陶瓷封接 的英文怎麼說
中文拼音 [táocífēngjiē]
陶瓷封接
英文
ceramic seal-
The damage of the transducer was avoided, so the ability of over - loading can be improved highly. in order to acquire a good hermetic seal between the diaphragm and the base plate, two sealing methods were used, namely, compound method and crystallite method
通過試驗對比，確定了介質腔的厚度，使陶瓷膜片在過載時與基座接觸，從而避免了傳感器的過載損壞，使傳感器的抗過載能力大大提高。研究了復合法和結晶法兩種封接方式，使陶瓷基座與膜片達到良好的匹配封接。A novel low mechanical hysteretic ceramic capacitive pressure transducer has been made, by using of ceramic sealing technology ; integrate circuit ( ic ) technology and thick film plane fixing circuit technology. this transducer is made of a deformable ceramic diaphragm and a ceramic base plate, between which has an air cavum. a coaxial gold electrode was fired onto the diaphragm and the base plate
本文利用新型陶瓷技術、集成電路技術和厚膜平面安裝電路技術，採用零力學滯后的陶瓷和陶瓷密封材料進行設計製造了一種非充液乾式的電容式壓力傳感器，該壓力傳感器由較厚的陶瓷基體和較薄的陶瓷膜片構成，中間形成一空氣介質腔，在基座和膜片之間內置同軸的雙電極，組成兩個電容，當膜片承受壓力時發生位移，使電容量產生變化，經後置處理電路直接轉換為可輸出的直流電壓信號。The unstability for steam content in the sealed devices is described, it mainly results from water vapor decomposed by bonding material of conductive adhesive under high temperature
摘要簡述了集成電路陶瓷封裝內部水汽含量的不穩定性，主要是由粘接材料導電膠在高溫下分解釋放出的水汽所造成的。The connecting intension has been put forward. the various factor that include the performance of commonly metal and ceramic, and the connectible structure, and the craft of ceramic metallization influences to ceramic - to - metal - to - seal has been analyze
本論文提出了陶瓷?金屬封接強度這一概念，分析了常用陶瓷和金屬材料的性能、封接結構、金屬化工藝等因素對封接強度的影響。With technology of one - seal - exhaust being applied in vacuum switch - tube, high request about ceramic - to - metal - to - seal is put forward
隨著一次封排技術在開關管生產中的廣泛應用，對陶瓷?金屬封接技術提出了更高的要求。The paper discusses the techniques of chemical plated nickel and electroplated nickel, as well as their difference in the ceramic - metal seal process
摘要討論了陶瓷金屬封接中化學鍍鎳與電鍍鎳工藝及相互之間的區別。According to different requirements during designing dies for ceramics - metal sealing, the experiences and skills of selecting materials, tolerance on fit, and setting auxiliary sizes are summarized, and they are very helpful to make the design of dies more reasonable and to improve the sealing quality
摘要針對陶瓷金屬封接模具設計的不同需要，從材料選擇、配合公差以及輔助尺寸的確定等方面總結出幾點經驗和技巧，力求使模具設計更為合理，以保證封接質量。Thermal and welding residual stress often produces in the proceeding of the electronic package, the residual stress release and thermal deformations of the microelectronics will reduce the assemble intensity between the chip and package, and then debase the electrical performance of the assemble circuit, numerous thermal cycling will lead to thermal fatigue or thermal failure of the microelectronics
電子封裝器件在生產的工藝過程中，往往會產生熱殘余應力以及焊接殘余應力，殘余應力的釋放作用及器件在使用過程中的熱變形，會降低集成電路晶元與封裝體的結合強度，進而降低集成電路的電性能，反復的熱循環，將導致器件的熱疲勞失效，嚴重時可導致矽片或陶瓷片破裂，使整個器件遭到破壞。Ceramic substrate packaging, which has better heat resistance and withstand higher and lower temperature and compact
採用陶瓷封裝，和矽晶晶片膨脹系數較接近散熱性能良好，耐高低溫與沖擊A cathode - ray - tube ( crt ) faceplate made of transparent spinel ( mgal2o4 ) is developed
摘要透明尖晶石陶瓷面板投影管的屏和錐採用了低熔點玻璃封接。The lastic, metal, or ceramic container that enclose a ic. ackage rotect the chi and ring the lead from the outside world to the chip
封住ic所用的塑料、金屬或陶瓷包裝。封裝可以保護晶元，並使晶元與外部世界連接。Specification for ceramic. metal seals used in microwave tubes
微波管用陶瓷.金屬封接件規范In order to improve the reliability and service life of the vacuum electronic parts of an apparatus, to meet demands of production technical development, i have researched the technology of ceramic - to - metal - seal
為了提高真空電子器件的可靠性及使用壽命，滿足生產技術發展的需要，本課題對陶瓷?金屬封接技術進行了研究。Ceramic - to - metal - to - seal is one key production craftwork of vacuum electronic parts of an apparatus, its quality playing a decisive role to airtight of products, concerning the properties of products and service life directly
陶瓷?金屬封接是真空電子器件生產的關鍵工藝之一，封接質量對真空電器產品的氣密性起決定性的作用，直接關繫到產品性能及其使用壽命。分享友人