400 and 800 were compared

    同時比較了在400 800下，鈷鎢合金鍍層與鎳層、鈷層的防銅滲能力。
  17. Corrosion protection of metals - electrodeposited coatings of nickel, nickel plus chromium, copper plus nickel and copper plus nickel plus chromium

    金屬防腐蝕.鎳鎳鉻銅鎳銅鎳鉻電解沉積鍍層
  18. On the basis of electroplating and immersion plating tin, and through large numbers of experiments, a new process of electroless plating tin in acid chloride bath solutions including sncl2 2h2o, nah2po2 h2o, special complexing agent, additive agent, stabilizing agent and antioxidant, was established. continuous self - catalyzed deposition of tin on copper substrate was achieved successfully, and half - bright and silvery - white tin deposits with excellent properties were obtained

    本文是在電鍍錫、浸鍍錫工藝配方的基礎上，通過大量的試驗，確立了一種以氯化亞錫、次亞磷酸鈉和特定的絡合劑、添加劑、穩定劑，抗氧化劑為基本鍍液組成的酸性氯化物化學鍍錫體系，成功地在銅上實現了錫的連續自催化沉積，獲得了性能優異的半光亮銀白色錫鍍層。
  19. The plastics matrix might be exposed with under - coarsing. the cracks might appear on the coating with over - coarsing. ( 2 ) the thickness of copper coating should be over 5m for preventing coating wrinkle

    （ 2 ）電鍍銅時銅鍍層必須具有一定的厚度，不應低於5林m ，防止鍍鎳后鍍層起皺，從而影響鍍層與基體的結合力。
  20. It has been pointed out that, with the development of microelectronics, the electroplating of copper has been currently focused on, owing to its engineering significance

    結合銅在微電子工業中的應用，綜述了硫酸鹽鍍銅中銅的電沉積機理、銅鍍層微結構、添加劑對銅電沉積過程的影響以及銅電沉積初期行為方面的研究進展。
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